Split word line fabrication process
A method for forming a buried split word line structure is provided. The method comprises the following steps. At first, a substrate having a trench therein is provided. Two liners are formed to a first thickness on sidewalls of the trench. Then, the trench is filled with a first insulating layer to a first height. The two liners are removed. Finally, a conductive material is deposited to a second height between and adjacent to the first insulating layer and the trench. Here, the first height is greater than the second height.
1. A method for forming a buried split word line structure, comprising:
providing a substrate having a trench therein;
forming a conductive material conformal to the trench;
depositing a first insulating layer within the trench adjacent the conductive material;
etching the first insulating layer to a first etched depth;
etching the conductive material to a second etched depth in accordance with the first etched depth to thereby form a U-shaped gate conductor;
depositing a second insulating layer above the U-shaped gate conductor and conformal to the trench; and
etching away portions of a third insulating layer, the U-shaped gate conductor and the substrate to form a recess in substrate so that the U-shaped gate conductor is split into two halves;
wherein the third layer is formed above the U-shaped gate conductor and the second etched depth is greater than the first etched depth.
2. The method according to claim 1 , wherein the step of forming the conductive layer comprises:
forming a fourth insulating layer to a first thickness conformal to the trench;
forming a glue layer to a second thickness over the fourth insulating layer; and
forming the conductive material to a third thickness over the glue layer.
3. The method according to claim 2 , wherein the step of forming the conductive material to the third thickness over the glue layer comprises forming the conductive material to the third thickness over the glue layer by atomic layer deposition (ALD).
4. The method according to claim 2 , wherein the first thickness, the second thickness and the third thickness are related to a width of the buried split word line structure.
5. The method according to claim 1 , wherein the second etched depth determines a height of the split word line structure.
6. The method according to claim 1 , wherein the second insulating layer is deposited further above the first insulating layer and the third insulating layer comprises the first insulating layer and the second insulating layer.
7. The method according to claim 1 , wherein the step of etching the conductive material comprises:
etching the glue layer to the second etched depth; and
etching the conductive material to the second etched depth to thereby form the U-shaped gate conductor, wherein the surface of the glue layer is substantially coplanar with the surface of the U-shaped gate conductor.
8. The method according to claim 1 , wherein the second etched depth increases as the first etched depth decreases.
9. The method according to claim 1 , further comprising:
removing the first insulating layer before depositing the second insulating layer;
wherein the third insulating layer comprises the second insulating layer.
10. A method for forming a buried split word line structure, comprising:
providing a substrate having a trench therein;
forming two liners to a first thickness on sidewalls of the trench;
filling the trench with a first insulating layer to a first height;
removing the liners; and
depositing a conductive material to a second height between and adjacent to the first insulating layer and the trench;
wherein the first height is greater than the second height.
11. The method according to claim 10 , wherein the step of forming the two liners comprises:
filling the trench with a second insulating layer to a second thickness;
forming a hard mask conformal to the trench and the second insulating layer to a third thickness; and
etching away portions of the second insulating layer, the hard mask and the substrate to form a recess in the substrate;
wherein a first material that forms the first insulating layer is different from a second material that forms the second insulating layer.
12. The method according to claim 10 , wherein the first thickness is related to a thickness of the conductive material.
13. The method according to claim 11 , wherein the third thickness is related to a thickness of the conductive material.
14. The method according to claim 11 , wherein the step of forming the hard mask comprises forming the hard mask conformal to the trench and the second insulating layer to the third thickness by atomic layer deposition (ALD).
15. The method according to claim 10 , wherein the step of forming the two liners comprises:
forming a second insulating layer conformal to the trench to a second thickness; and
etching away portions of the second insulating layer and the substrate to from a recess in the substrate;
wherein the first insulating layer and the second insulating layer are different.
16. The method according to claim 15 , wherein the first thickness is substantially equal to the second thickness.
17. The method according to claim 15 , wherein the second thickness is related to a thickness of the conductive material.
18. The method according to claim 15 , wherein the step of forming the second insulating layer comprises forming the second insulating layer conformal to the trench to the second thickness by atomic layer deposition (ALD).
19. The method according to claim 10 , wherein each of the two liners comprises at least one layer.