IP Library Granted Patent US 7,573,746
Granted Patent B1
US 7,573,746 · App. 11/861,504 · Granted Aug 11, 2009

Volatile data storage in a non-volatile memory cell array

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,573,746
App. No.
11/861,504
Granted
Aug 11, 2009
Kind
B1
Abstract

A method for storing data on nodes in memory cells of a non-volatile memory cell array including steps of setting non-volatile devices of the non-volatile memory cell array to a desired state, biasing pull-up devices and non-volatile devices in a first set of rows of the non-volatile memory cell array to an off state, loading data onto column lines of the non-volatile memory cell array and biasing non-volatile devices in a second set of rows in the memory cells of the non-volatile memory cell array to store data from the column lines on the nodes in the memory cells of the non-volatile memory cell array.

Claims (62)

1. An integrated circuit device capable of storing volatile data on common nodes in memory cells of a non-volatile memory cell array comprising:

a non-volatile memory cell array comprising:

column lines;

row lines; and

a plurality of memory cells arranged in rows and columns and coupled to the row lines and the column lines, each memory cell comprising a non-volatile device and a pull-up device connected at a common node;

a means for setting the non-volatile devices of each of the memory cells to a desired state;

a means for loading volatile data onto column lines of the non-volatile memory cell array;

a means for biasing non-volatile devices in the memory cells of the non-volatile memory cell array to store volatile data from said column lines on the common nodes in the memory cells of the non-volatile memory cell array; and

a means for biasing pull-up devices and non-volatile devices in a first set of rows of the non-volatile memory cell array to an off state;

wherein said means for biasing non-volatile devices in the memory cells of the non-volatile memory cell array is directed towards a second set of rows of the non-volatile memory cell array.

2. The integrated circuit device in claim 1 wherein:

said means for setting non-volatile devices of the non-volatile memory cell array to a desired state comprises a means for erasing each of said non-volatile devices in the non-volatile memory cell array.

3. The integrated circuit device in claim 1 further comprising:

a means for testing for the common nodes in the memory cells of the non-volatile memory cell array that cannot store charge as desired.

4. The integrated circuit device in claim 3 further comprising:

a means for storing the location of a row having a common node that cannot store charge as desired as determined in said testing step.

5. The integrated circuit device in claim 1 wherein:

said means for setting comprises a means for erasing each of said non-volatile devices in the non-volatile memory cell array.

6. The integrated circuit device in claim 1 further comprising:

a means for refreshing said volatile data from said column lines stored on the common nodes in the memory cells of the non-volatile memory cell array as desired.

7. The integrated circuit device in claim 3 further comprising:

a means for storing the location of a row having a common node that cannot store charge as desired as determined in said testing step.

8. An integrated circuit device capable of storing volatile data on common nodes in memory cells of a non-volatile memory cell array comprising:

a non-volatile memory cell array comprising:

column lines;

row lines; and

a plurality of memory cells arranged in rows and columns and coupled to the row lines and the column lines, each memory cell comprising a non-volatile device and a pull-up device connected at a common node;

a means for setting non-volatile devices of the non-volatile memory cell array to a desired state;

a means for loading volatile data onto column lines of the non-volatile memory cell array;

a means for biasing pull-up devices and non-volatile devices in the memory cells of the non-volatile memory cell array to store volatile data from said column lines on the common nodes in the memory cells of the non-volatile memory cell array; and

a means for biasing pull-up devices and non-volatile devices in a first set of rows of the non-volatile memory cell array to an off state; and

wherein said means for biasing pull-up devices and non-volatile devices in the memory cells of the non-volatile memory cell array is directed towards a second set of rows of the non-volatile memory cell array.

9. The integrated circuit device in claim 8 wherein:

said means for setting comprises a means for erasing each of said non-volatile devices in the non-volatile memory cell array.

10. The integrated circuit device in claim 8 further comprising:

a means for testing for the common nodes in the memory cells of the non-volatile memory cell array that cannot store charge as desired.

11. The integrated circuit device in claim 10 further comprising:

a means for storing a location of a row having a common node that cannot store charge as desired as determined in said means for testing.

12. The integrated circuit device in claim 8 further comprising:

a means for refreshing said volatile data from said column lines stored on the common nodes in the memory cells of the non-volatile memory cell array as desired.

13. An integrated circuit device capable of storing volatile data on common nodes in memory cells of a non-volatile memory cell array comprising:

a non-volatile memory cell array comprising:

column lines;

row lines; and

a plurality of memory cells arranged in rows and columns and coupled to the row lines and the column lines, each memory cell comprising a non-volatile device and a pull-up device connected at a common node;

a means for setting non-volatile devices of the non-volatile memory cell array to a desired state;

a means for loading volatile data onto column lines of the non-volatile memory cell array; and

a means for biasing pull-up devices in the memory cells of the non-volatile memory cell array to store volatile data from said column lines on the common nodes in the memory cells of the non-volatile memory cell array and;

a means for biasing pull-up devices and non-volatile devices in a first set of rows of the non-volatile memory cell array to an off state;

wherein said means for biasing pull-up devices in the memory cells of the non-volatile memory cell array is directed towards a second set of rows of the non-volatile memory cell array.

14. The integrated circuit device in claim 13 wherein:

said column lines are a single global column line.

15. The integrated circuit device in claim 13 wherein:

said means for setting comprises a means for erasing each of said non-volatile devices in the non-volatile memory cell array.

16. The integrated circuit device in claim 13 further comprising:

a means for testing for common nodes in the memory cells of the non-volatile memory cell array that cannot store charge as desired.

17. The integrated circuit device in claim 16 further comprising:

a means for storing a location of a row having a common node that cannot store charge as desired as determined in said means for testing.

18. The integrated circuit device in claim 13 further comprising:

a means for refreshing said volatile data from said column lines stored on the common nodes in the memory cells of the non-volatile memory cell array as desired.

19. The integrated circuit device in claim 13 wherein:

said column lines are a single global column line.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0572 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →