IP Library Granted Patent US 7,564,707
Granted Patent B2
US 7,564,707 · App. 11/843,404 · Granted Jul 21, 2009

One-time programmable non-volatile memory

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Quick Facts
Patent No.
US 7,564,707
App. No.
11/843,404
Granted
Jul 21, 2009
Kind
B2
Abstract

An apparatus includes a semiconductor substrate, elongated diffused well regions, and elongated conductors. The semiconductor substrate has a first electrical conductivity type. The elongated diffused well regions are in the semiconductor substrate. The diffused well regions have a second electrical conductivity type opposite the first electrical conductivity type. Each of the elongated electrical conductors crosses the diffused well regions at respective locations of one-time programmable memory cells. Each of the memory cells includes a antifuse structure between the respective diffused well region and the respective electrical conductor. Each of the memory cells has a first state in which the antifuse structure has a first electrical resistance and a second state in which the antifuse structure has a second electrical resistance lower than the first electrical resistance. In the second state, each of the memory cells includes a rectifying junction between the respective diffused well region and the respective electrical conductor.

Claims (16)

1. An apparatus, comprising:

a semiconductor substrate of a first electrical conductivity type;

elongated diffused well regions in the semiconductor substrate, wherein the diffused well regions are of a second electrical conductivity type opposite the first electrical conductivity type; and

elongated electrical conductors each of which crosses the diffused well regions at respective locations of one-time programmable memory cells, wherein each of the memory cells comprises a respective antifuse structure between the respective diffused well region and the respective electrical conductor, each of the memory cells has a first state in which the antifuse structure has a first electrical resistance and a second state in which the antifuse structure has a second electrical resistance lower than the first electrical resistance, and in the second state each of the memory cells comprises a respective rectifying junction between the respective diffused well region and the respective electrical conductor.

2. The apparatus of claim 1 , wherein the diffused well regions are arranged in parallel columns and the electrical conductors are arranged in parallel rows that are orthogonal to the diffused well regions.

3. The apparatus of claim 1 , wherein each of the memory cells comprises a respective first diffusion region of the first electrical conductivity type at a respective location in the respective elongated diffused well region that is self-aligned with respect to a first side of the respective electrical conductor.

4. The apparatus of claim 3 , wherein each of the memory cells comprises a respective second diffusion region of the first electrical conductivity type at a respective location in the respective diffused well region that is self-aligned with respect to a second side of the respective electrical conductor opposite the first side.

5. The apparatus of claim 4 , wherein in each of the memory cells the respective antifuse structure separates the respective electrical conductor from the respective first and second diffusion regions.

6. The apparatus of claim 4 , wherein in each of the memory cells the respective first and second diffusion regions are unconnected to any electrical biasing lines other than the respective diffused well region and the respective electrical conductor.

7. The apparatus of claim 1 , wherein each of the memory cells is free of any electrical biasing lines other than the respective diffused well region and the respective electrical conductor.

8. The apparatus of claim 1 , wherein each of the memory cells is free of any transistors.

9. The apparatus of claim 1 , wherein each of the electrical conductors comprises a respective metal layer.

10. The apparatus of claim 1 , wherein each of the electrical conductors comprises a respective polycrystalline silicon layer of the first electrical conductivity type.

11. The apparatus of claim 1 , wherein each of the antifuse structures comprises a dielectric layer.

12. The apparatus of claim 1 , further comprising a state sense circuit operable to sense the respective state of each of the memory cells based on current flow along an electrical path comprising the respective electrical conductor, the respective antifuse structure, and the respective diffused well region.

13. The apparatus of claim 1 , wherein each of the electrical conductors crosses each of the diffused well regions at respective locations of two or more of the memory cells.

Assignments (18)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
CORRECTIVE ASSIGNMENT TO CORRECT THE SERIAL NUMBER: 11538833 TO 11494874 PATENT NUMBER: 7548080 TO 7548040 PREVIOUSLY RECORDED ON REEL 024563 FRAME 0861. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF LETTERS PATENT EXHIBIT A MERGER AGREEMENT SCHEDULE 2.17.5. Recorded Jun 29, 2010
From: ZEROG WIRELESS, INC.; AZ1 ACQUISITION CORPORATION
To: MICROCHIP TECHNOLOGY INC.
Reel/Frame 024599/0933 →
MERGER Recorded Jun 22, 2010
From: ZEROG WIRELESS, INC.; AZ1 ACQUISITION CORPORATION
To: MICROCHIP TECHNOLOGY INC.
Reel/Frame 024563/0861 →
SECURITY AGREEMENT Recorded Mar 14, 2008
From: ZEROG WIRELESS, INC.
To: SILICON VALLEY BANK
Reel/Frame 020656/0408 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2007
From: KLEVELAND, BENDIK
To: ZEROG WIRELESS, INC.
Reel/Frame 019736/0275 →