Semiconductor device and method of making semiconductor device

1. A method of fabricating a semiconductor device, said method comprising:

forming a micro-chip comprising a thinned-wafer having one or more components fabricated thereon disposed between a carrier and a semiconductor chip;

connecting said semiconductor chip to said carrier, said micro-chip being electrically connected to said semiconductor chip under a higher consumption macro of the semiconductor chip and including a thickness which is less than a thickness of said semiconductor chip;

forming an interconnect between said semiconductor chip and said carrier for electrically connecting and bonding said semiconductor chip to said carrier;

forming an interconnect between said micro-chip and said semiconductor chip for electrically connecting and bonding said micro-chip and said semiconductor chip; and

forming an interconnect between said micro-chip and said carrier for electrically connecting and bonding said micro-chip and said carrier,

wherein said micro-chip comprises a thinned micro-chip having a thickness of less than 20 microns.

2. The method of claim 1 , wherein said micro-chip comprises one of a memory device, a decoupling capacitor, a sensor, and an actuator.

3. The method of claim 1 , wherein said connecting said semiconductor chip comprises connecting said semiconductor chip to a first side of said carrier, said method further comprising:

forming a plurality of interconnects on a second side of said carrier which is opposite said first side.

4. The method of claim 1 , wherein said micro-chip comprises a vertical through section (VTS).

5. The method of claim 4 , wherein said micro-chip includes a first side and a second side which opposes said first side, said vertical through section (VTS) extending from said first side to said second side.

6. The method of claim 4 , further comprising:

an electrical conductor disposed in said vertical through section (VTS),

wherein said micro-chip is bonded to said carrier such that said electrical conductor in said vertical through section (VTS) electrically connects said micro-chip to said carrier.

7. The method of claim 1 , wherein said micro-chip comprises a through silicon via.

8. The method of claim 1 , wherein said semiconductor chip comprises plural semiconductor chips formed as a chip stack, and

wherein said micro-chip comprises a plurality of micro-chips formed on said plural semiconductor chips, such that said semiconductor device comprises a three-dimensional integrated circuit.

9. The method of claim 8 , wherein said carrier is bonded to said chip stack, said plural micro-chips forming said three-dimensional integrated circuit with said chip stack and said carrier.

10. The method of claim 8 , further comprising:

forming plural first elements comprising at least one of optical elements and electrical elements on said micro-chip;

forming plural second elements comprising at least one of optical elements and electrical elements on said semiconductor chip; and

integrating said plural first elements together with said plural second elements.

11. The method of claim 10 , wherein said micro-chip is thermally integrated together with said semiconductor chip and said carrier.

12. The method of claim 10 , further comprising:

forming plural interconnections for thermally integrating said micro-chip together with said semiconductor chip and said carrier.

13. The method of claim 10 , further comprising:

forming a thermally conductive adhesive between said micro-chip and at least one of said semiconductor chip and said carrier, for thermally integrating said micro-chip together with said semiconductor chip and said carrier.

14. A method of fabricating a semiconductor device, said method comprising:

forming a micro-chip comprising a thinned-wafer having one or more components fabricated thereon, the micro-chip having a thickness of less than 20 microns on a first side of a package;

connecting a semiconductor chip to said first side of said package, such that said microchip is disposed between said semiconductor chip and said package and formed under a higher consumption macro of the semiconductor chip; and

electrically connecting said micro-chip to said semiconductor chip.

15. A method of fabricating a semiconductor device, said method comprising:

forming a micro-chip chip comprising a thinned-wafer having one or more components fabricated thereon, the micro-chip having a thickness of less than 20 microns on a first side of a semiconductor chip formed under a higher consumption macro of the semiconductor chip;

electrically connecting said micro-chip to said semiconductor chip; and

connecting said first side of said semiconductor chip to a package, such that said microchip is disposed between said semiconductor chip and said package.

16. The method of claim 1 , said forming the micro-chip comprising:

forming a via in the thinned-wafer;

forming an insulating layer in the via; and

filling the via with a metal fill.