Integrated circuit package system with molded strip protrusion
View Patent ↗An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded strip protrusion formed therefrom over the in-line strip.
1. A method for manufacturing an integrated circuit package system comprising:
providing an in-line strip;
attaching an integrated circuit die over the in-line strip; and
applying a molding material to form a molded strip over the in-line strip, wherein the molded strip includes a molded segment over the integrated circuit die, a molded strip bridge between the molded segment, and a molded strip protrusion surrounding the molded segment along an edge of the in-line strip.
2. The method as claimed in claim 1 wherein applying the molding material includes forming a guide rail on only two sides of the molded segment or surrounding the molded segment.
3. The method as claimed in claim 1 wherein applying the molding material includes forming a segmented protrusion.
4. The method as claimed in claim 1 further comprising marking a code on the molded strip protrusion.
5. The method as claimed in claim 1 wherein applying the molding material includes forming the molded strip protrusion to cooperate with a slot magazine or a stack magazine.
6. A method for manufacturing an integrated circuit package system comprising:
providing an in-line strip having an individualized unit;
mounting an integrated circuit die over the individualized unit; and
forming a molded strip over the in-line strip, further comprising:
forming a molded segment over the integrated circuit die;
forming a molded strip bridge between the molded segment; and
forming a molded strip protrusion surrounding the molded segment along an edge of the in-line strip, wherein the molded strip protrusion has a thickness thinner than or equal to the molded segment, and the width of the molded strip is less than or equal to the in-line strip.
7. The method as claimed in claim 6 wherein forming the molded strip includes forming a guide rail for process handling.
8. The method as claimed in claim 6 wherein forming the molded strip includes forming a segmented protrusion with registration features of the in-line strip substantially exposed.
9. The method as claimed in claim 6 further comprising marking a code on the molded strip protrusion for a strip test.
10. The method as claimed in claim 6 wherein forming the molded strip includes forming the molded strip protrusion to cooperate with a slot spacer of a slot magazine or a stack magazine.
11. An integrated circuit package system comprising:
an in-line strip;
an integrated circuit die over the in-line strip; and
a molded strip over the in-line strip consisting of a molded segment over the integrated circuit die, a molded strip bridge between the molded segment, and a molded strip protrusion surrounding the molded segment along an edge of the in-line strip.
12. The system as claimed in claim 11 wherein the molded strip includes a guide rail on only two sides of the molded segment or surrounding the molded segment.
13. The system as claimed in claim 11 wherein the molded strip includes a segmented protrusion.
14. The system as claimed in claim 11 wherein the molded strip protrusion includes a code.
15. The system as claimed in claim 11 wherein the molded strip includes the molded strip protrusion formed to cooperate with a slot magazine or a stack magazine.
16. The system as claimed in claim 11 wherein:
the in-line strip is the in-line strip having an individualized unit;
the integrated circuit die is the integrated circuit die over the individualized unit; and
the molded segment has a thickness greater than or equal to the molded strip protrusion.
17. The system as claimed in claim 16 wherein the molded strip includes a guide rail for process handling.
18. The system as claimed in claim 16 wherein the molded strip includes a segmented protrusion with registration features of the in-line strip substantially exposed.
19. The system as claimed in claim 16 wherein the molded strip protrusion includes a code for strip a test.
20. The system as claimed in claim 16 wherein the molded strip includes the molded strip protrusion formed to cooperate with a slot spacer of a slot magazine or a stack magazine.