IP Library Granted Patent US 7,528,616
Granted Patent B2
US 7,528,616 · App. 11/140,455 · Granted May 5, 2009

Zero ATE insertion force interposer daughter card

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Quick Facts
Patent No.
US 7,528,616
App. No.
11/140,455
Granted
May 5, 2009
Kind
B2
Abstract

A zero automated electrical testing (ATE) interposer daughter card (IDC) is provided for use in a test apparatus for ATE. Embodiments of the IDC include a first side having a first set of pads for mounting I/O's of a test package; and a second side having a second set of pads coupled to the first set of pads for replicating the first set of pads, wherein the second set of pads is located in area of the interposer card horizontally offset from the first set of pads, such that ATE measurements are obtained by removably inserting only a portion of the interposer card containing the second set of pads into an ATE test socket.

Claims (9)

1. A zero insertion-force interposer daughter card (IDC) for use in a test apparatus having a test socket, comprising:

a test package area containing a set of test package pads for surface mounting I/O's of a test package;

an extended area adjacent to the test package area having a set of replicated test pads for replicating the test package pads and for removably inserting the IDC into the test socket; and

traces for coupling the test package pads to the replicated test package pads;

wherein when the extended area is removably inserted into the test apparatus such that the set of replicated test pads mate with the test socket, an test socket clamp rests on the top side of the extended area to hold the IDC in place, while the test package area is left suspended in air and not disturbed by force imparted by the test socket clamp.

2. The zero insertion-force IDC of claim 1 wherein a first side of the IDC in the test package area includes the test package pads, and a second side of the IDC in the extended are includes the replicated test package pads.

3. The zero insertion-force IDC of claim 2 wherein the traces are coupled between a set of test package vias, which are coupled to respective test package pads, and a set of replicated vias, which are coupled to respective replicated test pads.

4. The zero insertion-force IDC of claim 3 wherein the traces are located within of the IDC.

5. The zero insertion-force IDC of claim 4 wherein the IDC is used with automated testing equipment.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059723/0382 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044886/0766 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
CHANGE OF NAME Recorded Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
MERGER Recorded Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2005
From: GRILLETTO, CARLO; KUTLU, ZAFER S.
To: LSI LOGIC CORPORATION
Reel/Frame 016646/0234 →