Patent Assignment
Reel/Frame 037223/0279
Change of Name
Recorded: 2015-12-07
Pages: 4
Assignor
REXCHIP ELECTRONICS CO., LTD.
Executed: 2013-08-19
Assignee
MICRON MEMORY TAIWAN CO., LTD.
(421) NO. 429-1, SANFENG ROAD, HOULI DISTRICT, TAICHUNG CITY, TAIWAN
Covered Properties
(17)
User Evaluation Apparatus Depending on Hardware Usage Status
Method and Apparatus for Buried Word Line Formation
Split Word Line Fabrication Process
Robot Arm for Delivering a Wafer and Wafer-Operating Machine
Three-Dimensional Dynamic Random Access Memory with an Ancillary Electrode Structure
Patent:
8,357,964 →
Application:
13/227,315 →
Dust Collector
Manufacturing Method of Charging Capacity Structure
Method of Controlling a Vertical Dual-Gate Dynamic Random Access Memory
Patent:
8,437,184 →
Application:
13/312,074 →
Method of Manufacturing Vertical Transistors
Self-Aligned Wet Etching Process
Vertical Transistor Structure and Method of Manufacturing Same
Semiconductor Device and Method for Making the Same
A Semiconductor Device Comprising Pillar Array and Contact Array
Ion Implantation Method for Semiconductor Sidewalls
Patent:
8,470,657 →
Application:
13/532,293 →
Method for Fabricating Buried Bit Lines
Patent:
8,546,220 →
Application:
13/551,919 →
Vertical Semiconductor Charge Storage Structure
Double-Exposure Mask Structure and Photolithography Method Thereof
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 5, 2010
From: NISHIKAWA, TAKEICHIRO; YONEZAWA, MINORU; MORITA, CHIE; NAKATSUGAWA, MINORU
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 024338/0248 →
Assignment of Assignor's Interest
Aug 12, 2010
From: LIN, YUNG-CHANG; LIANG, SHENG-CHANG
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 024831/0360 →
Assignment of Assignor's Interest
Aug 27, 2010
From: LIN, CHIH-HAO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 024902/0453 →
Assignment of Assignor's Interest
Nov 18, 2010
From: LEE, YU-SHENG
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 025407/0001 →
Assignment of Assignor's Interest
Sep 7, 2011
From: CHEN, CHIH-YUAN; CHEN, MENG-HSIEN; HSIUNG, CHIH-WEI
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 026868/0845 →
Assignment of Assignor's Interest
Oct 27, 2011
From: LU, CHIN HSIU; WANG, CHIN MING
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027134/0922 →
Assignment of Assignor's Interest
Nov 22, 2011
From: HUNG, PEI-CHUN; CHEN, LI-HSUN; TSAI, CHIEN-HUA; OHUCHI, MASAHIKO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027268/0595 →
Assignment of Assignor's Interest
Dec 6, 2011
From: HSIUNG, CHIH-WEI
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027345/0112 →
Assignment of Assignor's Interest
Dec 7, 2011
From: CHEN, HSIAO-CHIA; LIANG, SHENG-CHANG; TSAI, CHIEN-HUA; OHUCHI, MASAHIKO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027343/0614 →
Assignment of Assignor's Interest
Dec 15, 2011
From: CHANG, WEI-CHE; HUANG, CHUN-HUA; AI, CHUNG-YUNG; LIU, WEI-CHIH
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027389/0288 →
Assignment of Assignor's Interest
Dec 27, 2011
From: NAGAI, YUKIHIRO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027448/0242 →
Assignment of Assignor's Interest
Mar 9, 2012
From: TAKESAKO, KAZUAKI; HSU, WEN-KUEI; TANAKA, YOSHINORI; NAGAI, YUKIHIRO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027833/0606 →
Assignment of Assignor's Interest
Apr 25, 2012
From: NAGAI, YUKIHIRO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028103/0333 →
Assignment of Assignor's Interest
Jun 25, 2012
From: LO, CHIH-HSIN
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028438/0629 →
Assignment of Assignor's Interest
Jul 18, 2012
From: TANAKA, ISAO; TSAI, CHIEN-HUA
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028577/0017 →
Assignment of Assignor's Interest
Sep 17, 2012
From: YU, PIN-YUAN; SHAO, YI-CHUN; CHU, CHIEN-HUA
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028969/0927 →
Assignment of Assignor's Interest
Aug 12, 2013
From: HUNG, YUNG-WEN; LI, CHENG-SHUAI; SHEN, YUN-TING
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 030992/0524 →
Assignment of Assignor's Interest
Dec 7, 2015
From: MICRON MEMORY TAIWAN CO., LTD.,
To: MICRON TECHNOLOGY, INC
Reel/Frame 037222/0690 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →