IP Library Granted Patent US 7,546,568
Granted Patent B2
US 7,546,568 · App. 11/311,515 · Granted Jun 9, 2009

Automation of tie cell insertion, optimization and replacement by scan flip-flops to increase fault coverage

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Quick Facts
Patent No.
US 7,546,568
App. No.
11/311,515
Granted
Jun 9, 2009
Kind
B2
Abstract

A method for designing an integrated circuit is disclosed. The method generally comprises the steps of (A) splitting a design layout of the integrated circuit into a plurality of tiles, (B) adding a plurality of tie-to cells to the design layout, wherein at least one of the tie-to cells generating a tie-to signal at a particular logical level is added into each of the tiles having at least one gate with an input fixed to the particular logical level and (C) routing the tie-to signal to each of the inputs within each of the tiles.

Claims (44)

1. A method for designing an integrated circuit, comprising the steps of:

(A) splitting a design layout of said integrated circuit into a plurality of tiles, wherein (i) said tiles each have a respective boundary, (ii) said design layout comprises a plurality of logic gates and (iii) said logic gates of a given set each have a respective logic input to be fixed at a first logical level;

(B) generating a list of said tiles;

(C) deleting from said list each of said tiles that does not contain at least one of said logical gates having at least one tied-to input;

(D) adding a plurality of tie-to cells to said design layout, wherein (i) said tie-to cells of a first set each generate a respective first tie-to signal at said first logical level, (ii) said first tie-to signals are intentionally current limited by said tie-to cells to prevent gate damage and (iii) said logic inputs of said given set of said logic gates outnumber said tie-to cells of said first set; and

(E) routing said first tie-to signals from said tie-to cells of said first set to said logic inputs of said given set without crossing said boundaries.

2. The method according to claim 1 , wherein said tie-to cells of said first set each comprises a tie-high cell generating said first tie-to signal at a logical high level.

3. The method according to claim 1 , wherein said tie-to cells of said first set each comprises a tie-low cell generating said first tie-to signal at a logical low level.

4. The method according to claim 1 , wherein (i) said tie-to cells of a second set each generate a respective second tie-to signal at a second logical level, (ii) said second tie-to signals are intentionally current limited by said tie-to cells to prevent gate damage and (iii) said first logical level is different than said second logical level.

5. The method according to claim 1 , further comprising the step of:

routing a second tie-to signal from a particular one of said tie-to cells of a second set to a particular one of said logic gates, wherein (i) said particular tie-to cell is in a first tile of said tiles, (ii) said particular logic gate is in a second tile of said tiles and (iii) said second tile is adjacent said first tile.

6. The method according to claim 1 , further comprising the step of:

routing a second tie-to signal from a particular one of said tie-to cells of said first set of said tie-to cells to a particular one of said logic inputs, wherein said second tie-to signal crosses one of said boundaries.

7. The method according to claim 1 , further comprising the step of:

generating at least one of said first tie-to signals using a resistive path to a power rail.

8. A method for designing an integrated circuit, comprising the steps of:

(A) splitting a design layout of said integrated circuit into a plurality of tiles, wherein (i) said tiles each have a respective boundary, (ii) said design layout comprises a plurality of logic gates and (iii) said logic gates of a given set each have a respective logic input to be fixed at a first logical level;

(B) adding a plurality of tie-to cells to said design layout, wherein (i) said tie-to cells of a first set each generate a respective first tie-to signal at said first logical level, (ii) said first tie-to signals are intentionally current limited by said tie-to cells to prevent gate damage and (iii) said logic inputs of said given set of said logic gates outnumber said tie-to cells of said first set;

(C) routing said first tie-to signals from said tie-to cells of said first set to said logic inputs of said given set without crossing said boundaries; and

(D) marking each of said tiles that (i) contains at least one of said logical gates having at least one tied-to input and (ii) lacks available space to place corresponding cells of said tie-to cells to fix said tied-to input.

9. The method according to claim 8 , further comprising the step of:

checking available space in each of said tiles adjoining said tiles that have been marked to place said corresponding cells.

10. A storage medium for use in a computer to for design an integrated circuit, the storage medium recording a computer program that is readable and executable by the computer, when executed the computer program comprising the steps of:

(A) splitting a design layout of said integrated circuit into a plurality of tiles, wherein (i) said tiles each have a respective boundary, (ii) said design layout comprises a plurality of logic gates and (iii) said logic gates of a given set each have a respective logic input to be fixed at a first logical level;

(B) generating a list of said tiles;

(C) deleting from said list each of said tiles that does not contain at least one of said logical gates having at least one tied-to input;

(D) adding a plurality of tie-to cells to said design layout, wherein (i) said tie-to cells of a first set each generate a respective first tie-to signal at said first logical level, (ii) said first tie-to signals are intentionally current limited by said tie-to cells to prevent gate damage and (iii) said logic inputs of said given set of said logic gates outnumber said tie-to cells of said first set; and

(E) routing said first tie-to signals from said tie-to cells of said first set to said logic inputs of said given set without crossing said boundaries.

11. The storage medium according to claim 10 , wherein said tie-to cells of said first set each comprises a tie-high cell generating said first tie-to signal at a logical high level.

12. The storage medium according to claim 10 , wherein said tie-to cells of said first set each comprises a tie-low cell generating said first tie-to signal at a logical low level.

13. The storage medium according to claim 10 , wherein (i) said tie-to cells of a second set each generate a respective second tie-to signal at a second logical level, (ii) said second tie-to signals are intentionally current limited by said tie-to cells to prevent gate damage and (iii) said first logical level is different than said second logical level.

14. The storage medium according to claim 10 , further comprising the step of:

routing a second tie-to signal from a particular one of said tie-to cells of a second set to a particular one of said logic gates, wherein (i) said particular tie-to cell is in a first tile of said tiles, (ii) said particular logic gate is in a second tile of said tiles and (iii) said second tile is adjacent said first tile.

15. The storage medium according to claim 10 , further comprising the step of:

routing a second tie-to signal from a particular one of said tie-to cells of said first set of said tie-to to a particular one of said logic inputs, wherein said second tie-to signal crosses one of said boundaries.

16. The storage medium according to claim 10 , further comprising the step of:

generating at least one of said first tie-to signals using a resistive path to a power rail.

17. A storage medium for use in a computer to for design an integrated circuit, the storage medium recording a computer program that is readable and executable by the computer, when executed the computer program comprising the steps of:

(A) splitting a design layout of said integrated circuit into a plurality of tiles, wherein (i) said tiles each have a respective boundary, (ii) said design layout comprises a plurality of logic gates and (iii) said logic gates of a given set each have a respective logic input to be fixed at a first logical level;

(B) adding a plurality of tie-to cells to said design layout, wherein (i) said tie-to cells of a first set each generate a respective first tie-to signal at said first logical level, (ii) said first tie-to signals are intentionally current limited by said tie-to cells to prevent gate damage and (iii) said logic inputs of said given set of said logic gates outnumber said tie-to cells of said first set;

(C) routing said first tie-to signals from said tie-to cells of said first set to said logic inputs of said given set without crossing said boundaries; and

(D) marking each of said tiles that (i) contains at least one of said logical gates having at least one tied-to input and (ii) lacks available space to place corresponding cells of said tie-to cells to fix said tied-to input.

18. The storage medium according to claim 17 , further comprising the step of:

checking available space in each of said tiles adjoining said tiles that have been marked to place said corresponding cells.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Apr 15, 2022
From: CORTLAND CAPITAL MARKET SERVICES LLC
To: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
Reel/Frame 059720/0223 →
SECURITY INTEREST Recorded Feb 1, 2018
From: HILCO PATENT ACQUISITION 56, LLC; BELL SEMICONDUCTOR, LLC; BELL NORTHERN RESEARCH, LLC
To: CORTLAND CAPITAL MARKET SERVICES LLC, AS COLLATERAL AGENT
Reel/Frame 045216/0020 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2017
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.; BROADCOM CORPORATION
To: BELL SEMICONDUCTOR, LLC
Reel/Frame 044887/0109 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: LSI CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035390/0388 →
CHANGE OF NAME Recorded Jun 6, 2014
From: LSI LOGIC CORPORATION
To: LSI CORPORATION
Reel/Frame 033102/0270 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
MERGER Recorded Feb 19, 2008
From: LSI SUBSIDIARY CORP.
To: LSI CORPORATION
Reel/Frame 020548/0977 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 19, 2005
From: DIRKS, JUERGEN; DINTER, MATHIAS; LEUCHTER, RALF
To: LSI LOGIC CORPORATION
Reel/Frame 017397/0802 →