Integrated circuit wafer with inter-die metal interconnect lines traversing scribe-line boundaries
View Patent ↗A metal interconnect structure formed over a substrate in an integrated circuit that traverses a scribe-line boundary between a first die and a second die includes at least one metal interconnect line that traverses the scribe-line boundary. A switch is coupled between the at least one metal interconnect line and the substrate, the switch having a control element coupled to a scribe-cut control line. The control line turns the switch on if the two dice are separated into individual dice and turns the switch off if the two dice are to remain physically connected so that the interconnect line may be used to make connections between circuits on the two dice.
1. A method for protecting from contamination a metal line that crosses a scribe boundary on an integrated circuit die having a substrate, the method comprising:
separating the die from adjacent die to create an exposed metal line;
disconnecting the exposed metal line from circuitry formed on the die; and
connecting the exposed metal line to the substrate in the die.
2. The method of claim 1 wherein connecting the exposed metal line to the substrate in the die comprises turning on a transistor coupled between the exposed metal line and the substrate.
3. The method of claim 2 wherein turning on the transistor comprises driving the transistor from a scribe-control circuit disposed on the die.
4. The method of claim 3 wherein driving the transistor from a scribe-control circuit disposed on the die comprises programming the scribe-control circuit to provide a signal to the transistor.
5. The method of claim 4 wherein programming the scribe-control circuit to provide a signal to the transistor comprises programming a programmable element associated with the scribe-control circuit.
6. The method of claim 4 wherein programming the scribe-control circuit to provide a signal to the transistor comprises mask programming the scribe-control circuit.
7. The method of claim 1 wherein disconnecting the metal line from circuitry formed on the die comprises turning off a transistor coupled between the metal line and the circuitry.
8. The method of claim 7 wherein turning off the transistor comprises driving the transistor from a scribe-control circuit disposed on the die.
9. A method for protecting from contamination a die formed on a substrate and having a metal line that crosses a scribe boundary comprising:
providing a scribe-control transistor on the die connected between the metal line and the substrate;
separating the die from adjacent die to create an exposed metal line; and
turning on the scribe-control transistor to connect the exposed metal line to the substrate in the die.
10. The method of claim 9 wherein turning on the scribe-control transistor to connect the exposed metal line to the substrate in the die comprises activating a scribe-control circuit on the die coupled to the scribe-control transistor.
11. The method of claim 9 wherein providing a scribe-control transistor on the die connected between the exposed metal line and the substrate comprises providing an n-channel scribe-control transistor on the die having a source connected to the substrate, a drain connected to the exposed metal line, and a gate.
12. The method of claim 11 further including:
providing a scribe-control circuit on the die coupled to the gate of the n-channel scribe-control transistor; and
activating the scribe-control circuit when the die is to be separated from an adjacent die to which the exposed metal line extends.
13. The method of claim 12 wherein activating the scribe-control circuit comprises programming the scribe-control circuit.
14. The method of claim 13 wherein programming the scribe-control circuit comprises mask programming the scribe-control circuit.
15. The method of claim 13 wherein programming the scribe-control circuit comprises programming a programmable element associated with the scribe-control circuit.