Elongated via structures
An integrated circuit structure includes a plurality of insulator layers (connected to each other) that form a laminated structure. Further included are via openings within each of the insulator layers, and conductive via material within the via openings. The conductive via material within corresponding via openings of adjacent insulator layers are electrically connected to form continuous electrical via paths through the insulator layers between the top surface and the bottom surface of the laminated structure. Within each of the continuous electrical via paths, the via openings are positioned relative to each other to form a diagonal structural path of the conductive via material through the laminated structure. The corresponding via openings of the adjacent insulator layers partially overlap each other. The diagonal structural paths are non-perpendicular to the top surface and the bottom surface.
1. A method of forming an integrated circuit structure comprising:
forming via openings in an insulator layer;
forming conductive via material within said via openings; and
forming a laminated structure of insulator layers on said insulator layer, said forming of said laminated structure of insulator layers comprising:
successively forming said insulator layers on one another;
repeating said forming of said via openings in each said insulator layers;
positioning corresponding ones of via openings of adjacent ones of said insulator layers to partially overlap each other; and
repeating said forming of said conductive via material in said via openings,
said laminated structure of insulated layers being formed to have a top surface and a bottom surface opposite said top surface,
said insulator layers being formed between said top surface and said bottom surface of said laminated structure of insulator layers,
said repeating of said forming of said conductive via material in said via openings electrically connecting said conductive via material within said corresponding ones of said via openings to form continuous electrical via paths through said insulator layers between said top surface and said bottom surface of said laminated structure of insulator layers,
said positioning of said corresponding ones of via openings within each of said continuous electrical via paths causing said forming of said conductive via material to form a diagonal structural path of said conductive via material through said laminated structure of insulator layers, and
said diagonal structural path being formed non-perpendicular to said top surface and said bottom surface.
2. The method of forming an integrated circuit structure according to claim 1 , further comprising forming multiple ones of said diagonal structural path to form diagonal structural paths,
adjacent ones of said diagonal structural paths forming a triangular load-bearing structure with one of said top surface and said bottom surface.
3. The method of forming an integrated circuit structure according to claim 2 , said triangular load-bearing structure preventing said laminated structure of insulator layers from warping and delaminating.
4. The method of forming an integrated circuit structure according to claim 1 , within each of said via openings, a second opening portion is formed to be overlapped with, and offset from a first opening portion.
5. The method of forming an integrated circuit structure according to claim 1 , said insulator layers being formed parallel to said top surface and said bottom surface.
6. The method of forming an integrated circuit structure according to claim 1 , further comprising connecting a flip chip to one of said bottom surface and said top surface.
7. A method of forming an integrated circuit structure comprising:
forming a plurality of via openings by forming, for each of said plurality of via openings, a first opening portion in an insulator layer, said first opening portion extending fully through said insulator layer, each of said plurality of via openings being formed to have three unequal perpendicular dimensions comprising a depth dimension equal to a thickness of said insulator layer, a width dimension greater than said depth dimension, and a length dimension greater than said width dimension;
forming, for each of said plurality of via openings, a second opening portion to extend partially through said insulator layer, said length dimension of said second opening portion being formed greater than said length dimension of said first opening portion, and said width dimension of said second opening portion being formed greater than said width dimension of said first opening portion;
forming conductive via material within said plurality of via openings; and
forming a laminated structure of insulator layers on said insulator layer, said forming of said laminated structure of insulator layers comprising:
successively forming said insulator layers on one another;
repeating said forming of said first opening portion and said forming of said second opening portion to successively form via openings in each said insulator layers;
positioning corresponding ones of via openings of adjacent ones of said insulator layers to partially overlap each other; and
repeating said forming of said conductive via material in said plurality of via openings,
said laminated structure of insulator layers being formed to have a top surface and a bottom surface opposite said top surface,
said insulator layers being formed between said top surface and said bottom surface of said laminated structure of insulator layers,
said repeating of said forming of said conductive via material in said plurality of via openings electrically connecting said conductive via material within said corresponding ones of said plurality of via openings to form continuous electrical via paths through said insulator layers between said top surface and said bottom surface of said laminated structure of insulator layers,
said positioning of said corresponding ones of via openings within each of said continuous electrical via paths causing said forming of said conductive via material to form a diagonal structural path of said conductive via material through said laminated structure of insulator layers, and
said diagonal structural path being formed non-perpendicular to said top surface and said bottom surface.
8. The method of forming an integrated circuit structure according to claim 7 , further comprising forming multiple ones of said diagonal structural path to form diagonal structural paths,
adjacent ones of said diagonal structural paths forming a triangular load-bearing structure with one of said top surface and said bottom surface.
9. The method of forming an integrated circuit structure according to claim 8 , said triangular load-bearing structure preventing said laminated structure from warping and delaminating.
10. The method of forming an integrated circuit structure according to claim 7 , within each of said plurality of via openings, said second opening portion being formed to be overlapped with, and offset from said first opening portion.
11. The method of forming an integrated circuit structure according to claim 7 , said insulator layers being formed parallel to said top surface and said bottom surface.
12. The method of forming an integrated circuit structure according to claim 7 , further comprising connecting a flip chip to one of said bottom surface and said top surface.
13. A method of forming an integrated circuit structure comprising:
forming via openings in an insulator layer;
forming conductive via material within said via openings; and
forming a laminated structure of insulator layers on said insulator layer, said forming of said laminated structure of insulator layers comprising:
successively forming said insulator layers on one another;
repeating said forming of said via openings in each said insulator layers;
positioning corresponding ones of via openings of adjacent ones of said insulator layers to partially overlap each other; and
repeating said forming of said conductive via material in said via openings,
said laminated structure of insulator layers being formed to have a top surface and a bottom surface opposite said top surface,
said insulator layers being formed between said top surface and said bottom surface of said laminated structure of insulator layers,
said repeating of said forming of said conductive via material in said via openings electrically connecting said conductive via material within said corresponding ones of said via openings to form continuous electrical via paths through said insulator layers between said top surface and said bottom surface of said laminated structure of insulator layers,
said positioning of said corresponding ones of via openings within each of said continuous electrical via paths causing said forming of said conductive via material to form a diagonal structural path of said conductive via material through said laminated structure of insulator layers.
14. The method of forming an integrated circuit structure according to claim 13 , further comprising forming multiple ones of said diagonal structural path to form diagonal structural paths,
adjacent ones of said diagonal structural paths forming a triangular load-bearing structure with one of said top surface and said bottom surface.
15. The method of forming an integrated circuit structure according to claim 14 , said triangular load-bearing structure preventing said laminated structure from warping and delaminating.
16. The method of forming an integrated circuit structure according to claim 13 , within each of said via openings, a second opening portion is formed to be overlapped with, and offset from a first opening portion.
17. The method of forming an integrated circuit structure according to claim 13 , said insulator layers being formed parallel to said top surface and said bottom surface.
18. The method of forming an integrated circuit structure according to claim 13 , further comprising connecting a flip chip to one of said bottom surface and said top surface.