Self-aligned polymer passivation/aluminum pad

1. A method of forming a pad structure on a semiconductor chip structure, the method comprising:

forming a polyimide buffering layer directly over one of:

a substrate, or

an oxide layer formed over the substrate;

forming an aluminum pad structure on the buffering layer; and

using the aluminum pad structure as a mask, etching the substrate to remove the polyimide buffering layer from the substrate except under the aluminum pad structure such that the polyimide buffering layer is self-aligned to the aluminum pad structure.

2. The method of claim 1 , wherein the polyimide buffering layer comprises at least one of the following polymers: photosensitive polyimide (PSPI), benzocyclobutene (BCB), and polybenzoxazole (PBO).

3. The method of claim 1 , wherein the aluminum pad structure includes at least one wire and at least one wire pad.

4. The method of claim 3 , wherein the polyimide buffering layer is self-aligned to the at least one wire and the at least one wire pad.

5. The method of claim 1 , wherein the forming of the polyimide buffering layer includes depositing the polyimide buffering layer on the substrate.

6. The method of claim 1 , wherein the aluminum pad structure is configured to bond with a C4 solder bump positioned thereon.

7. The method of claim 1 , wherein the substrate comprises an oxide.

8. The method of claim 1 , wherein the forming of the aluminum pad structure includes depositing a layer of aluminum over the polyimide buffering layer, and using a mask to etch the layer of aluminum to form the aluminum pad structure.

9. The method of claim 1 , wherein the polyimide buffering layer under the aluminum pad structure has a thickness of approximately 1 micron to approximately 14 microns.

10. The method of claim 1 , further comprising:

depositing a second polyimide layer after the etching of the substrate to remove the polyimide buffering layer, wherein the second polyimide layer is deposited over the substrate and the aluminum pad structure.

11. The method of claim 10 , further comprising:

removing a portion of the second polyimide layer to expose at least a portion of the aluminum pad structure; and

forming a C4 solder bump contacting the aluminum pad structure.

12. The method of claim 1 , further comprising: performing a wet clean process on the semiconductor chip structure after the etching of the substrate to remove the polyimide buffering layer.

13. The method of claim 1 , further comprising: curing the polyimide buffering layer after the depositing of the polyimide buffering layer on the substrate.

14. A semiconductor substrate comprising:

at least one aluminum pad structure; and

a polyimide buffering layer under the aluminum pad structure, wherein the polyimide buffering layer is self-aligned to the aluminum pad structure, and

wherein the polyimide buffering layer is formed directly over one of:

a substrate, or

an oxide layer formed over the substrate.

15. The semiconductor substrate of claim 14 , wherein the polyimide buffering layer comprises at least one of the following polymers: photosensitive polyimide (PSPI), benzocyclobutene (BCB), and polybenzoxazole (PBO).

16. The semiconductor substrate of claim 14 , wherein the pad structure includes at least one wire and at least one wire pad.

17. The semiconductor substrate of claim 16 , wherein the polyimide buffering layer is self-aligned to the at least one wire and the at least one wire pad.

18. The semiconductor substrate of claim 14 , wherein the substrate comprises an oxide.

19. The semiconductor substrate of claim 14 , wherein the polyimide buffering layer under the aluminum pad structure has a thickness of approximately 1 micron to approximately 14 microns.

20. The semiconductor substrate of claim 14 , further comprising:

a second polyimide layer over the substrate and the aluminum pad structure.