Fabrication and method of operation of multi-level memory cell on SOI substrate
View Patent ↗A semiconductor device includes an insulation layer ( 14 ) provided on a semiconductor substrate ( 12 ), a p-type semiconductor region ( 16 ) provided on the insulation layer, an isolation region ( 18 ) provided that surrounds the p-type semiconductor region to reach the insulation layer, an n-type source region ( 20 ) and an n-type drain region ( 22 ) provided on the p-type semiconductor region, a charge storage region ( 30 ) provided above the p-type semiconductor region between the n-type source region and the n-type drain region, and an voltage applying portion that applies a different voltage to the p-type semiconductor region while any of programming, erasing and reading a different data of a memory cell that has the charge storage region is being preformed.
1. A semiconductor device comprising:
an insulation layer provided on a semiconductor substrate;
two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;
a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;
an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and
a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region, wherein the charge storage region has a plurality of charge states for a memory cell.
2. The semiconductor device as claimed in claim 1 ,
wherein four or more charge states can be programmed in the charge storage region; and
wherein a voltage applying portion applies a different voltage to the first p-type semiconductor region to program a different charge state.
3. The semiconductor device as claimed in claim 2 , wherein the voltage applying portion applies a first voltage to the first p-type semiconductor region in a first period while a charge is being written into the charge storage region, and applies a second voltage, higher than the first voltage, to the first p-type semiconductor region in a second period while the charge is being written into the charge storage region after the first period.
4. The semiconductor device as claimed in claim 2 wherein the voltage applying portion applies a first voltage to the first p-type semiconductor region in a first period while a charge is being erased from the charge storage region, and applies a second voltage, lower than the first voltage, to the first p-type semiconductor region in a second period while the charge is being erased from the charge storage region after the first period.
5. The semiconductor device as claimed in claim 3 , wherein the voltage applying portion applies an identical voltage in the first period and in the second period to a source, a control gate, and a drain of the memory cell.
6. The semiconductor device as claimed in claim 1 ,
wherein the memory cell is a reference cell; and
wherein a voltage applying portion applies a different voltage to the first p-type semiconductor region to read different data from the reference cell.
7. The semiconductor device as claimed in claim 1 , wherein the trench oxide film includes an oxide silicon region or an n-type semiconductor region.
8. A semiconductor device comprising:
an insulation layer provided on a semiconductor substrate;
a first p-type semiconductor region provided on the insulation layer;
an isolation region that surrounds the first p-type semiconductor region to reach the insulation layer and that includes an oxide silicon region and an n-type semiconductor region, wherein the isolation region isolates the p-type semiconductor region from other p-type semiconductor regions, wherein the isolation region individually surrounds each of the other p-type semiconductor regions and the first p-type semiconductor region, and wherein a portion of the oxide silicon region is in contact with a plurality of individually isolated p-type semiconductor regions;
an n-type drain region provided on the first p-type semiconductor region, wherein the oxide silicon region is provided alongside the drain region;
an n-type source region provided on the first p-type semiconductor region and on the n-type semiconductor region, wherein the n-type semiconductor region is provided alongside the source region;
a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region; and
a voltage applying portion, wherein the voltage applying portion generates and communicates a different voltage to the first p-type semiconductor region while any of programming, erasing and reading a different data of a memory cell that has the charge storage region is being performed.
9. The semiconductor device as claimed in claim 7 , wherein the charge storage region includes a floating gate.
10. The semiconductor device as claimed in claim 7 , wherein the charge storage region includes a trap layer of an ONO film.
11. A wireless communications device, said wireless communications device comprising:
a flash memory comprising:
an insulation layer provided on a semiconductor substrate;
two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;
a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;
an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and
a charge storage region provided above the first p-type semiconductor region between the n-type source region end the n-type drain region, wherein the charge storage region has a plurality of charge states;
a processor;
a communications component;
a transmitter;
a receiver; and
an antenna connected to the transmitter circuit and the receiver circuit.
12. The wireless communications device of claim 11 , wherein said flash memory is NAND flash memory.
13. The wireless communications device of claim 11 , wherein said flash memory is NOR flesh memory.
14. The wireless communications device of claim 11 , wherein said flash memory utilizes mirrorbits technology.
15. A computing device comprising:
a processor;
an input component;
an output component;
a memory comprising:
a volatile memory; and
a flash memory comprising:
an insulation layer provided on a semiconductor substrate;
two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;
a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;
an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and
a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region, wherein the charge storage region has a plurality of charge states.
16. The computing device of claim 15 , wherein said computing device is a personal computer (PC).
17. The computing device of claim 15 , wherein said computing device is a personal digital assistant (PDA).
18. The computing device of claim 15 , wherein said computing device is a gaming system.
19. A portable media player comprising:
a processor;
a cache;
a user input component;
a coder-decoder component; and
a memory comprising:
a flash memory comprising:
an insulation layer provided on a semiconductor substrate;
two or more p-type semiconductor regions comprising a first p-type semiconductor region and other p-type semiconductor regions provided on the insulation layer;
a trench oxide film provided that surrounds each of the two or more p-type semiconductor regions to reach the insulation layer, wherein the trench oxide film isolates any two of the two or more p-type semiconductor regions from each other, and wherein the trench oxide film is a single contiguous film;
an n-type source region and an n-type drain region provided on the first p-type semiconductor region; and
a charge storage region provided above the first p-type semiconductor region between the n-type source region and the n-type drain region, wherein the charge storage region has a plurality of charge states.
20. The portable media player of claim 19 , wherein said portable media player is a portable music player.
21. The portable media player of claim 19 , wherein said portable media player is a portable video player.