Semiconductor package system with cavity substrate
A semiconductor package system is provided including providing a cavity substrate having a cavity provided therein, attaching a metal die pad to the cavity substrate, attaching a semiconductor die in the cavity to the metal die pad, and attaching solder connectors to the cavity substrate for connection on the system board with the metal die pad on the system board.
1. A method of manufacturing a semiconductor package system comprising:
providing a cavity substrate, having a cavity provided therethrough, including a top foil protector on a top surface of the cavity substrate and a bottom foil protector on a bottom surface of the cavity substrate;
attaching a metal die pad in an underside rim of the cavity substrate;
attaching a semiconductor die in the cavity to the metal die pad;
bonding the semiconductor die with bond wires to the cavity substrate;
encapsulating the bond wires in a wire encapsulant;
encapsulating the semiconductor die and the wire encapsulant; and
attaching solder connectors to the cavity substrate for connection on a system board with the metal die pad on the system board.
2. The method as claimed in 1 wherein:
attaching the metal die pad includes forming the metal die pad to have a cross-section with a pedestal.
3. The method as claimed in 1 wherein attaching the metal die pad includes forming the metal die pad to have a rectangular cross-section.
4. The method as claimed in 1 wherein attaching the metal die pad further comprises forming the metal die pad as a paddle to have a shape of a circle, a square with perpendicular arms, or a square with 45 degree arms.
5. The method as claimed in 1 further comprising:
conductively attaching the cavity substrate to conductive wiring on the system board; and
conductively attaching the metal die pad to the conductive wiring on the system board.
6. A method of manufacturing a semiconductor package system comprising:
providing a cavity substrate, having a cavity provided therethrough, including a top foil protector on a top surface of the cavity substrate and a bottom foil protector on a bottom surface of the cavity substrate;
attaching a metal die pad in an underside rim of the cavity substrate at the bottom of the cavity;
attaching a semiconductor die in the cavity to the metal die pad;
bonding the semiconductor die with bond wires to the cavity substrate;
encapsulating the bond wires in a wire encapsulant;
encapsulating the semiconductor die and the wire encapsulant; and
attaching solder balls to the cavity substrate for connection on a system board with the metal die pad on the system board.
7. The method as claimed in 6 wherein: attaching the metal die pad includes forming the metal die pad to have a cross-section with a pedestal; and attaching the metal die pad indicates bonding the metal die pad at outer extremities thereof to the cavity substrate.
8. The method as claimed in 6 wherein:
attaching the metal die pad includes forming the metal die pad to have a rectangular cross-section; and
attaching the metal die pad includes bonding the metal die pad at an outer periphery thereof to the cavity substrate.
9. The method as claimed in 6 wherein:
attaching the metal die pad further comprises forming the metal die pad as a paddle to have a shape of a circle, a square with perpendicular arms, or a square with 45 degree arms; and
attaching the metal die pad includes bonding the metal die pad at an outer periphery thereof to the cavity substrate.
10. The method as claimed in 6 further comprising:
conductively attaching the cavity substrate to conductive wiring on the system board by the solder balls; and
conductively attaching the metal die pad to the conductive wiring on the system board by a conductive interconnection.
11. A semiconductor package system for attachment to a system board, comprising:
a cavity substrate, having a cavity provided therethrough, including a top foil protector on a top surface of the cavity substrate and a bottom foil protector on a bottom surface of the cavity substrate;
a metal die pad attached in an underside rim of the cavity substrate;
a semiconductor die in the cavity attached to the metal die pad; bond wires bonding the semiconductor die to the cavity substrate;
a wire encapsulant encapsulating the bond wires;
an encapsulant encapsulating the semiconductor die and the wire encapsulant; and
solder connectors attached to the cavity substrate for connection on the system board with the metal die pad on the system board.
12. The system as claimed in 11 wherein:
wherein the metal die pad has a cross-section with a pedestal.
13. The system as claimed in 11 wherein the metal die pad has a rectangular cross-section.
14. The system as claimed in 11 wherein the metal die pad is a paddle with a shape of a circle, a square with perpendicular arms, or a square with 45 degree arms.
15. The system as claimed in 11 further comprising:
the system board having conductive wiring;
the cavity substrate conductively attached to the conductive wiring on the system board; and
the metal die pad conductively attached to the conductive wring on the system board.
16. The system as claimed in 11 wherein:
the metal die pad is attached to the cavity substrate at the bottom of the cavity.
17. The system as claimed in 16 further comprising:
a top metal heat sink above or around the semiconductor die; and
the top metal heat sink partially encapsulated in a mold compound.
18. The system as claimed in 16 wherein the metal die pad is bonded at the outer periphery thereof to the cavity substrate.
19. The system as claimed in 16 wherein the metal die pad is bonded at the outer extremity thereof to the cavity substrate.
20. The system as claimed in 16 wherein:
the cavity substrate is conductively attached to conductive wiring on the system board by solder balls; and
the metal die pad is conductively attached to the conductive wiring on the system board by a conductive grease.