SUBSTRATE INDEXING SYSTEM
A substrate indexing system comprising aligning a substrate with an indexing system, drawing the substrate along a long axis of the indexing system, and engaging the substrate using a self-aligning resilient tensioner with a chamfered edge.
1 . A substrate indexing system comprising:
aligning a substrate with an indexing system;
drawing the substrate along an axis of the indexing system; and
engaging the substrate using a self-aligning resilient tensioner with a chamfered edge.
2 . The system as claimed in claim 1 further comprising:
configuring the self-aligning resilient tensioner with the chamfered edge to act upon a load transference member.
3 . The system as claimed in claim 1 further comprising:
configuring the self-aligning resilient tensioner with the chamfered edge to automatically adjust to varying substrate thicknesses.
4 . The system as claimed in claim 1 further comprising:
configuring the self-aligning resilient tensioner with the chamfered edge at parallel peripheral edges of a substrate, between integrated circuits, between panels, or a combination thereof.
5 . The system as claimed in claim 1 further comprising:
configuring the self-aligning resilient tensioner with the chamfered edge to possess a tapered leading edge designed to facilitate substrate movement.
6 . A substrate indexing system comprising:
indexing a substrate through a heating system including a self-aligned resilient tensioner comprised by a self-aligning resilient member section, a load transferance member section, and a chamfered bottom down holder clamp section;
providing pressure upon a chamfered bottom down holder clamp via a self-aligning resilient member acting upon a load transferance member; and
transmitting the pressure of the chamfered bottom down holder clamp to the substrate by first engaging the substrate via a chamfered surface and indexing the substrate underneath the self-aligned resilient tensioner.
7 . The system as claimed in claim 6 further comprising:
configuring the substrate indexing system to minimize heat transfer loss between the heating system and the substrate.
8 . The system as claimed in claim 6 further comprising:
configuring the substrate indexing system to provide a substantially flat substrate which improves die attach of integrated circuits.
9 . The system as claimed in claim 6 further comprising:
configuring the substrate indexing system to provide a substantially flat substrate which improves bond placement accuracy or bond line thickness.
10 . The system as claimed in claim 6 further comprising:
configuring the self-aligned resilient tensioner to continuously hold down the substrate during indexing.
11 . A substrate indexing system comprising:
a tensioner, wherein the tensioner includes:
a self-aligning resilient member section,
a load transferance member section, and
a chamfered bottom down holder clamp section.
12 . The system as claimed in claim 11 wherein:
the self-aligning resilient member section includes a member capable of generating a load.
13 . The system as claimed in claim 11 wherein:
the load transferance member section includes a roundish or oblong member.
14 . The system as claimed in claim 111 wherein:
a tapered leading edge of the chamfered bottom down holder clamp is tapered less than a tapered trailing edge.
15 . The system as claimed in claim 11 wherein:
the chamfered bottom down holder clamp section includes a leading edge taper of about 11° and a trailing edge taper of about 35°.
16 . A substrate indexing system comprising:
a heating system including an indexing arm for moving substrates through the heating system;
a self-aligned resilient tensioner formed within the heating system;
wherein the self-aligned resilient tensioner is comprised by a resilient absorber section containing a resilient member, a load transferance member section, and a chamfered bottom down holder clamp.
17 . The system as claimed in claim 16 wherein:
the substrate is a bonding substrate or a leadframe.
18 . The system as claimed in claim 16 wherein:
the self-aligned resilient tensioner automatically adjusts to varying substrate thicknesses.
19 . The system as claimed in claim 16 wherein:
the self-aligned resilient tensioner configured to prevent warpage of a substrate.
20 . The system as claimed in claim 16 wherein:
the self-aligned resilient tensioner is comprised of a tungsten carbide material coated with titanium.