IP Library Granted Patent US 8,946,574
Granted Patent B2
US 8,946,574 · App. 13/312,405 · Granted Feb 3, 2015

Two-layer sensor stack

Inventors: David Brent Guard (Hampshire, GB); Esat Yilmaz (Santa Cruz, CA); Tsung-Ching Wu (Saratoga, CA)
Assignee: Atmel Corporation
G06F3/044G06F2203/04103G06F2203/04112
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,946,574
App. No.
13/312,405
Granted
Feb 3, 2015
Kind
B2
Abstract

In one embodiment, an method apparatus includes an optically clear adhesive (OCA) layer between a cover sheet and a substrate. The substrate has drive or sense electrodes of a touch sensor disposed on a first surface and a second surface of the substrate. The first surface is opposite the second surface and the drive or sense electrodes are made of a conductive mesh of conductive material including metal.

Claims (26)

1. An apparatus comprising:

a first optically clear adhesive (OCA) layer between a first cover sheet and a substrate;

the substrate, with drive or sense electrodes of a touch sensor disposed on a first surface and a second surface of the substrate, the first surface being opposite the second surface, the drive or sense electrodes being made of a conductive mesh conductive material comprising metal; and

a display separated from the second surface of the substrate by a second OCA and a second cover sheet such that at least a portion of the second cover sheet is positioned between the second surface of the substrate and the display.

2. The apparatus of claim 1 , wherein the conductive material is copper, silver, gold, aluminum, or tin.

3. The apparatus of claim 1 , wherein the conductive mesh comprises a plurality of mesh segments, each of the mesh segments having a width of approximately 10 μm.

4. The apparatus of claim 3 , wherein approximately 5% of an active area of the touch sensor is covered by the one or more mesh segments.

5. The apparatus of claim 3 , wherein each of the mesh segments is substantially sinusoidal.

6. The apparatus of claim 1 , wherein the conductive meshes have an optical transmissivity of approximately 90%.

7. The apparatus of claim 1 , wherein the sense electrodes being disposed on the first surface of the substrate and the drive electrodes being disposed on the second surface of the substrate.

8. A device comprising:

a first cover sheet;

a first optically clear adhesive layer (OCA) between the first cover sheet and a substrate;

the substrate, with drive or sense electrodes of a touch sensor disposed on a first surface and a second surface of the substrate, the first surface being opposite the second surface, the drive or sense electrodes being made of a conductive mesh conductive material comprising metal;

a display separated from the second surface of the substrate by a second OCA and a second cover sheet such that at least a portion of the second cover sheet is positioned between the second surface of the substrate and the display; and

one or more computer-readable non-transitory storage media embodying logic that is configured when executed to control the touch sensor.

9. The device of claim 8 , wherein the conductive material is copper, silver, gold, aluminum, or tin.

10. The device of claim 8 , wherein the conductive mesh comprises a plurality of mesh segments, each of the mesh segments having a width of approximately 10 μm.

11. The device of claim 10 , wherein approximately 5% of an active area of the touch sensor is covered by the mesh segments.

12. The device of claim 10 , wherein each of the mesh segments is substantially sinusoidal.

13. The device of claim 8 , wherein the conductive meshes have an optical transmissivity of approximately 90%.

14. The device of claim 8 , wherein the sense electrodes being disposed on the first surface of the substrate and the drive electrodes being disposed on the second surface of the substrate.

15. An apparatus comprising:

a first optically clear adhesive (OCA) layer between a first cover sheet and a substrate;

the substrate, with sense electrodes of a touch sensor disposed on a first surface and drive electrodes of the touch sensor disposed on a second surface of the substrate, the first surface being opposite the second surface, the drive and sense electrodes being made of a conductive mesh of conductive material comprising metal; and

a display separated from the second surface of the substrate by a second OCA and a second cover sheet such that at least a portion of the second cover sheet is positioned between the second surface of the substrate and the display.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2019
From: MICROCHIP TECHNOLOGY INC.; ATMEL CORPORATION; MICROCHIP TECHNOLOGY GERMANY GMBH
To: NEODRÓN LIMITED
Reel/Frame 048259/0840 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0884 →
RELEASE OF SECURITY INTEREST IN CERTAIN PATENT RIGHTS Recorded Dec 21, 2018
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 047976/0937 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2013
From: GUARD, DAVID BRENT; YILMAZ, ESAT
To: QRG LIMITED
Reel/Frame 030278/0189 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2013
From: QRG LIMITED
To: ATMEL CORPORATION
Reel/Frame 030278/0311 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2013
From: WU, TSUNG-CHING
To: ATMEL CORPORATION
Reel/Frame 030278/0082 →
Continuity (2)
Continuation 13089061 · Apr 18, 2011
Related Publication 20120261242A1 · Oct 18, 2012