Method of ion implantation for achieving desired dopant concentration
A method for forming a plurality of MOSFETs wherein each one of the MOSFET has a unique predetermined threshold voltage. A doped well or tub is formed for each MOSFET. A patterned mask is then used to form a material line proximate each semiconductor well, wherein the width of the line is dependent upon the desired threshold voltage for the MOSFET. A tilted ion implantation is performed at an acute angle with respect to the substrate surface such that the ion beam passes through the material line. Thicker lines have a lower transmission coefficient for the ion beam and thus the intensity of the ion beam reaching the adjacent semiconductor well is reduced. By appropriate selection of the line width the dopant density in the well, and thus the final MOSFET threshold voltage, is controllable.
1. A method for fabricating a semiconductor device region comprising:
forming a doped semiconductor region on a semiconductor layer;
forming a first material line proximate the doped semiconductor region on a top surface of the semiconductor layer;
performing a first tilted ion implantation through the first material line, wherein an ion beam intersects the first material line at an angle with respect to the top surface of the semiconductor layer such that an ion beam passes through the first material line prior to striking the doped semiconductor region, and wherein an implanted ion dosage reaching the doped semiconductor region to increase a dopant concentration thereof is dependent on an ion transmission properties of the first material line.
2. The method of claim 1 wherein the step of forming the first material line comprises forming a first layer over the semiconductor layer, patterning the first layer to identify the location of the first material line, and removing the material of the first layer except for the first material line.
3. The method of claim 1 wherein the material of the first material line is selected from a group consisting of silicon nitride, silicon dioxide, photo resist and polycrystalline silicon.
4. The method of claim 1 wherein a tilted angle is in the range of about 1 to 89 degrees.
5. The method of claim 1 wherein the width of the first material line is selected to control the ion implantation dosage reaching the doped semiconductor region.
6. The method of claim 1 wherein a height of the first material line is selected to control the ion implantation dosage reaching the doped semiconductor region.
7. The method of claim 1 further comprising:
forming a second material line proximate the doped semiconductor region on an opposing side of the doped semiconductor region from the first material line;
performing a second tilted ion implantation through the second material line, wherein the ion beam intersects the second material line at an angle with respect to the top surface of the semiconductor layer such that the ion beam passes through the second material line prior to striking the doped semiconductor region.
8. The method of claim 7 wherein after the first and the second tilted ion implantations a lateral dopant concentration in the doped semiconductor region is substantially uniform.
9. The method of claim 1 wherein the dopant concentration is laterally non-uniform.
10. A method of doping a semiconductor device region comprising:
forming a plurality of doped semiconductor regions on a semiconductor layer by at least one dopant introduction step, wherein at least one doped semiconductor region is associated with one of a plurality of semiconductor devices;
forming a material line proximate at least one of the plurality of semiconductor regions; and
performing an ion implantation wherein an ion beam intersects the material line at an angle with respect to a top surface of the semiconductor layer such that the ion beam passes through the material line prior to striking the proximate semiconductor region, and wherein the implanted ions further increase the doping concentration of the doped semiconductor region, as determined by the ion transmissive properties of the material line.
11. The method of claim 10 wherein the doped semiconductor region is a semiconductor well.
12. The method of claim 10 wherein the material of the material line is selected from a group consisting of silicon nitride, silicon dioxide, photo resist and polycrystalline silicon.
13. The method of claim 10 further comprising:
forming an opposing material line proximate and on the opposing side of the doped semiconductor region from the material line; and
performing a second tilted ion implantation through the opposing material line, wherein the ion beam intersects the opposing material line at an angle with respect to the top surface of the semiconductor layer such that the ion beam passes through the opposing material line prior to striking the doped semiconductor region.
14. The method of claim 10 wherein a plurality of material lines are formed, and wherein a doping concentration in the doped semiconductor region is responsive to a width and a height of each material line.
15. A method for fabricating a plurality of field effect transistors, comprising:
forming a plurality of doped semiconductor wells on a semiconductor substrate, wherein each doped semiconductor well is associated with a field-effect transistor;
forming a plurality of material lines each proximate a doped semiconductor well, wherein each one of the plurality of material lines has a predetermined width;
performing a tilted ion implantation through each one of the material lines such that an ion beam intersects each one of the plurality of the material lines at an acute angle with respect to the top surface of the semiconductor layer and strikes the proximate doped semiconductor well, and wherein the implanted ions further increase the doping concentration of the doped semiconductor well;
in each of the plurality of semiconductor wells, forming an oxide layer on a region of the semiconductor layer, wherein the region below the oxide layer defines a channel region;
forming a gate region over the oxide layer in each one of the plurality of semiconductor wells; and
forming a source region and a drain region in each one of the plurality of doped semiconductor wells with the channel region therebetween;
wherein the combination of a source region, a drain region and a gate associated with each one of the plurality of doped semiconductor wells forms a field-effect transistor, and wherein a dopant density of the channel region is dependent on the transmission of ions through the material line, and wherein a threshold voltage of each field-effect transistor of the plurality of field-effect transistors is dependent on the dopant density.
16. The method of claim 15 wherein after the step of forming the doped semiconductor wells, the doped semiconductor wells have a minimal dopant density.
17. The method of claim 15 wherein the transmission of ions through each one of the material lines is a function of a material line width.
18. The method of claim 15 wherein the material line comprises silicon nitride, silicon dioxide, photo resist or polycrystalline silicon.
19. The method of claim 15 further comprising:
forming an opposing material line proximate and on the opposing side of the doped semiconductor well from the material line; and
performing a second tilted ion implantation through the opposing material line, wherein the ion beam intersects the opposing material line at an angle with respect to a top surface of the semiconductor layer such that the ion beam passes through the opposing material line prior to striking the doped semiconductor well.
20. The method of claim 15 wherein a threshold voltage for the associated field-effect transistor is responsive to a width and a height of each one of the plurality of material lines.