IP Library Granted Patent US 6,534,859
Granted Patent Utility
US 6,534,859 · Confirmation No. 3870

SEMICONDUCTOR PACKAGE HAVING HEAT SINK ATTACHED TO PRE-MOLDED CAVITIES AND METHOD FOR CREATING THE PACKAGE

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2016-04-07 OATH Oath or Declaration filed 8 View
2002-04-05 TRNA Transmittal of New Application 1 View
2002-04-05 SPEC Specification 24 View
2002-04-05 CLM Claims 18 View
2002-04-05 ABST Abstract 1 View
2002-04-05 DRW Drawings-only black and white line drawings 5 View
2002-04-05 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,534,859
App. No.
10/116,983
Filed
2002-04-05
Granted
2003-03-18
Art Unit
2827
PTA
0 days