IP Library Granted Patent US 7,915,663
Granted Patent B2
US 7,915,663 · App. 11/493,468 · Granted Mar 29, 2011

Fabrication and method of operation of multi-level memory cell on SOI substrate

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Quick Facts
Patent No.
US 7,915,663
App. No.
11/493,468
Granted
Mar 29, 2011
Kind
B2
Abstract

A semiconductor device includes an insulation layer ( 14 ) provided on a semiconductor substrate ( 12 ), a p-type semiconductor region ( 16 ) provided on the insulation layer, an isolation region ( 18 ) provided that surrounds the p-type semiconductor region to reach the insulation layer, an n-type source region ( 20 ) and an n-type drain region ( 22 ) provided on the p-type semiconductor region, a charge storage region ( 30 ) provided above the p-type semiconductor region between the n-type source region and the n-type drain region, and an voltage applying portion that applies a different voltage to the p-type semiconductor region while any of programming, erasing and reading a different data of a memory cell that has the charge storage region is being preformed.

Claims (70)

1. A semiconductor device comprising:

an insulation layer provided on a semiconductor substrate;

two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;

a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;

an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and

a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region, wherein the charge storage region has a plurality of charge states for a memory cell.

2. The semiconductor device as claimed in claim 1 ,

wherein four or more charge states can be programmed in the charge storage region; and

wherein a voltage applying portion applies a different voltage to the first p-type semiconductor region to program a different charge state.

3. The semiconductor device as claimed in claim 2 , wherein the voltage applying portion applies a first voltage to the first p-type semiconductor region in a first period while a charge is being written into the charge storage region, and applies a second voltage, higher than the first voltage, to the first p-type semiconductor region in a second period while the charge is being written into the charge storage region after the first period.

4. The semiconductor device as claimed in claim 2 wherein the voltage applying portion applies a first voltage to the first p-type semiconductor region in a first period while a charge is being erased from the charge storage region, and applies a second voltage, lower than the first voltage, to the first p-type semiconductor region in a second period while the charge is being erased from the charge storage region after the first period.

5. The semiconductor device as claimed in claim 3 , wherein the voltage applying portion applies an identical voltage in the first period and in the second period to a source, a control gate, and a drain of the memory cell.

6. The semiconductor device as claimed in claim 1 ,

wherein the memory cell is a reference cell; and

wherein a voltage applying portion applies a different voltage to the first p-type semiconductor region to read different data from the reference cell.

7. The semiconductor device as claimed in claim 1 , wherein the trench oxide film includes an oxide silicon region or an n-type semiconductor region.

8. A semiconductor device comprising:

an insulation layer provided on a semiconductor substrate;

a first p-type semiconductor region provided on the insulation layer;

an isolation region that surrounds the first p-type semiconductor region to reach the insulation layer and that includes an oxide silicon region and an n-type semiconductor region, wherein the isolation region isolates the p-type semiconductor region from other p-type semiconductor regions, wherein the isolation region individually surrounds each of the other p-type semiconductor regions and the first p-type semiconductor region, and wherein a portion of the oxide silicon region is in contact with a plurality of individually isolated p-type semiconductor regions;

an n-type drain region provided on the first p-type semiconductor region, wherein the oxide silicon region is provided alongside the drain region;

an n-type source region provided on the first p-type semiconductor region and on the n-type semiconductor region, wherein the n-type semiconductor region is provided alongside the source region;

a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region; and

a voltage applying portion, wherein the voltage applying portion generates and communicates a different voltage to the first p-type semiconductor region while any of programming, erasing and reading a different data of a memory cell that has the charge storage region is being performed.

9. The semiconductor device as claimed in claim 7 , wherein the charge storage region includes a floating gate.

10. The semiconductor device as claimed in claim 7 , wherein the charge storage region includes a trap layer of an ONO film.

11. A wireless communications device, said wireless communications device comprising:

a flash memory comprising:

an insulation layer provided on a semiconductor substrate;

two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;

a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;

an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and

a charge storage region provided above the first p-type semiconductor region between the n-type source region end the n-type drain region, wherein the charge storage region has a plurality of charge states;

a processor;

a communications component;

a transmitter;

a receiver; and

an antenna connected to the transmitter circuit and the receiver circuit.

12. The wireless communications device of claim 11 , wherein said flash memory is NAND flash memory.

13. The wireless communications device of claim 11 , wherein said flash memory is NOR flesh memory.

14. The wireless communications device of claim 11 , wherein said flash memory utilizes mirrorbits technology.

15. A computing device comprising:

a processor;

an input component;

an output component;

a memory comprising:

a volatile memory; and

a flash memory comprising:

an insulation layer provided on a semiconductor substrate;

two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;

a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;

an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and

a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region, wherein the charge storage region has a plurality of charge states.

16. The computing device of claim 15 , wherein said computing device is a personal computer (PC).

17. The computing device of claim 15 , wherein said computing device is a personal digital assistant (PDA).

18. The computing device of claim 15 , wherein said computing device is a gaming system.

19. A portable media player comprising:

a processor;

a cache;

a user input component;

a coder-decoder component; and

a memory comprising:

a flash memory comprising:

an insulation layer provided on a semiconductor substrate;

two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;

a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;

an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and

a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region, wherein the charge storage region has a plurality of charge states.

20. The portable media player of claim 19 , wherein said portable media player is a portable music player.

21. The portable media player of claim 19 , wherein said portable media player is a portable video player.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
RELEASE OF SECURITY INTEREST Recorded Dec 19, 2019
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 051334/0633 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2019
From: CYPRESS SEMICONDUCTOR CORPORATION
To: LONGITUDE FLASH MEMORY SOLUTIONS LIMITED
Reel/Frame 051251/0787 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 2, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036050/0174 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2015
From: BARCLAYS BANK PLC
To: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY LLC
Reel/Frame 035201/0159 →
SECURITY AGREEMENT Recorded Jun 4, 2010
From: SPANSION LLC; SPANSION INC.; SPANSION TECHNOLOGY INC.; SPANSION TECHNOLOGY LLC
To: BARCLAYS BANK PLC
Reel/Frame 024522/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2006
From: HAYAKAWA, YUKIO
To: SPANSION LLC.
Reel/Frame 018293/0994 →