INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

1 . An integrated circuit package system comprising:

forming a perimeter paddle having a first external interconnect extending therefrom;

mounting an integrated circuit die over the perimeter paddle;

connecting a second external interconnect and the integrated circuit die; and

encapsulating the integrated circuit die and the perimeter paddle with the first external interconnect exposed.

2 . The system as claimed in claim 1 further comprising applying an adhesive in a contiguous configuration or a non-contiguous configuration on the perimeter paddle.

3 . The system as claimed in claim 1 further comprising applying a film adhesive on the perimeter paddle.

4 . The system as claimed in claim 1 wherein forming the perimeter paddle includes forming the first external interconnect by partially etching the perimeter paddle.

5 . The system as claimed in claim 1 wherein forming the perimeter paddle includes forming a central opening in the perimeter paddle.

6 . An integrated circuit package system comprising:

forming a perimeter paddle having both a first external interconnect extending therefrom and a central opening;

mounting an integrated circuit die over the perimeter paddle with an adhesive;

connecting a second external interconnect and the integrated circuit die; and

encapsulating the integrated circuit die and the perimeter paddle with the first external interconnect and the second external interconnect exposed.

7 . The system as claimed in claim 6 wherein:

forming the perimeter paddle includes:

forming a tie bar connected with the perimeter paddle; and

connecting the active side further includes:

connecting the tie bar and the integrated circuit die.

8 . The system as claimed in claim 6 wherein forming the perimeter paddle having both the first external interconnect extending therefrom and the central opening includes forming a mold locking feature.

9 . The system as claimed in claim 6 further comprising connecting the first external interconnect to a reference level.

10 . The system as claimed in claim 6 wherein mounting the integrated circuit die includes overhanging the integrated circuit die over the perimeter paddle.

11 . An integrated circuit package system comprising:

a perimeter paddle having a first external interconnect extending therefrom;

an integrated circuit die over the perimeter paddle;

a second external interconnect connected to the integrated circuit die; and

an encapsulation over the integrated circuit die and the perimeter paddle with the first external interconnect exposed.

12 . The system as claimed in claim 11 further comprising an adhesive in a contiguous or a non-contiguous configuration on the perimeter paddle.

13 . The system as claimed in claim 11 further comprising a film adhesive on the perimeter paddle.

14 . The system as claimed in claim 11 wherein the perimeter paddle is partially exposed from the encapsulation.

15 . The system as claimed in claim 11 wherein the perimeter paddle includes a central opening.

16 . The system as claimed in claim 11 wherein:

the perimeter paddle has a central opening; and

further comprising:

an adhesive over the perimeter paddle.

17 . The system as claimed in claim 16 further comprising a tie bar connected with the perimeter paddle, wherein the tie bar is connected with the integrated circuit die.

18 . The system as claimed in claim 16 wherein the perimeter paddle having both the first external interconnect extending therefrom and the central opening is a mold locking feature.

19 . The system as claimed in claim 16 further comprising the first external interconnect connected to a reference level.

20 . The system as claimed in claim 16 wherein the integrated circuit die overhangs the perimeter paddle.