INTEGRATED CIRCUIT PACKAGE SYSTEM
An integrated circuit package system is provided forming an integrated circuit die having a non-active side and an active side, elevating a die paddle above an external interconnect, attaching the active side on a bottom side of the die paddle, and partially encapsulating the integrated circuit die, the die paddle, and the external interconnect with a top side of the die paddle and the non-active side exposed.
1 . An integrated circuit package system comprising:
forming an integrated circuit die having a non-active side and an active side;
elevating a die paddle above an external interconnect;
attaching the active side on a bottom side of the die paddle; and
partially encapsulating the integrated circuit die, the die paddle, and the external
interconnect with a top side of the die paddle and the non-active side exposed.
2 . The system as claimed in claim 1 further comprising forming a low package height below 0.8 mm.
3 . The system as claimed in claim 1 further comprising:
forming a first thermal dissipation path from the active side through the die paddle to ambient; and
forming a second thermal dissipation path from the active side through the non-active side to ambient.
4 . The system as claimed in claim 1 wherein attaching the active side on the bottom side of the die paddle includes applying an adhesive between the integrated circuit die and the die paddle.
5 . The system as claimed in claim 1 further comprising electrically connecting the active side and the external interconnect.
6 . An integrated circuit package system comprising:
forming an integrated circuit die having a non-active side and an active side having circuitry provided thereon;
elevating a die paddle above an external interconnect with a tie bar attached to the die paddle;
attaching the active side on a bottom side of the die paddle with an adhesive; and
partially encapsulating the integrated circuit die, the die paddle, and the external interconnect with a top side of the die paddle, the non-active side, and a portion of the external interconnect exposed.
7 . The system as claimed in claim 6 further comprising forming the die paddle and the external interconnects from a lead frame comprised of metals or alloys.
8 . The system as claimed in claim 6 further comprising forming the die paddle and the external interconnects from a lead frame plated with a material comprised of gold, silver, copper oxide, or nickel palladium alloy.
9 . The system as claimed in claim 6 further comprising forming the die paddle and the external interconnects from a lead frame pre-plated with a material comprised of an insulator, an epoxy, a liquid type epoxy, a B-stage epoxy, or a film type epoxy.
10 . The system as claimed in claim 6 wherein attaching the active side on the bottom side of the die paddle has the integrated circuit die larger than the die paddle.
11 . An integrated circuit package system comprising:
an integrated circuit die having a non-active side and an active side;
a die paddle above an external interconnect;
the active side on a bottom side of the die paddle; and
a first encapsulation to partially cover the integrated circuit die, the die paddle, and
the external interconnect with a top side of the die paddle and the non-active side exposed.
12 . The system as claimed in claim 11 further comprising a low package height below 0.8 mm.
13 . The system as claimed in claim 11 further comprising:
a first thermal dissipation path from the active side through the die paddle to ambient; and
a second thermal dissipation path from the active side through the non-active side to ambient.
14 . The system as claimed in claim 11 wherein the active side on the bottom side of the die paddle includes an adhesive between the integrated circuit die and the die paddle.
15 . The system as claimed in claim 11 further comprising an internal interconnect between the active side and the external interconnect.
16 . The system as claimed in claim 11 wherein:
the integrated circuit die having the non-active side and the active side has circuitry provided on the active side;
the die paddle above the external interconnect is attached to a tie bar;
the active side on the bottom side of the die paddle has an adhesive between the active side and the bottom side; and
the first encapsulation to partially cover the integrated circuit die, the die paddle, and
the external interconnect with the top side of the die paddle and the non-active side exposed also exposes a portion of the external interconnect.
17 . The system as claimed in claim 16 further comprising the die paddle and the external interconnects comprised of metals or alloys.
18 . The system as claimed in claim 16 further comprising the die paddle and the external interconnects plated with a material comprised of gold, silver, copper oxide, or nickel palladium alloy.
19 . The system as claimed in claim 16 further comprising the die paddle and the external interconnects pre-plated with a material comprised of an insulator, an epoxy, a liquid type epoxy, a B-stage epoxy, or a film type epoxy.
20 . The system as claimed in claim 16 wherein the active side on the bottom side of the die paddle has the integrated circuit die larger than the die paddle.