IP Library Granted Patent US 7,170,315
Granted Patent B2
US 7,170,315 · App. 10/843,701 · Granted Jan 30, 2007

Programmable system on a chip

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Quick Facts
Patent No.
US 7,170,315
App. No.
10/843,701
Granted
Jan 30, 2007
Kind
B2
Abstract

A programmable system-on-a-chip integrated circuit device comprises a programmable logic block, a non-volatile memory block, an analog sub-system, an analog input/output circuit block, and a digital input/output circuit block. A programmable interconnect architecture includes programmable elements and interconnect conductors. Ones of the programmable elements are coupled to the programmable logic block, the non-volatile memory block, the analog sub-system, the analog input/output circuit block, the digital input/output circuit block, and to the interconnect conductors, such that inputs and outputs of the programmable logic block, the non-volatile memory block, the analog sub-system, the analog input/output circuit block, and the digital input/output circuit block can be programmably coupled to one another.

Claims (38)

1. A programmable system-on-a-chip integrated circuit device comprising:

a programmable logic block

a digital input/output circuit block;

a non-volatile memory block;

an analog circuit block including an analog to digital converter and at least one temperature-sensing circuit coupled to an I/O pad and including a programmable voltage prescaling circuit;

an analog input/output circuit block; and

a programmable interconnect architecture including programmable elements and interconnect conductors, ones of said programmable elements coupled to said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, said digital input/output circuit block, and to said interconnect conductors, such that inputs and outputs of said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, and said digital input/output circuit block can be programmably coupled to one another.

2. The programmable system-on-a-chip integrated circuit device of claim 1 further including a static random-access memory block and wherein said programmable interconnect architecture is coupled to said static random-access memory block.

3. The programmable system-on-a-chip integrated circuit device of claim 2 wherein said static random-access memory block is configured into at least two sub-blocks.

4. The programmable system-on-a-chip integrated circuit device of claim 1 further including a microcontroller block and a static random-access memory block and wherein said programmable interconnect architecture is coupled to said microcontroller block and said static random-access memory block.

5. The programmable system-on-a-chip integrated circuit device of claim 4 wherein said static random-access memory block is configured into at least two sub-blocks.

6. The programmable system-on-a-chip integrated circuit device of claim 1 further including a microprocessor block and a static random-access memory block and wherein said programmable interconnect architecture is coupled to said microprocessor block and said static random-access memory block.

7. The programmable system-on-a-chip integrated circuit device of claim 6 wherein said static random-access memory block is configured into at least two sub-blocks.

8. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said non-volatile memory block comprises flash memory.

9. The programmable system-on-a-chip integrated circuit device of claim 1 further including a digital input circuit coupled to said I/O pad.

10. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes at least one voltage-sensing circuit coupled to an I/O pad.

11. The programmable system-on-a-chip integrated circuit device of claim 10 wherein said at least one voltage-sensing circuit includes a programmable voltage prescaling circuit.

12. The programmable system-on-a-chip integrated circuit device of claim 10 further including a digital input circuit coupled to said I/O pad.

13. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes at least one current-sensing circuit coupled to a first I/O pad and a second I/O pad.

14. The programmable system-on-a-chip integrated circuit device of claim 13 wherein said at least one current-sensing circuit includes a programmable voltage prescaling circuit.

15. The programmable system-on-a-chip integrated circuit device of claim 13 further including a digital input circuit coupled to at least one of said first and second I/O pads.

16. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes at least one programmable MOSFET gate-drive circuit coupled to an I/O pad.

17. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said analog circuit block further includes:

at least one MOSFET gate-drive circuit coupled to a first I/O pad

at least one voltage-sensing circuit coupled to a second I/O pad; and

at least one current-sensing circuit coupled to said second I/O pad and a third I/O pad and wherein said at least one temperature-sensing circuit is coupled to a fourth I/O pad.

18. The programmable system-on-a-chip integrated circuit device of claim 17 further including a digital input circuit coupled to one of said second, third, and fourth I/O pads.

19. The programmable system-on-a-chip integrated circuit device of claim 1 wherein said non-volatile memory block has a first segment that may be programmably connected to a user-configured circuit and a second segment that may not be programmably connected to a user-configured circuit.

20. The programmable system-on-a-chip integrated circuit device of claim 1 further including a bandgap reference circuit.

21. A programmable system-on-a-chip integrated circuit device comprising:

a programmable logic block

a digital input/output circuit block;

a non-volatile memory block;

an analog circuit block;

an analog input/output circuit block;

a programmable interconnect architecture including programmable elements and interconnect conductors, ones of said programmable elements coupled to said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, said digital input/output circuit block, and to said interconnect conductors, such that inputs and outputs of said programmable logic block, said non-volatile memory block, said analog circuit block, said analog input/output circuit block, and said digital input/output circuit block can be programmably coupled to one another; and

a system controller block including a power-up controller configured to apply system power to said programmable logic block, said digital input/output circuit block, said non-volatile memory block, said analog circuit block, and said analog input/output circuit block in a predetermined sequence and a system supervisor block coupled to at least one of said programmable logic block, said digital input/output circuit block, said non-volatile memory block, said analog circuit block, and said analog input/output circuit block, and configured to monitor at least one function of at least one circuit external to the programmable system-on-a-chip integrated circuit device.

22. The programmable system-on-a-chip integrated circuit device of claim 21 wherein said system supervisor block is further configured to control at least one function of said at least one circuit external to said programmable system-on-a-chip integrated circuit device.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2005
From: BAKKER, GREG; SPEERS, THEODORE; SCHUBERT, BRIAN; KOLKIND, KURT; NARAYANAN, VENKATESH; PLANTS, WILLIAM C.; ZHU, LIMIN; BALASUBRAMANIAN, RABINDRANATH; BARRAZA, THOMAS; MCCOLLUM, JOHN
To: ACTEL CORPORATION
Reel/Frame 015879/0401 →