Integrated circuit package system with down-set die pad and method of manufacture thereof
View Patent ↗An integrated circuit package system and method of manufacture therefor includes providing a substrate with a beveled cavity, attaching a down-set conductive die pad with tapered sidewalls for matching with the beveled cavity in the substrate and having the down-set below a lower surface of the substrate, and attaching an integrated circuit over the down-set conductive die pad and electrically connected thereto.
1. A method for manufacturing an integrated circuit package system comprising:
providing a substrate with a beveled cavity;
attaching a down-set conductive die pad with tapered sidewalls for matching with the beveled cavity in the substrate and having the down-set below a lower surface of the substrate; and
attaching an integrated circuit over the down-set conductive die pad and electrically connected thereto.
2. The method as claimed in claim 1 wherein attaching the down-set conductive die pad comprises:
forming substrate connectors having lower extents in a plane; and
forming an exposed surface of the down-set conductive die pad substantially coplanar with the plane of the lower extent of the substrate connectors.
3. The method as claimed in claim 1 wherein providing the down-set conductive die pad comprises:
forming substrate connectors having lower extents in a plane; and
forming an exposed surface of the down-set conductive die pad with an offset above the plane of the lower extent of the substrate connectors.
4. The method as claimed in claim 1 further comprising attaching another integrated circuit package system over the integrated circuit package system.
5. The method as claimed in claim 1 further comprising attaching passive devices on the substrate.
6. A method for manufacturing an integrated circuit package system comprising:
forming a substrate having a beveled cavity;
attaching a down-set conductive die pad with tapered sidewalls for matching with the beveled cavity of the substrate and having the down-set below a lower surface of the substrate;
attaching an integrated circuit over the down-set conductive die pad in the beveled cavity of the substrate, the integrated circuit electrically connected to the down-set conductive die pad; and
applying an encapsulant over the integrated circuit with a surface of the down-set conductive die pad exposed.
7. The method as claimed in claim 6 further comprising attaching a shield over the integrated circuit for electrical shielding.
8. The method as claimed in claim 6 further comprising attaching a heat sink over the integrated circuit for heat transfer.
9. The method as claimed in claim 6 wherein forming the down-set conductive die pad comprises forming a bridge-type down-set conductive die pad providing space for the integrated circuit connection.
10. The method as claimed in claim 6 wherein forming the down-set conductive die pad comprises forming a window-type down-set conductive die pad providing space for the integrated circuit connection.
11. An integrated circuit package system comprising:
a substrate with a beveled cavity;
a down-set conductive die pad with tapered sidewalls matched with the beveled cavity in the substrate and having the down-set below a lower surface of the substrate; and
an integrated circuit over the down-set conductive die and electrically connected thereto.
12. The system as claimed in claim 11 wherein the down-set conductive die pad comprises:
substrate connectors having lower extents in a plane; and
an exposed surface of the down-set conductive die pad substantially coplanar with the plane of the lower extents of the substrate connectors.
13. The system as claimed in claim 11 wherein the down-set conductive die pad comprises:
substrate connectors having lower extents in a plane; and
an exposed surface of the down-set conductive die pad with an offset above the plane of the lower extents of the substrate connectors.
14. The system as claimed in claim 11 further comprising another integrated circuit package system over the integrated circuit package system.
15. The system as claimed in claim 11 further comprising passive devices on the substrate.
16. The system as claimed in claim 11 wherein:
the down-set die pad with tapered sidewalls is matched in the beveled cavity of the substrate;
the integrated circuit is over the down-set conductive die pad in the beveled cavity of the substrate; and
further comprising:
an encapsulant is over the integrated circuit with a surface of the down-set conductive die pad exposed.
17. The system as claimed in claim 16 further comprising a shield over the integrated circuit for electrical shielding.
18. The system as claimed in claim 16 further comprising a heat sink over the integrated circuit for heat transfer.
19. The system as claimed in claim 16 wherein the down-set conductive die pad comprises a bridge-type down-set conductive die pad providing space for the integrated circuit connection.
20. The system as claimed in claim 16 wherein the down-set conductive die pad comprises a window-type down-set conductive die pad providing space for the integrated circuit connection.