Granted Patent B2

US 7,368,319 · App. 11/276,940 · Granted May 6, 2008

Abstract

Claims (88)

1. A stacked integrated circuit package-in-package system comprising:

forming a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation;

stacking the first integrated circuit package below the second integrated circuit package with the first encapsulation attached to the second encapsulation;

forming a substrate having an opening from a substrate top surface to a substrate bottom surface;

mounting the first integrated circuit package over the substrate top surface;

electrically connecting the first integrated circuit package and the substrate bottom surface through the opening; and

electrically connecting the second integrated circuit package and the substrate top surface.

2. The system as claimed in claim 1 wherein:

electrically connecting the first integrated circuit package and the substrate bottom surface comprises:

electrically connecting the first integrated circuit package and a contact on the substrate bottom surface; and

further comprising:

attaching an external interconnect on the contact.

3. The system as claimed in claim 1 further comprising:

mounting an integrated circuit die on the substrate top surface; and

electrically connecting the integrated circuit die and the substrate top surface.

4. The system as claimed in claim 1 further comprising:

mounting an integrated circuit die on the substrate top surface; and

electrically connecting the integrated circuit die and the substrate bottom surface through the opening.

5. The system as claimed in claim 1 further comprising:

forming a package encapsulation having a recess, the recess exposes a portion of a second package substrate of the second integrated circuit package; and

mounting a device on the second package substrate in the recess.

6. A stacked integrated circuit package-in-package system comprising:

forming a first integrated circuit package having a first encapsulation and a first substrate;

forming a second integrated circuit package having a second encapsulation and a second substrate;

stacking the first integrated circuit package below the second integrated circuit package with the first encapsulation attached to the second encapsulation with a first adhesive;

forming a package substrate having an opening from a substrate top surface to a substrate bottom surface, the substrate bottom surface has a bottom contact;

mounting the first integrated circuit package over the substrate top surface with the first substrate towards the substrate top surface;

electrically connecting the first integrated circuit package and the bottom contact of the substrate bottom surface through the opening; and

electrically connecting the second integrated circuit package and the substrate top surface.

7. The system as claimed in claim 6 further comprising electrically connecting the second substrate and the substrate top surface.

8. The system as claimed in claim 6 wherein:

electrically connecting the first integrated circuit package and the substrate bottom surface comprises:

electrically connecting the first integrated circuit package and the bottom contact on the substrate bottom surface through the opening; and

further comprising:

encapsulating the opening to form a center gate mold on the substrate bottom surface; and

attaching an external interconnect on the contact.

9. The system as claimed in claim 6 further comprising:

mounting an integrated circuit die having a central bond pad on the substrate top surface;

electrically connecting the central bond pad and the substrate bottom surface through the opening;

encapsulating the opening to form a center gate mold on the substrate bottom surface; and

attaching an external interconnect on the contact.

10. The system as claimed in claim 6 further comprising:

forming a package encapsulation having a recess, the recess exposes a portion of the second substrate; and

electrically connecting a device and a terminal pad on the second substrate in the recess.

11. A stacked integrated circuit package-in-package system comprising:

a first integrated circuit package having a first encapsulation and a second integrated circuit package having a second encapsulation;

the first integrated circuit package below the second integrated circuit package with the first encapsulation attached to the second encapsulation;

a substrate having an opening from a substrate top surface to a substrate bottom surface;

the first integrated circuit package over the substrate top surface;

a first interconnect between the first integrated circuit package and the substrate bottom surface through the opening; and

a second interconnect between the second integrated circuit package and the substrate top surface.

12. The system as claimed in claim 11 wherein:

the first interconnect between the first integrated circuit package and the substrate bottom surface comprises:

the first interconnect between the first integrated circuit package and a contact on the substrate bottom surface; and

further comprising:

an external interconnect on the contact.

13. The system as claimed in claim 11 further comprising:

an integrated circuit die on the substrate top surface; and

a second interconnect between the integrated circuit die and the substrate top surface.

14. The system as claimed in claim 11 further comprising:

an integrated circuit die on the substrate top surface; and

a second interconnect between the integrated circuit die and the substrate bottom surface through the opening.

15. The system as claimed in claim 11 further comprising:

a package encapsulation having a recess, the recess exposes a portion of a second package substrate of the second integrated circuit package; and

a device on the second package substrate in the recess.

16. The system as claimed in claim 11 wherein:

the first integrated circuit package has the first encapsulation and a first substrate;

the second integrated circuit package has the second encapsulation and a second substrate;

the first integrated circuit package is below the second integrated circuit package with the first encapsulation attached to the second encapsulation with a first adhesive;

the substrate is a package substrate with an opening from the substrate top surface to the substrate bottom surface having a bottom contact;

the first integrated circuit package is over the substrate top surface with the first substrate towards the substrate top surface;

the first interconnect is between the first integrated circuit package and the bottom contact of the substrate bottom surface through the opening; and

the second interconnect is between the second integrated circuit package and a top contact of the substrate top surface.

17. The system as claimed in claim 16 further comprising a second interconnect between the second substrate and the substrate top surface.

18. The system as claimed in claim 16 wherein:

the first interconnect between the first integrated circuit package and the substrate bottom surface comprises:

the first interconnect between the first integrated circuit package and the bottom contact on the substrate bottom surface through the opening; and

further comprising:

a package encapsulation to fill the opening and to form a center gate mold on the substrate bottom surface; and

an external interconnect on the contact.

19. The system as claimed in claim 16 further comprising:

an integrated circuit die having a central bond pad on the substrate top surface;

a second interconect between the central bond pad and the substrate bottom surface through the opening;

a package encapsulation to fill the opening and to form a center gate mold on the substrate bottom surface; and

an external interconnect on the contact.

20. The system as claimed in claim 16 further comprising:

forming a package encapsulation having a recess, the recess exposes a portion of the second substrate; and

a second interconnect between a device and a terminal pad on the second substrate in the recess.

Assignments (7)