INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK
An integrated circuit package system is provided including forming a paddle having a depression from a paddle top surface and an external interconnect, forming a lead tip and a lead body of the external interconnect, connecting a device over the paddle top surface and the external interconnect, and filling a substantially electrically nonconductive material in the depression.
1 . An integrated circuit package system comprising:
forming a paddle having a depression from a paddle top surface and an external interconnect;
forming a lead tip and a lead body of the external interconnect;
connecting a device over the paddle top surface and the external interconnect; and
filling a substantially electrically nonconductive material in the depression.
2 . The system as claimed in claim 1 further comprising:
forming a slot in a tie bar connected to the paddle; and
molding an encapsulation through the slot.
3 . The system as claimed in claim 1 further comprising:
forming a recess in the lead body from a lead body top surface; and
molding an encapsulation in the recess.
4 . The system as claimed in claim 1 further comprising:
forming a recess in the lead body from a lead body top surface;
forming a slot in a tie bar connected to the paddle; and
molding an encapsulation through the slot and in the recess.
5 . The system as claimed in claim 1 wherein filling the substantially electrically nonconductive material in the depression includes filling an adhesive in the depression.
6 . An integrated circuit package system comprising:
forming a paddle, having a depression from a paddle top surface, and an external interconnect, with a tie bar attached to the paddle;
forming a lead tip and a lead body of the external interconnect with a lead tip bottom surface above a lead body bottom surface;
connecting an integrated circuit die over the paddle top surface and the external interconnect; and
filling a substantially electrically nonconductive material in the depression.
7 . The system as claimed in claim 6 wherein connecting the integrated circuit die and the external interconnect includes attaching a solder bump between the integrated circuit die and the lead tip.
8 . The system as claimed in claim 6 wherein connecting the integrated circuit die and the external interconnect includes attaching a bond wire between the integrated circuit die and the lead tip.
9 . The system as claimed in claim 6 further comprising:
forming a slot in the tie bar;
forming a hole in the lead tip; and
molding an encapsulation through the slot and the hole.
10 . The system as claimed in claim 6 further comprising:
forming a recess in the lead body from a lead body top surface;
forming a slot in the tie bar;
forming a hole in the lead tip; and
molding an encapsulation through the slot, through the hole, and in the recess.
11 . An integrated circuit package system comprising:
a paddle having a depression from a paddle top surface;
an external interconnect having a lead tip and a lead body;
a device over the paddle top surface;
an internal interconnect between the device and the external interconnect; and
a substantially electrically nonconductive material in the depression.
12 . The system as claimed in claim 11 further comprising a tie bar connected to the paddle has a slot with an encapsulation through the slot.
13 . The system as claimed in claim 11 wherein the lead body has a recess from a lead body top surface with an encapsulation in the recess.
14 . The system as claimed in claim 11 further comprising:
a tie bar connected to the paddle has a slot with an encapsulation through the slot; and wherein:
the lead body has a recess from a lead body top surface with an encapsulation in the recess.
15 . The system as claimed in claim 11 wherein the substantially electrically nonconductive material in the depression is an adhesive.
16 . The system as claimed in claim 11 wherein:
the paddle having the depression from the paddle top surface is connected to a tie bar;
the external interconnect having the lead tip and the lead body has a lead tip bottom surface above a lead body bottom surface;
the device over the paddle top surface is an integrated circuit die;
the internal interconnect between the device and the external interconnect is connected to the lead tip; and
the substantially electrically nonconductive material in the depression is on the paddle top surface.
17 . The system as claimed in claim 16 wherein the internal interconnect is a solder bump.
18 . The system as claimed in claim 16 wherein the internal interconnect is a bond wire.
19 . The system as claimed in claim 16 wherein:
the tie bar has a slot;
the lead tip has a hole; and further comprising:
an encapsulation through the slot and the hole.
20 . The system as claimed in claim 16 wherein:
the lead body has a recess from the lead body top surface;
the tie bar has a slot;
the lead tip has a hole; and further comprising:
an encapsulation in the slot, the hole, and the recess.