Integrated circuit package system including stacked die

1. An integrated circuit package system comprising:

providing a wafer with bond pads formed on the wafer;

depositing a solder bump on one or more bond pads;

embedding the bond pads and the solder bump within a mold compound formed on the wafer;

forming a groove in the mold compound to expose a portion of the solder bump; and

singulating the wafer at the groove into individual die structures.

2. The system as claimed in claim 1 wherein forming the groove further comprises:

removing a top portion of the mold compound and a top portion of a solder bump associated with a bond pad.

3. The system as claimed in claim 2 further comprising:

exposing the top portion of two adjacent solder bumps.

4. The system as claimed in claim 1 wherein singulating further comprises:

cutting the wafer and the mold compound between two adjacent bond pads.

5. The system as claimed in claim 1 further comprising:

planarizing the bottom exposed surface of the wafer.

6. The system as claimed in claim 1 further comprising:

providing a printed circuit board; and

connecting the exposed portion of the solder bump to the printed circuit board with electrical connectors,

wherein a combined height of the mold compound and the wafer is at least greater than a height of the electrical connectors.

7. The system as claimed in claim 6 further comprising:

stacking a second semiconductor structure on the mold compound; and

connecting the second semiconductor structure to the printed circuit board.

8. The system as claimed in claim 6 further comprising:

encapsulating the wafer, the mold compound, and the electrical connectors with an encapsulant.

9. The system as claimed in claim 7 further comprises:

providing a layer of film laminate on the mold compound and under the second semiconductor structure.

10. The system as claimed in claim 6 further comprising:

forming solder balls on the bottom surface of the printed circuit board.