INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING DIE-ATTACH PAD WITH ELEVATED BONDLINE THICKNESS
An integrated circuit package system is provided. A leadframe is provided having a die-attach pad. Elevated buttons are formed on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
1 . An integrated circuit package system, comprising:
providing a leadframe having a die-attach pad; and
forming elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
2 . The system as claimed in claim 1 wherein forming elevated buttons on the top surface of the die-attach pad further comprises shaping the elevated buttons with a mechanical buttoning process.
3 . The system as claimed in claim 1 wherein forming elevated buttons on the top surface of the die-attach pad further comprises etching the top of the die-attach pad to form the elevated buttons thereon.
4 . The system as claimed in claim 1 further comprising attaching an IC die to the die-attach pad supported spaced by the elevated buttons above the top surface of the die-attach pad.
5 . The system as claimed in claim 1 further comprising attaching an IC die to the die-attach pad with an adhesive free of spacers therein, the IC die being spaced from the die-attach pad by the elevated buttons thereon.
6 . An integrated circuit package system, comprising:
providing a leadframe having a die-attach pad;
forming elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon free of contact with lead fingers on the leadframe;
attaching an IC die to the die-attach pad supported by the elevated buttons spaced above the top surface of the die-attach pad; and attaching bond wires between the IC die and lead fingers on the leadframe.
7 . The system as claimed in claim 6 wherein forming elevated buttons on the top surface of the die-attach pad further comprises shaping the elevated buttons with a mechanical buttoning process.
8 . The system as claimed in claim 6 wherein forming elevated buttons on the top surface of the die-attach pad further comprises forming the elevated buttons using an etch of the top surface of the die-attach pad to etch the top of the die-attach pad to form the elevated buttons thereon.
9 . The system as claimed in claim 6 wherein attaching an IC die to the die-attach pad further comprises attaching an IC die to the die-attach pad with an epoxy free of spacers therein, the IC die being spaced from the die-attach pad by the elevated buttons thereon.
10 . The system as claimed in claim 6 further comprising encapsulating the IC die, the bond wires, and at least portions of the lead fingers and the die-attach pad in an encapsulant to form a semiconductor package.
11 . An integrated circuit package system, comprising:
a leadframe having a die-attach pad; and
elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon.
12 . The system as claimed in claim 11 wherein the elevated buttons on the top surface of the die-attach pad further comprise buttons having the characteristics of having been shaped with a mechanical buttoning process.
13 . The system as claimed in claim 11 wherein the elevated buttons on the top surface of the die-attach pad further comprise buttons having the characteristics of having been formed by etching the top of the die-attach pad to form the elevated buttons thereon.
14 . The system as claimed in claim 11 further comprising an IC die attached to the die-attach pad supported spaced by the elevated buttons above the top surface of the die-attach pad.
15 . The system as claimed in claim 11 further comprising:
an IC die;
an adhesive, free of spacers therein, attaching the IC die to the die-attach pad; and
the IC die being spaced from the die-attach pad by the elevated buttons thereon.
16 . An integrated circuit package system, comprising:
a leadframe having lead fingers and a die-attach pad;
elevated buttons on the top surface of the die-attach pad configured to support an IC die in an elevated position thereon free of contact with the lead fingers;
an IC die attached to the die-attach pad supported by the elevated buttons spaced above the top surface of the die-attach pad; and
bond wires attached between the IC die and the lead fingers on the leadframe.
17 . The system as claimed in claim 16 wherein the elevated buttons on the top surface of the die-attach pad further comprise buttons having the characteristics of having been shaped with a mechanical buttoning process.
18 . The system as claimed in claim 16 wherein the elevated buttons on the top surface of the die-attach pad further comprise buttons having the characteristics of having been formed by etching the top of the die-attach pad to form the elevated buttons thereon.
19 . The system as claimed in claim 16 further comprising an epoxy attaching the IC die to the die-attach pad, the epoxy being free of spacers therein, and the IC die being spaced from the die-attach pad by the elevated buttons thereon.
20 . The system as claimed in claim 16 further comprising an encapsulant encapsulating the IC die, the bond wires, and at least portions of the lead fingers and the die-attach pad to form a semiconductor package.