Granted Patent
Utility
US 6,534,859
· Confirmation No. 3870
SEMICONDUCTOR PACKAGE HAVING HEAT SINK ATTACHED TO PRE-MOLDED CAVITIES AND METHOD FOR CREATING THE PACKAGE
Patented Case
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2016-04-07 | OATH |
Oath or Declaration filed | 8 | View | |
| 2002-04-05 | TRNA |
Transmittal of New Application | 1 | View | |
| 2002-04-05 | SPEC |
Specification | 24 | View | |
| 2002-04-05 | CLM |
Claims | 18 | View | |
| 2002-04-05 | ABST |
Abstract | 1 | View | |
| 2002-04-05 | DRW |
Drawings-only black and white line drawings | 5 | View | |
| 2002-04-05 | OATH |
Oath or Declaration filed | 3 | View |
Inventors
Attorneys & Agents of Record
Classification
USPC
257/706
H10W40/778
H10W74/10
H10W72/536
H10W72/884
H10W72/5363
H10W72/551
H10W72/951
H10W72/075
H10W74/00
H10W90/754
H10W42/20
H10W90/734
H10W74/117
Prosecution
- Examiner
- MITCHELL, JAMES M
- Art Unit
- 2827
- Customer No.
- 28112
- Docket No.
- ST01-003
- Confirmation No.
- 3870
Patent Term Adjustment
0days
No related applications found.
RELEASE OF SECURITY INTEREST
Recorded 2020-06-16
SECURITY INTEREST
Recorded 2015-08-06
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-04-05
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Quick Facts
- Patent No.
- US 6,534,859
- App. No.
- 10/116,983
- Filed
- 2002-04-05
- Granted
- 2003-03-18
- Examiner
- MITCHELL, JAMES M
- Art Unit
- 2827
- PTA
- 0 days
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