Inter-stacking module system
View Patent ↗An inter-stacking module system is provided by mounting an integrated circuit on a first substrate, the first substrate having a first bond pad, mounting an inter-stacking module substrate over the integrated circuit, forming an inter-stacking module bonding pad on the inter-stacking module substrate, and connecting bond wires between the inter-stacking module bonding pad and the first bond pad.
1. An inter-stacking module system comprising:
a first substrate, the first substrate having a first bond pad;
a first integrated circuit mounted directly on the first substrate;
a second integrated circuit mounted directly on a surface of the first integrated circuit;
an integrated circuit spacer mounted directly on the surface of the first integrated circuit and spaced apart from the second integrated circuit;
an inter-stacking module substrate mounted with a center thereof over and between the integrated circuit spacer and the second integrated circuit includes a direct electrical connection between a module integrated circuit, mounted on the inter-stacking module substrate, and inter-stacking module bonding pads exposed from an outer peripheral vertical side of the inter-stacking module substrate and exposed from a module substrate bottom, with a solder mask isolated from a region between all of the inter-stacking module bonding pads on the outer peripheral vertical side;
bond wires directly connected between the inter-stacking module bonding pad-pads and the first bond pad;
further comprising instances of the inter-stacking module bonding pads aligned in a row on the inter-stacking module substrate;
instances of the first bond pad aligned in a row on the first substrate and parallel to the row of instances of the inter-stacking module bond pads;
further comprising a package in package device comprising:
an integrated circuit mounted directly on a module substrate to of the inter-stacking module substrate and connected to the inter-stacking module bond pads with the bond wires;
a molding compound encases the integrated circuit, the bond wires and the module substrate to of the inter-stacking module substrate; and
a stacking module spacer adhered to the molding compound and mounted over the integrated circuit on the first substrate.
2. The system as claimed in claim 1 further comprising a row of the inter-stacking module bonding pads on the inter-stacking module substrate.
3. The system as claimed in claim 1 further comprising a parallel row of first bond pads aligned with a parallel row of the inter-stacking module bonding pads.
4. The system as claimed in claim 1 wherein the inter-stacking module bonding pads comprise placing the inter-stacking module bonding pads at an edge of the inter-stacking module substrate.
5. The system as claimed in claim 1 further comprising a second molding compound around the inter-stacking module substrate, the bond wires and a first top side of the first substrate and a stacking module spacer adhered to a first molding compound.
6. The system as claimed in claim 1 further comprising an edge of the inter-stacking module substrate with the inter-stacking module bonding pads positioned on the edge of the inter-stacking module substrate.
7. The system as claimed in claim 1 further comprising a molding compound around the inter-stacking module substrate, the bond wires and a first top side of the first substrate.
8. The system as claimed in claim 1 further comprising a second integrated circuit stacked between the first integrated circuit mounted on the first substrate and the stacking module mounted over the first substrate.