Stacked semiconductor packages
View Patent ↗A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is mounted on the interposer.
1. A stacked semiconductor package, comprising:
a substrate;
a first semiconductor device mounted on the substrate;
an interposer electrically connected to the substrate and supported above the first semiconductor device opposite the substrate;
a partial mold encapsulant encapsulating at least the first semiconductor device and at least a portion of the interposer to form an open cavity over the interposer for mounting of a second semiconductor device on the interposer; and
a metallic stiffener supporting the interposer, the metallic stiffener having a plurality of legs contacting the substrate and being supported thereon.
2. The stacked semiconductor package of claim 1 further comprising a second semiconductor device mounted on the interposer in the open cavity over the interposer.
3. The stacked semiconductor package of claim 1 further comprising means forming at least one opening through the metallic stiffener for attaching at least one semiconductor device therethrough.
4. The stacked semiconductor package of claim 1 further comprising at least one base supporting member connecting at least one pair of the legs to enhance the stiffness of the metallic stiffener.
5. A stacked semiconductor package, comprising:
a substrate;
a first semiconductor device mounted on the substrate;
a metallic stiffener above the first semiconductor device opposite the substrate, wherein the metallic stiffener has:
a plane supporting the interposer; and
a plurality of legs extending from the plane, contacting the substrate, and being supported thereon;
an interposer electrically connected to the substrate and supported on the metallic stiffener;
a partial mold encapsulant encapsulating at least the first semiconductor device and at least a portion of the interposer to form an open cavity over the interposer:
a second semiconductor device mounted on the interposer within the cavity: and
a top encapsulant encapsulating the cavity.
6. The stacked semiconductor package of claim 5 further comprising means forming at least one opening though the plane of the metallic stiffener for attaching at least one semiconductor device therethrough.
7. The stacked semiconductor package of claim 5 further comprising at least one base supporting member connecting at least one pair of the legs opposite the plane to enhance the stiffness of the metallic stiffener.
8. The stacked semiconductor package of claim 5 wherein the first and second semiconductor devices further comprise at least one of a die, a flip chip die, a surface mountable passive, a multi-chip package, a fully assembled semiconductor package, a leadframe-based fully assembled semiconductor package, an array-based fully assembled semiconductor package, a system-in-a-package, and a combination thereof.