Ion implantation method for semiconductor sidewalls
An ion implantation method for semiconductor sidewalls includes steps of: forming a trench on a substrate, and the trench having a lower reflecting layer and two sidewalls adjacent to a bottom section; performing a plasma doping procedure to sputter conductive ions to the lower reflecting layer and the conductive ions being rebounded from the lower reflecting layer to adhere to the sidewalls to respectively form an adhesion layer thereon; and performing an annealing procedure to diffuse the conductive ions of the adhesion layer into the substrate to form a conductive segment. Thus, without damaging the substrate, the conductive segment having a high conductive ion doping concentration is formed at a predetermined region to satisfy semiconductor design requirements.
1. An ion implantation method for semiconductor sidewalls, comprising the steps of:
S 1 : forming at least one trench on a substrate, the at least one trench including an opening, a bottom section far away from the opening, a lower reflecting layer formed on the bottom section, and two sidewalls adjacent to the bottom section;
S 2 : performing a plasma doping procedure to sputter conductive ions to the lower reflecting layer, and the conductive ions being rebounded from the lower reflecting layer to adhere to the two sidewalls to respectively form an adhesion layer thereon; and
S 3 : performing an annealing procedure to diffuse the conductive ions of the adhesion layer into the substrate to form a conductive segment.
2. The ion implantation method of claim 1 , wherein the substrate is formed by sequentially depositing a semiconductor layer and an insulating layer.
3. The ion implantation method of claim 2 , wherein the semiconductor layer is made of silicon and the insulating layer is made of silicon nitride.
4. The ion implantation method of claim 1 , wherein the trench is formed at a depth greater than ten times of a width of the trench.
5. The ion implantation method of claim 1 , after the Step S 1 , further comprising the steps of:
S 1 A: forming at least one protection layer on surfaces of the substrate and the at least one trench; and
S 1 B: forming the lower reflecting layer at the bottom section of the at least one trench, and forming two doping sidewalls at positions where the two sidewalls are adjacent to the lower reflecting layer.
6. The ion implantation method of claim 5 , wherein in the Step S 1 A, an oxidation protection layer and a silicon nitride protection layer are sequentially deposited on the surfaces of the substrate and the at least one trench to form the protection layer.
7. The ion implantation method of claim 5 , wherein in the Step S 2 , the conductive ions are deposited in coordination with an inert gas, and the inert gas impacts the conductive ions deposited on the lower reflecting layer to allow the conductive ions to be rebounded to adhere to one of the two doping sidewalls to form the adhesion layer.
8. The ion implantation method of claim 1 , wherein in the Step S 2 , the conductive ions are made of hydrogen arsenide or hydrogen phosphide.
9. The ion implantation method of claim 7 , between the Steps S 2 and S 3 , further comprising the step of:
S 2 A: oxidizing a surface of the adhesion layer to form an oxidation adhesion layer.
10. The ion implantation method of claim 9 , after the Step S 3 , further comprising the step of:
S 4 : removing the oxidation adhesion layer by etching.
11. The ion implantation method of claim 7 , between the Step S 2 and S 3 , further comprising the step of:
S 2 B: depositing an oxidation layer on the surface of the adhesion layer.
12. The ion implantation method of claim 11 , after the Step S 3 , further comprising the step of:
S 4 : removing the oxidation layer by etching.
13. The ion implantation method of claim 11 , wherein the oxidation layer is formed by atomic layer deposition (ALD) or molecular layer deposition (MLD).
14. The ion implantation method of claim 1 , wherein in the Step S 1 , the lower reflecting layer is formed on the bottom section of the at least one trench by a spin-on dielectric (SOD) material.
15. The ion implantation method of claim 1 , further comprising a plurality of trenches and a plurality of posts each being disposed between any two of the plurality of trenches, and the conductive segment is formed on one of the plurality of posts.