Patent Assignment
Reel/Frame 037222/0690
Assignment of Assignor's Interest
Recorded: 2015-12-07
Pages: 4
Assignor
MICRON MEMORY TAIWAN CO., LTD.,
Executed: 2015-11-20
Assignee
MICRON TECHNOLOGY, INC
8000 S. FEDERAL WAY, MS - 1-525, BOISE, IDAHO, 83707
Covered Properties
(17)
User Evaluation Apparatus Depending on Hardware Usage Status
Method and Apparatus for Buried Word Line Formation
Split Word Line Fabrication Process
Robot Arm for Delivering a Wafer and Wafer-Operating Machine
Three-Dimensional Dynamic Random Access Memory with an Ancillary Electrode Structure
Patent:
8,357,964 →
Application:
13/227,315 →
Dust Collector
Manufacturing Method of Charging Capacity Structure
Method of Controlling a Vertical Dual-Gate Dynamic Random Access Memory
Patent:
8,437,184 →
Application:
13/312,074 →
Method of Manufacturing Vertical Transistors
Self-Aligned Wet Etching Process
Vertical Transistor Structure and Method of Manufacturing Same
Semiconductor Device and Method for Making the Same
A Semiconductor Device Comprising Pillar Array and Contact Array
Ion Implantation Method for Semiconductor Sidewalls
Patent:
8,470,657 →
Application:
13/532,293 →
Method for Fabricating Buried Bit Lines
Patent:
8,546,220 →
Application:
13/551,919 →
Vertical Semiconductor Charge Storage Structure
Double-Exposure Mask Structure and Photolithography Method Thereof
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 5, 2010
From: NISHIKAWA, TAKEICHIRO; YONEZAWA, MINORU; MORITA, CHIE; NAKATSUGAWA, MINORU
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 024338/0248 →
Assignment of Assignor's Interest
Aug 12, 2010
From: LIN, YUNG-CHANG; LIANG, SHENG-CHANG
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 024831/0360 →
Assignment of Assignor's Interest
Aug 27, 2010
From: LIN, CHIH-HAO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 024902/0453 →
Assignment of Assignor's Interest
Nov 18, 2010
From: LEE, YU-SHENG
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 025407/0001 →
Assignment of Assignor's Interest
Sep 7, 2011
From: CHEN, CHIH-YUAN; CHEN, MENG-HSIEN; HSIUNG, CHIH-WEI
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 026868/0845 →
Assignment of Assignor's Interest
Oct 27, 2011
From: LU, CHIN HSIU; WANG, CHIN MING
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027134/0922 →
Assignment of Assignor's Interest
Nov 22, 2011
From: HUNG, PEI-CHUN; CHEN, LI-HSUN; TSAI, CHIEN-HUA; OHUCHI, MASAHIKO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027268/0595 →
Assignment of Assignor's Interest
Dec 6, 2011
From: HSIUNG, CHIH-WEI
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027345/0112 →
Assignment of Assignor's Interest
Dec 7, 2011
From: CHEN, HSIAO-CHIA; LIANG, SHENG-CHANG; TSAI, CHIEN-HUA; OHUCHI, MASAHIKO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027343/0614 →
Assignment of Assignor's Interest
Dec 15, 2011
From: CHANG, WEI-CHE; HUANG, CHUN-HUA; AI, CHUNG-YUNG; LIU, WEI-CHIH
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027389/0288 →
Assignment of Assignor's Interest
Dec 27, 2011
From: NAGAI, YUKIHIRO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027448/0242 →
Assignment of Assignor's Interest
Mar 9, 2012
From: TAKESAKO, KAZUAKI; HSU, WEN-KUEI; TANAKA, YOSHINORI; NAGAI, YUKIHIRO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 027833/0606 →
Assignment of Assignor's Interest
Apr 25, 2012
From: NAGAI, YUKIHIRO
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028103/0333 →
Assignment of Assignor's Interest
Jun 25, 2012
From: LO, CHIH-HSIN
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028438/0629 →
Assignment of Assignor's Interest
Jul 18, 2012
From: TANAKA, ISAO; TSAI, CHIEN-HUA
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028577/0017 →
Assignment of Assignor's Interest
Sep 17, 2012
From: YU, PIN-YUAN; SHAO, YI-CHUN; CHU, CHIEN-HUA
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 028969/0927 →
Assignment of Assignor's Interest
Aug 12, 2013
From: HUNG, YUNG-WEN; LI, CHENG-SHUAI; SHEN, YUN-TING
To: REXCHIP ELECTRONICS CORPORATION
Reel/Frame 030992/0524 →
Change of Name
Dec 7, 2015
From: REXCHIP ELECTRONICS CO., LTD.
To: MICRON MEMORY TAIWAN CO., LTD.
Reel/Frame 037223/0279 →
Security Interest
May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
Patent Security Agreement
Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
Corrective Assignment to Correct the Replace Erroneously Filed Patent #7358718 with the Correct Patent #7358178 Previously Recorded on Reel 038669 Frame 0001. Assignor(S) Hereby Confirms the Security Interest.
Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
Security Interest
Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
Release of Security Interest
Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
Release of Security Interest
Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
Release of Security Interest
Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →