Integrated circuit package system with L-shaped leadfingers

1. A method for manufacturing of an integrated circuit package system comprising:

providing a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die;

forming first L-shaped leadfingers adjacent the single edge, the first L-shaped leadfingers having a first upper surface;

connecting the die pads and the first L-shaped leadfingers;

attaching a second integrated circuit die over the first integrated circuit die;

forming second L-shaped leadfingers adjacent the second integrated circuit die, the second L-shaped leadfingers having a second upper surface;

connecting the second integrated circuit die to the second L-shaped leadfingers; and

encapsulating the die pads and the first integrated circuit die and the second integrated circuit die and a portion of the first L-shaped leadfingers and a portion of the second L-shaped leadfingers to form a first package, wherein the encapsulating step exposes the first upper surface and the second upper surface, the second upper surface being greater than the first upper surface.

2. The method as claimed in claim 1 wherein:

the second integrated circuit die includes second die pads only adjacent a single edge of the second integrated circuit die;

attaching the second integrated circuit die over the first integrated circuit die having the die pads of the first integrated circuit die exposed;

forming the second L-shaped leadfingers adjacent the single edge of the second integrated circuit die; and

connecting the second die pads and the second L-shaped leadfingers.

3. The method as claimed in claim 1 wherein:

the second integrated circuit die includes second die pads only adjacent a single edge of the second integrated circuit die;

attaching the second integrated circuit die over the first integrated circuit die with the die pads of the first integrated circuit die exposed;

forming the second L-shaped leadfingers adjacent the single edge of the second integrated circuit die and intermixed with the first L-shaped leadfingers; and

connecting the second die pads and the second L-shaped leadfingers.

4. The method as claimed in claim 1 further comprising:

providing a third integrated circuit die having third die pads only adjacent a single edge of the third integrated circuit die;

forming third L-shaped leadfingers adjacent the single edge of the third integrated circuit die;

connecting the third die pads and the third L-shaped leadfingers;

encapsulating the third die pads and portions of the third L-shaped leadfingers to form a second package; and

stacking the second package over the first package with the third L-shaped leadfingers electrically connected to at least one of the first L-shaped leadfingers and the second L-shaped leadfingers.

5. The method as claimed in claim 4 further comprising:

providing a base substrate; and

electrically connecting at least one of the first L-shaped leadfingers and the second L-shaped leadfingers and the third L-shaped leadfingers to the base substrate.

6. A method for manufacturing of an integrated circuit package system comprising:

forming a first integrated circuit die having die pads on a first die active surface only adjacent a single edge of the first integrated circuit die;

forming a first leadframe having first L-shaped leadfingers adjacent the single edge, the first L-shaped leadfingers having a first upper surface;

electrically connecting the die pads to the first L-shaped leadfingers;

providing a second integrated circuit die;

attaching the second integrated circuit die over the first integrated circuit die;

forming a second leadframe having second L-shaped leadfingers adjacent the second integrated circuit die, the second L-shaped leadfingers having a second upper surface;

electrically connecting the second integrated circuit die to the second L-shaped leadfingers; and

encapsulating a portion of the first integrated circuit die, the die pads, the second integrated circuit die, and portions of the first L-shaped leadfingers and the second L-shaped leadfingers to form a first package, wherein the encapsulating step exposes the first upper surface and the second upper surface, the second upper surface being greater than the first upper surface.

7. The method as claimed in claim 6 wherein:

the second integrated circuit die includes a second die back surface; and

attaching the second die back surface over the first die active surface, the second integrated circuit die having an offset from the first integrated circuit die with the die pads exposed adjacent the second integrated circuit die.

8. The method as claimed in claim 6 wherein:

the second integrated circuit die includes second die pads and a second die active surface; and

attaching the second die active surface over the first die active surface, the second integrated circuit die having an offset from the first integrated circuit die with the second die pads exposed adjacent the first integrated circuit die.

9. The method as claimed in claim 6 wherein:

the second integrated circuit die includes second die pads; and

attaching the second integrated circuit die over the first integrated circuit die having the second die pads on a side opposite the die pads.

10. The method as claimed in claim 6 wherein:

the second integrated circuit die includes second die pads; and

attaching the second integrated circuit die over the first integrated circuit die having the second die pads on the same side as the die pads.

11. An integrated circuit package system comprising:

a first integrated circuit die having die pads only adjacent a single edge of the first integrated circuit die;

first L-shaped leadfingers adjacent the single edge, the first L-shaped leadfingers having a first upper surface and connected to the die pads;

a second integrated circuit die over the first integrated circuit die;

second L-shaped leadfingers adjacent the second integrated circuit die, the second L-shaped leadfingers having a second upper surface and connected to the second integrated circuit die; and

a first package having the die pads, the first integrated circuit, the second integrated circuit, and portions of the first L-shaped leadfingers and the second L-shaped leadfingers encapsulated leaving the first upper surface and the second upper surface exposed, the second upper surface being greater than the first upper surface.

12. The system as claimed in claim 11 wherein:

the second integrated circuit die includes second die pads only adjacent a single edge of the second integrated circuit die, the second integrated circuit die over the first integrated circuit die having the die pads exposed; and

the second L-shaped leadfingers adjacent the single edge of the second integrated circuit die having the second die pad and the second L-shaped leadfingers connected.

13. The system as claimed in claim 11 wherein:

the second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die, the second integrated circuit die over the first integrated circuit die with the die pads exposed; and

the second L-shaped leadfingers adjacent the single edge of the second integrated circuit die and intermixed with the first L-shaped leadfingers, the second die pads and the second L-shaped leadfingers connected.

14. The system as claimed in claim 11 further comprising:

the second integrated circuit die having second die pads only adjacent a single edge of the second integrated circuit die;

the second L-shaped leadfingers adjacent the single edge of the second integrated circuit die having the second die pads and the second L-shaped leadfingers connected; and

a second package stacked over the first package with the first L-shaped leadfingers and the second L-shaped leadfingers electrically connected.

15. The system as claimed in claim 14 further comprising:

a base substrate;

the second package stacked over the first package with at least one of the first L-shaped leadfingers and the second L-shaped leadfingers electrically connected to the base substrate.

16. The system as claimed in claim 11 wherein:

the first integrated circuit die is the first integrated circuit die having the die pads on a first die active surface only adjacent the single edge of the first integrated circuit die;

the first L-shaped leadfingers are part of a leadframe having the first L-shaped leadfingers adjacent the single edge.

17. The system as claimed in claim 16 wherein the second integrated circuit die includes a second die back surface over the first die active surface, the second integrated circuit die having an offset from the first integrated circuit die with the die pads exposed adjacent the second integrated circuit die.

18. The system as claimed in claim 16 wherein the second integrated circuit die includes second die pads and a second die active surface over the first die active surface, the second integrated circuit die having an offset of the first integrated circuit die with the second die pads exposed adjacent the first integrated circuit die.

19. The system as claimed in claim 16 wherein the second integrated circuit die includes second die pads, the second integrated circuit die over the first integrated circuit die having the second die pads on a side opposite the die pads.

20. The system as claimed in claim 16 wherein the second integrated circuit die includes second die pads, the second integrated circuit die over the first integrated circuit die having the second die pads on a same side as the die pads.