Multichip package system

1. A multichip package system comprising:

forming a substrate having a plurality of molding transfer channels;

connecting a first integrated circuit die on a top side of the substrate;

connecting a second integrated circuit die on a bottom side of the substrate; and

concurrently encapsulating the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels.

2. The system as claimed in claim 1 wherein forming the substrate includes forming a shield in the substrate.

3. The system as claimed in claim 1 wherein:

forming the substrate having the plurality of the molding transfer channels comprises:

forming an extension of the substrate, the extension having a molding transfer channel; and

concurrently encapsulating the first integrated circuit die and the second integrated circuit die with the molding compound flow through the plurality of the molding transfer channels further comprises:

forming a center gate mold with the molding compound flow from the molding transfer channel through bottom runners at the bottom side of the substrate to cover the second integrated circuit die.

4. The system as claimed in claim 1 wherein connecting the first integrated circuit die on the top side includes attaching the first integrated circuit die over a portion of the plurality of the molding transfer channels.

5. The system as claimed in claim 1 wherein forming the substrate having the plurality of the molding transfer channels comprises:

forming the substrate having bond pads; and

forming a configuration of the plurality of the molding transfer channels comprised of the molding transfer channels between the bond pads and edges of the substrate, the molding transfer channels between the bond pads, the molding transfer channels in a vertical orientation, the molding transfer channels in a horizontal orientation, and a combination thereof.

6. A multichip package system comprising:

forming a substrate having a plurality of molding transfer channels and a bond pad;

connecting a first integrated circuit die and a device on a top side of the substrate;

connecting a second integrated circuit die on a bottom side of the substrate;

concurrently encapsulating the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels; and

attaching an external interconnect on the bottom side.

7. The system as claimed in claim 6 wherein connecting the first integrated circuit die includes connecting a bond wire between the first integrated circuit die and the top side.

8. The system as claimed in claim 6 wherein connecting the first integrated circuit die includes connecting a solder bump between the first integrated circuit die and the top side.

9. The system as claimed in claim 6 wherein connecting the second integrated circuit die includes connecting a bond wire between the second integrated circuit die and the bottom side.

10. The system as claimed in claim 6 wherein connecting the second integrated circuit die includes connecting a solder bump between the second integrated circuit die and the bottom side.

11. A multichip package system comprising:

a substrate having a plurality of molding transfer channels;

a first integrated circuit die on a top side of the substrate;

a second integrated circuit die on a bottom side of the substrate; and

an encapsulation to cover the first integrated circuit die and the second integrated circuit die with a molding compound flow through the plurality of the molding transfer channels.

12. The system as claimed in claim 11 wherein the substrate includes a shield in the substrate.

13. The system as claimed in claim 11 wherein:

the substrate having the plurality of the molding transfer channels comprises:

an extension of the substrate, the extension having a molding transfer channel; and

an encapsulation to cover the first integrated circuit die and the second integrated circuit die with the molding compound flow through the plurality of the molding transfer channels further comprises:

a center gate mold with the molding compound flow from the molding transfer channel through bottom runners at the bottom side of the substrate to cover the second integrated circuit die.

14. The system as claimed in claim 11 wherein the first integrated circuit die on the top side includes the first integrated circuit die over a portion of the plurality of the molding transfer channels.

15. The system as claimed in claim 11 wherein the substrate having the plurality of the molding transfer channels comprises:

the substrate having bond pads; and

a configuration of the plurality of the molding transfer channels comprised of the molding transfer channels between the bond pads and edges of the substrate, the molding transfer channels between the bond pads, the molding transfer channels in a vertical orientation, the molding transfer channels in a horizontal orientation, and a combination thereof.

16. The system as claimed in claim 11 wherein:

the substrate having the plurality of the molding transfer channels has a shield therein;

the first integrated circuit die on the top side of the substrate is attached with an adhesive;

the second integrated circuit die on the bottom side of the substrate is attached with the adhesive; and

the encapsulation to cover the first integrated circuit die and the second integrated circuit die with a molding compound through the molding transfer channel is a cover of the top side;

further comprising:

the substrate having a bond pad; and

an external interconnect on the bottom side.

17. The system as claimed in claim 16 wherein the first integrated circuit die on the top side includes a bond wire between the first integrated circuit die and the top side.

18. The system as claimed in claim 16 wherein the first integrated circuit die on the top side includes a solder bump between the first integrated circuit die and the top side.

19. The system as claimed in claim 16 wherein the second integrated circuit die on the bottom side includes a bond wire between the second integrated circuit die and bottom side.

20. The system as claimed in claim 16 wherein the second integrated circuit die on the bottom side includes a solder bump between the second integrated circuit die and bottom side.