Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing an integrated circuit;
mounting a routing structure having a functional side above the integrated circuit;
mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure;
forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure;
mounting a first-external-package-component to the routing structure; and
forming a first-external-package-encapsulation covering the first-external-package-component and in direct contact with the routing structure.
2. The method as claimed in claim 1 further comprising:
mounting a substrate below the integrated circuit; and
connecting the integrated circuit to the substrate with internal interconnects.
3. The method as claimed in claim 1 further comprising:
mounting a substrate below the integrated circuit; and
connecting the routing structure to the substrate with z-interconnects.
4. The method as claimed in claim 1 further comprising:
connecting an external-package to the vertical interconnect.
5. The method as claimed in claim 1 wherein:
mounting the vertical interconnect includes mounting vertical interconnects in two rows.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing an integrated circuit;
mounting a routing structure having a functional side above the integrated circuit;
mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure;
forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure;
forming mold risers in the encapsulation with the mold risers rise vertically away from the routing structure;
connecting an external-package to the surface exposed from the encapsulation between the mold risers;
mounting a first-external-package-component to the routing structure; and
forming a first-external-package-encapsulation covering the first-external-package-component and in direct contact with the routing structure.
7. The method as claimed in claim 6 wherein:
mounting the integrated circuit includes mounting a wire-bonded die, a flip-chip, or a combination thereof; and
connecting the external-package to the surface exposed from the encapsulation includes connecting a flip-chip, an integrated circuit component package, or a combination thereof.
8. The method as claimed in claim 6 wherein:
forming the mold risers includes forming mold risers sufficiently high to provide structural support for the vertical interconnect and to provide a standoff height above the external package.
9. The method as claimed in claim 6 wherein:
forming the encapsulation covering the vertical interconnect includes forming the encapsulation around a vertical interconnect, forming a hole in the encapsulation and filling the hole with the vertical interconnect, or a combination thereof.
10. The method as claimed in claim 6 wherein:
mounting the vertical interconnect includes mounting the vertical interconnects along two edges of the routing structure.
11. An integrated circuit packaging system comprising:
an integrated circuit;
a routing structure having a functional side mounted above the integrated circuit;
a vertical interconnect mounted to the functional side of the routing structure and the vertical interconnect extends vertically away from the routing structure;
an encapsulation over the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and a surface of the routing structure remains exposed from the encapsulation, and a portion of the vertical interconnect remains exposed from the encapsulation above the surface of the routing structure;
a first-external-package-component mounted to the routing structure; and
a first-external-package-encapsulation covering the first-external-package-component and in direct contact with the routing structure.
12. The system as claimed in claim 11 further comprising:
a substrate below the integrated circuit; and
the integrated circuit is connected to the substrate with internal interconnects.
13. The system as claimed in claim 11 further comprising:
a substrate below the integrated circuit; and
the routing structure is connected to the substrate with z-interconnects.
14. The system as claimed in claim 11 further comprising:
an external-package connected to the vertical interconnect.
15. The system as claimed in claim 11 wherein:
the vertical interconnects are mounted in two rows.
16. The system as claimed in claim 11 further comprising:
mold risers formed in the encapsulation and rise vertically away from the routing structure; and
an external-package connected to the surface exposed from the encapsulation between the mold risers.
17. The system as claimed in claim 16 wherein:
the integrated circuit is a wire-bonded die, a flip-chip, or a combination thereof; and
the external-package is a flip-chip, an integrated circuit component package, or a combination thereof.
18. The system as claimed in claim 16 wherein:
the mold risers are sufficiently high to provide structural support for the vertical interconnect and to provide a standoff height above the external package.
19. The system as claimed in claim 16 wherein:
the vertical interconnect is an embedded-conductive-fillings formed in a hole of the encapsulation, an embedded solder ball or a combination thereof.
20. The system as claimed in claim 16 wherein:
the vertical interconnects are along two edges of the routing structure.