IP Library Granted Patent US 7,619,252
Granted Patent B2
US 7,619,252 · App. 11/196,277 · Granted Nov 17, 2009

Integrated circuit having a predefined dielectric strength

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Quick Facts
Patent No.
US 7,619,252
App. No.
11/196,277
Granted
Nov 17, 2009
Kind
B2
Abstract

An integrated circuit having a first connection, a second connection, a substrate, and a control connection, in provided. The control connection controls a conductivity of the integrated circuit between the first connection and the second connection. The integrated circuit further includes a first transistor and n additional transistors with conductive paths connected between the first connection and the second connection, n diodes, each of the n diodes being connected between a control connection of the n transistors and a driver supply voltage that corresponds to the voltage at the first connection combined with an additive offset, and wherein the control connection of the integrated circuit connects either the driver supply voltage or the voltage at the first connection to a control connection of the first transistor, and a voltage divider that is connected between the first connection and the second connection in parallel to the conductive paths and that connects the control connections of the transistors to one another and to both the first connection and the second connection. The control connections of each set of two transistors are connected to one another by a subsection of the voltage divider, which lies between them.

Claims (17)

1. An Integrated circuit comprising:

a first connection;

a second connection;

a substrate; and

a main control connection for controlling a conductivity of the integrated circuit between the first connection and the second connection;

a first transistor and n additional transistors having conductive paths connected in series between the first connection and the second connection, wherein n is an integer greater than or equal to 1, each of said transistor and said n additional transistors having a transistor control connection;

n diodes, each of the n diodes being connected between a transistor control connection of the n transistors and a driver supply voltage that corresponds to a voltage at the first connection combined with an additive offset, the main control connection connecting either the driver supply voltage or the voltage at the first connection to a control connection of the first transistor; and

a voltage divider connected between the first connection and the second connection and in parallel to the conductive paths, the voltage divider connecting the transistor control connections of the n transistors and the transistor control connection of the first transistor to one another and to both the first connection and the second connection,

wherein the control connections of each set of two transistors are connected to one another by a subsection of the voltage divider which lies between them.

2. The integrated circuit according to claim 1 , wherein the voltage divider has a diode connected between the second connection and the control connection of the n transistor whose conductive path is connected to the second connection.

3. The integrated circuit according to claim 1 , further comprising a series connection of n Zener diodes, each of which is connected in parallel to one of the subsections of the voltage divider connecting the transistor control connections of the transistors to one another.

4. The integrated circuit according to claim 1 , wherein a resistor is provided between the control connection of the integrated circuit and the control connection of the first transistor.

5. The integrated circuit according to claim 1 , wherein the transistors are MOS field-effect transistors.

6. The integrated circuit according to claim 1 , wherein the integrated circuit is based on CMOS technology.

7. The integrated circuit according to claim 1 , wherein a circuit section passes a variable voltage to the first connection.

8. The integrated circuit according to claim 1 , wherein a first power transistor has a conductive path between the first connection and a power supply voltage connection and is controlled by the second connection.

9. The integrated circuit according to claim 1 , wherein an additional power transistor has a conductive path in series with the conductive path of the first power transistor between the power supply voltage connection and a reference voltage connection of the integrated circuit.

Assignments (19)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2011
From: ATMEL AUTOMOTIVE GMBH
To: ATMEL CORPORATION
Reel/Frame 025899/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2009
From: ATMEL GERMANY GMBH
To: ATMEL AUTOMOTIVE GMBH
Reel/Frame 023209/0021 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2005
From: GRUBER, BERTHOLD; HEHN, LARS
To: ATMEL GERMANY GMBH
Reel/Frame 016860/0309 →