Non-conformal hardmask deposition for through silicon etch

1. A method to form deep features in a substrate, the method comprising:

forming a patterned layer having at least one opening on a top surface of said substrate whereby said opening exposes at least one region on said substrate,

first etching to form a cavity in said at least one exposed region, said cavity with a width and a bottom surface at depth D 1 below said top surface, and

depositing a non-conformal first hardmask after said first etching, said first hardmask extending fully over said top surface, said first hardmask as deposited defining an open area over said bottom surface

second etching according to said first hardmask to extend said cavity, and

depositing a second hardmask layer after said second etching step, whereby said second hardmask layer has substantially no thickness over the bottom of said cavity.

2. The method of claim 1 wherein said substrate comprises insulating material overlying a plurality of devices formed in a semiconductor layer.

3. The method of claim 1 wherein said second hardmask is deposited by angled evaporation, CVD, or angled PVD.

4. The method of claim 2 wherein said insulating material constitutes at least two stacked dielectric layers that each having metal wiring embedded.

5. The method of claim 3 further comprising:

rotating said substrate about an axis normal to said top surface during said second hardmask deposition.

6. The method of claim 3 wherein said angled evaporation or angled PVD provides deposition source material at an angle relative to said top surface between 10 and 50 degrees.

7. The method of claim 1 wherein said substrate comprises a semiconductor layer and said first etching forms a cavity that extends into said semiconductor layer.

8. The method of claim 1 wherein said second hardmask is not fully consumed by said second etching, the method further comprising stripping said second hard mask.

9. The method of claim 1 wherein said second hardmask is comprised of SiOx, SiN, SiON, SiCN, W, TiN, Al, Ta, Si, Co, Ni, or TaN, or any combination thereof.

10. A method to form deep features in a substrate, said method comprising:

providing a substrate comprising a plurality of interconnect layers disposed on a semiconductor layer, at least two of said interconnect layers comprising conductive interconnects embedded within a layer of dielectric material,

etching to form a cavity according to a photoresist mask disposed on a top surface of said substrate, said etching consuming less than the entire photoresist mask, and

depositing a non-conformal first hardmask after stripping said photoresist layer, said first hardmask extending fully over said top surface, said first hardmask as deposited defining an open area over said cavity.

11. A method to protect an upper surface topography while forming a deep cavity in a semiconductor substrate, the method comprising:

providing a layered structure comprising a semiconductor layer and a plurality of interconnect layers disposed on said semiconductor layer, at least two of said interconnect layers comprising metal wiring embedded within a layer of dielectric material;

forming a cavity through a top surface of said plurality according to a patterned mask, said cavity having sidewalls and a bottom surface;

while rotating said layered structure at least one full rotation about an axis normal to said semiconductor layer, depositing a hard mask at an angle offset from said axis such that said bottom surface is not covered by said hard mask; and

extending said cavity into said semiconductor substrate by etching through said bottom surface.

12. The method of claim 11 wherein said depositing is achieved by evaporation or PVD.

13. The method of claim 11 wherein the depth of said cavity in combination with the angle of said deposition is such that a lower portion of said sidewalls and said bottom surface are not impinged by said deposition.

14. The method of claim 11 wherein said bottom surface is within said semiconductor layer prior to both said depositing and said extending steps.

15. The method of claim 11 wherein said hard mask is comprised of a nitride composition selected from SiN, SiON, SiCN, TiN, TaN, or any combination thereof.

16. The method of claim 11 further comprising depositing a second hardmask layer after said extending step, whereby said second hardmask layer has substantially no thickness over the bottom of said cavity.