Integrated circuit package system with heat sink
View Patent ↗An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of adhesive structures is formed. A heat sink is attached to the plurality of adhesive structures. The integrated circuit is encapsulated. The support bars are removed.
1. An integrated circuit package system comprising:
providing a substrate;
attaching an integrated circuit to the substrate;
forming a plurality of support bars on the substrate wherein forming the plurality of support bars on the substrate forms support bars having a height higher than the height of the integrated circuit;
forming a plurality of adhesive structures;
attaching a heat slug to the plurality of adhesive structures;
encapsulating the integrated circuit; and
removing the support bars.
2. The system for packaging integrated circuits as claimed in claim 1 , wherein forming a plurality of support bars on the substrate forms a plurality of adhesive dots.
3. The system for packaging integrated circuits as claimed in claim 1 , wherein:
forming a plurality of adhesive structures forms a plurality of adhesive dots on the plurality of support bars.
4. The system for packaging integrated circuits as claimed in claim 1 , wherein forming a plurality of adhesive structures forms a plurality of adhesive dots having a height higher than the height of the plurality of support bars.
5. An integrated circuit package system comprising:
providing a substrate;
attaching a plurality of integrated circuits to the substrate to form an array of integrated circuits;
forming a plurality of support bars around outer edges of the array of integrated circuits wherein forming the plurality of support bars on the substrate forms support bars having a height higher than the height of the array of integrated circuits;
forming a plurality of adhesive structures;
attaching a heat slug to the plurality of adhesive structures over the array of integrated circuits;
encapsulating the array of integrated circuits and the support bars to form an array of packaged integrated circuits; and
singulating the array of integrated circuits to form packaged integrated circuits having a heat sink above the integrated circuit above the array of integrated circuits and exposed through the encapsulant.
6. The system for packaging integrated circuits as claimed in claim 5 , wherein forming a plurality of support bars on the substrate forms a plurality of adhesive dots.
7. The system for packaging integrated circuits as claimed in claim 5 , wherein:
forming a plurality of adhesive structures forms a plurality of adhesive structures on the plurality of support bars.
8. The system for packaging integrated circuits as claimed in claim 5 , wherein forming a plurality of adhesive structures forms a plurality of adhesive dots having a height higher than the height of the plurality of support bars.