Hybrid stacking package system
View Patent ↗A hybrid stacking package system is provided including providing a board-on-chip substrate, having an opening, attaching a first integrated circuit on the board-on-chip substrate, attaching bond wires, between the first integrated circuit and the board-on-chip substrate, through the opening, and mounting a second integrated circuit over the bond wires.
1. A hybrid stacking package system comprising:
providing a board-on-chip substrate, having an opening;
attaching a first integrated circuit on the board-on-chip substrate includes applying a die attach film on the board-on-chip substrate beneath the first integrated circuit;
attaching bond wires, between the first integrated circuit and the board-on-chip substrate, through the opening includes forming an electrical connection on the surface of the board-on-chip substrate opposite the first integrated circuit;
mounting a second integrated circuit over the bond wires includes mounting an IC spacer between the second integrated circuit and the board-on-chip substrate; and
attaching bond wires between the second integrated circuit and the board-on-chip substrate through a second set of openings.
2. The system as claimed in claim 1 further comprising including a die attach material, on the bond wires, filling the opening includes forming a mounting surface for an integrated circuit.
3. The system as claimed in claim 1 further comprising applying amolding compound for encapsulating the integrated circuit and the bond wires provides protecting the bond wires.
4. The system as claimed in claim 1 further comprising attaching electrical interconnects on the board-on-chip substrate for system connection, wherein attaching the electrical interconnects includes attaching solder balls, solder bumps, stud bumps or a combination thereof.
5. A hybrid stacking package system comprising:
a board-on-chip substrate, having an opening;
a first integrated circuit attached on the board-on-chip substrate;
bond wires attached, between the first integrated circuit and the board-on-chip substrate, through the opening;
a second integrated circuit mounted over the bond wires;
bond wires attached between the second integrated circuit and the board-on-chip substrate through a second set of openings;
a die attach film on the board-on-chip substrate beneath the first integrated circuit;
an electrical connection formed on the surface of the board-on-chip substrate opposite the first integrated circuit; and
an IC spacer mounted between the second integrated circuit and the board-on-chip substrate.
6. The system as claimed in claim 5 further comprising a die attach material, on the bond wires, to fill the opening includes a mounting surface formed for an integrated circuit.
7. The system as claimed in claim 5 further comprising a molding compound for encapsulating the integrated circuit and the bond wires provides protection for the bond wires.
8. The system as claimed in claim 5 further comprising electrical interconnects attached on the board-on-chip substrate for system connection, wherein the electrical interconnects include solder balls, solder bumps, stud bumps or a combination thereof.