BUMP FOR OVERHANG DEVICE
A semiconductor package system is provided including forming a support platform, mounting a first device over the support platform, forming a bump on the support platform, and mounting a second device on the first device and the bump.
1 . A semiconductor package system comprising:
forming a support platform;
mounting a first device over the support platform;
forming a bump on the support platform; and
mounting a second device on the first device and the bump.
2 . The system as claimed in claim 1 wherein forming the bump includes forming a stud bump, a solder bump, or a stack with one or both with a conductive material.
3 . The system as claimed in claim 1 wherein forming the support platform includes forming a substrate.
4 . The system as claimed in claim 1 further comprising mounting a third device on the second device.
5 . The system as claimed in claim 1 wherein forming the support platform includes:
forming a third device having the bump thereon; and
further comprising:
forming a substrate; and
mounting the third device over the substrate.
6 . A semiconductor package system comprising:
forming a support platform;
mounting a first integrated circuit die over the support platform;
forming a bump on the support platform; and
mounting a second integrated circuit die on the first integrated circuit die and the bump.
7 . The system as claimed in claim 6 wherein forming the support platform includes:
forming a substrate; and
further comprising:
connecting the first integrated circuit die and the substrate;
connecting the second integrated circuit die and the substrate; and
molding the first integrated circuit die, the second integrated circuit die, the bump, and the substrate.
8 . The system as claimed in claim 6 wherein forming the support platform includes:
forming a third integrated circuit die having the bump thereon; and
further comprising:
forming a substrate;
connecting the third integrated circuit die and the substrate;
connecting the first integrated circuit die and the substrate;
connecting the second integrated circuit die and the substrate; and
molding the first integrated circuit die, the second integrated circuit die, the third integrated circuit die, the bump, and the substrate.
9 . The system as claimed in claim 6 wherein:
forming the support platform includes:
forming a substrate having a support pad; and
forming the bump on the support platform further includes:
forming the bump on the support pad.
10 . The system as claimed in claim 6 wherein:
forming the support platform includes:
forming a substrate having a support pad; and
forming the bump on the support platform further includes:
forming the bump on the support pad; and
further comprising:
connecting a voltage reference to the bump.
11 . A semiconductor package system comprising:
a support platform;
a first device over the support platform;
a bump on the support platform; and
a second device on the first device and the bump.
12 . The system as claimed in claim 11 wherein the bump is a stud bump, a solder bump, or a stack with one or both.
13 . The system as claimed in claim 11 wherein the support platform is a substrate.
14 . The system as claimed in claim 11 further comprising a third device on the second device.
15 . The system as claimed in claim 11 wherein the support platform is a third device having the bump thereon and further comprising:
a substrate having the third device thereover.
16 . The system as claimed in claim 11 wherein:
the support platform has a conductive structure;
the first device is a first integrated circuit die over the support platform;
the bump is next to the first device on the support platform; and
the second device is a second integrated circuit die on the first device and the bump.
17 . The system as claimed in claim 16 wherein the support platform is a substrate and further comprising:
an interconnect between the first integrated circuit die and the substrate as well as between the second integrated circuit die and the substrate; and
an encapsulation to cover the first integrated circuit die, the second integrated circuit die, the bump, and the substrate.
18 . The system as claimed in claim 16 wherein the support platform is a third integrated circuit die and further comprising:
a substrate with the third integrated circuit die thereon;
an interconnect between the first integrated circuit die and the substrate as well as between the second integrated circuit die and the substrate; and
an encapsulation to cover the first integrated circuit die, the second integrated circuit die, the third integrated circuit die, the bump, and the substrate.
19 . The system as claimed in claim 16 wherein:
the support platform is a substrate; and
the bump on the support platform is on a support pad of the substrate.
20 . The system as claimed in claim 16 wherein:
the support platform is a substrate; and
the bump on the support platform is on a support pad of the substrate for a connection to a voltage reference.