INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE
An integrated circuit package system includes a base substrate having a base substrate cavity, attaching a junction integrated circuit package over the base substrate with a portion of the junction integrated circuit package in the base substrate cavity, and attaching a base integrated circuit over the junction integrated circuit package and the base substrate.
1 . An integrated circuit package system comprising:
providing a base substrate having a base substrate cavity;
attaching a junction integrated circuit package over the base substrate with a portion of the junction integrated circuit package in the base substrate cavity; and
attaching a base integrated circuit over the junction integrated circuit package and the base substrate.
2 . The system as claimed in claim 1 wherein attaching the junction integrated circuit package includes attaching a package to package connection to a junction substrate of the junction integrated circuit package and the base substrate.
3 . The system as claimed in claim 1 further comprising attaching a base connector to the base integrated circuit and the base substrate first surface.
4 . The system as claimed in claim 1 further comprising attaching a base connector to the base integrated circuit and the junction substrate second surface.
5 . The system as claimed in claim 1 further comprising attaching a package connector to the junction substrate second surface and the base substrate first surface.
6 . An integrated circuit package system comprising:
forming a base substrate having a base substrate cavity, a base substrate first surface, and a base substrate second surface;
mounting a junction integrated circuit package having a junction integrated circuit over the base substrate with a portion of the junction integrated circuit in the base substrate cavity; and
mounting a base integrated circuit over the junction integrated circuit package and the base substrate first surface.
7 . The system as claimed in claim 6 wherein mounting the junction integrated circuit package includes mounting the junction integrated circuit package over a base substrate first surface.
8 . The system as claimed in claim 6 wherein mounting the junction integrated circuit package includes mounting the junction integrated circuit package over a base substrate second surface.
9 . The system as claimed in claim 6 wherein mounting the base integrated circuit includes mounting the base integrated circuit over a junction substrate second surface.
10 . The system as claimed in claim 6 wherein mounting the base integrated circuit includes mounting the base integrated circuit over a base substrate first surface.
11 . An integrated circuit package system comprising:
a base substrate having a base substrate cavity;
a junction integrated circuit package over the base substrate with a portion of the junction integrated circuit package in the base substrate cavity; and
a base integrated circuit over the junction integrated circuit package and the base substrate.
12 . The system as claimed in claim 11 wherein the junction integrated circuit package includes a package to package connection to a junction substrate of the junction integrated circuit package and the base substrate.
13 . The system as claimed in claim 11 further comprising a base connector attached to the base integrated circuit and the base substrate first surface.
14 . The system as claimed in claim 11 further comprising a base connector attached to the base integrated circuit and the junction substrate second surface.
15 . The system as claimed in claim 11 further comprising a package connector attached to the junction substrate second surface and the base substrate first surface.
16 . The system as claimed in claim 11 wherein:
the base substrate has the base substrate cavity, a base substrate first surface, and a base substrate second surface;
the junction integrated circuit package has a junction integrated circuit over the base substrate with a portion of the junction integrated circuit in the base substrate cavity; and
the base integrated circuit is over the junction integrated circuit package and the base substrate first surface of the base substrate.
17 . The system as claimed in claim 16 wherein the junction integrated circuit package includes the junction integrated circuit package over a base substrate first surface.
18 . The system as claimed in claim 16 wherein the junction integrated circuit package includes the junction integrated circuit package over a base substrate second surface.
19 . The system as claimed in claim 16 wherein the base integrated circuit includes the base integrated circuit over a junction substrate second surface.
20 . The system as claimed in claim 16 wherein the base integrated circuit includes the base integrated circuit over a base substrate first surface.