IP Library Granted Patent US 7,598,782
Granted Patent B2
US 7,598,782 · App. 11/485,348 · Granted Oct 6, 2009

Circuit for changing a frequency

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Quick Facts
Patent No.
US 7,598,782
App. No.
11/485,348
Granted
Oct 6, 2009
Kind
B2
Abstract

A circuit is provided for multiplying a frequency by a cascade formed of a transadmittance having a transfer characteristic and a transimpedance having a transfer characteristic. The transadmittance includes two terminals for a signal of a first frequency and the transimpedance includes two terminals for a signal of a second frequency. A transfer characteristic of the transimpedance is steeper than a transfer characteristic of the transadmittance, and a modulation region of the transadmittance is larger than a modulation region of the transimpedance.

Claims (15)

1. A frequency multiplying circuit for multiplying a first frequency, the circuit comprising: a transadmittance portion having a first transfer characteristic, the transadmittance portion having two input terminals for a signal of said first frequency; and a transimpedance portion having a second transfer characteristic, the transimpedance portion having two output terminals for a signal of a second frequency higher than the first frequency as an output of said multiplying circuit, wherein a transfer characteristic of the transimpedance portion is steeper than a transfer characteristic of the transadmittance portion, and wherein a modulation range of the transadmittance portion is greater than a modulation range of the transimpedance portion.

2. The circuit according to claim 1 , wherein the transadmittance portion has a first symmetrical DC amplifier with a first transistor circuit, a second transistor circuit, and a first constant-current source that is connected to a common emitter terminal of the first transistor circuit and the second transistor circuit.

3. The circuit according to claim 2 , wherein the transimpedance portion has a second symmetrical DC amplifier that has a third transistor circuit and a fourth transistor circuit, wherein the third transistor circuit and the fourth transistor circuit each include at least one transistor, and a resistor connected between the collector and the base of the transistor and said transimpedance portion further including a second constant current source, and wherein the second constant current source is connected to a common emitter terminal of the third and fourth transistor circuits.

4. The circuit according to claim 3 , wherein at least one of the first, second, third or fourth transistor circuits has at least one bipolar transistor.

5. The circuit according to claim 3 , wherein at least one of the first, second, third or fourth transistor circuits has at least one field-effect transistor.

6. The circuit according to claim 3 , wherein first partial currents of the two constant-current sources are collected at a first node that is connected to an operating voltage of the circuit through a first load resistor, second partial currents of the two constant-current sources are collected at a second node that is connected to the operating voltage through a second load resistor, and wherein a first terminal of the transimpedance portion is connected to the first node and a second terminal of the transimpedance portion is connected to a second node.

7. The circuit according to claim 1 , wherein the transadmittance portion and the transimpedance portion are integrated on a chip with a transmit path and a receive path.

8. The circuit according to claim 7 , wherein an electrical connection is formed between the terminals of the transimpedance portion and a transmit path or a receive path.

9. The circuit according to claim 8 , wherein an electrical connection is formed between the terminals of the transadmittance portion and a voltage-controlled oscillator.

10. The circuit according to claim 9 , wherein an output frequency of the voltage-controlled oscillator is two thirds of a transmit frequency, halved for internal signal processing and tripled by the circuit.

11. The circuit according to claim 1 , wherein the transadmittance portion is in series with the transimpedance portion.

12. A frequency multiplying circuit for multiplying a first frequency, the circuit comprising: a transadmittance portion having a voltage-current transfer characteristic, the transadmittance portion having two input terminals for a signal of said first frequency; and a transimpedance portion having a current-voltage transfer characteristic, the transimpedance portion having two output terminals for a signal of a second frequency, which is higher than said first frequency, and which is output from said multiplying circuit, wherein a modulation range of the transadmittance portion is greater than a modulation range of the transimpedance portion.

13. The circuit according to claim 12 , wherein the current-voltage transfer characteristic of the transimpedance portion is steeper than voltage-current transfer characteristic of the transadmittance portion.

14. The circuit according to claim 1 , wherein said transadmittance portion includes two transadmittance output terminals and said transimpedance portion includes two transimpedance input terminals and wherein said two transadmittance output terminals are directly connected to said two transimpedance input terminals.

15. The circuit according to claim 12 wherein said transadmittance portion includes two transadmittance output terminals and said transimpedance portion includes two transimpedance input terminals and wherein said two transadmittance output terminals are directly connected to said two transimpedance input terminals.

Assignments (19)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2011
From: ATMEL AUTOMOTIVE GMBH
To: ATMEL CORPORATION
Reel/Frame 025899/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2009
From: ATMEL GERMANY GMBH
To: ATMEL AUTOMOTIVE GMBH
Reel/Frame 023209/0021 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2006
From: REIMANN, REINHARD
To: ATMEL GERMANY GMBH
Reel/Frame 018090/0355 →