Integrated circuit package system with mold lock subassembly
View Patent ↗An integrated circuit package system includes: providing a substrate; attaching an integrated circuit over the substrate; attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and forming a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation.
1. An integrated circuit package system comprising:
providing a substrate;
attaching an integrated circuit over the substrate;
attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and
forming a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation.
2. The system as claimed in claim 1 wherein attaching the integrated circuit subassembly system includes attaching a subsystem integrated circuit.
3. The system as claimed in claim 1 wherein attaching the integrated circuit subassembly system includes attaching the perforated interposer over the integrated circuit.
4. The system as claimed in claim 1 wherein attaching the integrated circuit includes attaching a wire bond integrated circuit.
5. The system as claimed in claim 1 wherein attaching the integrated circuit includes attaching a flip chip.
6. An integrated circuit package system comprising:
providing a package substrate;
attaching a first integrated circuit over the package substrate with a first adhesive;
attaching an integrated circuit subassembly system having a perforated interposer, a subassembly integrated circuit, and a carrier over the package substrate with the perforated interposer having a slot; and
forming a package encapsulation over the carrier, the subassembly integrated circuit, the perforated interposer, the first integrated circuit, and the package substrate with the slot filled with the package encapsulation.
7. The system as claimed in claim 6 wherein attaching the integrated circuit subassembly system includes attaching the carrier over the first integrated circuit.
8. The system as claimed in claim 6 further comprising attaching a component device to the carrier.
9. The system as claimed in claim 6 wherein attaching the integrated circuit subassembly system includes attaching a mounting integrated circuit device over the integrated circuit subassembly system.
10. The system as claimed in claim 6 further comprising attaching a mounting integrated circuit device adjacent the package encapsulation over the integrated circuit subassembly system.
11. An integrated circuit package system comprising:
a substrate;
an integrated circuit over the substrate;
an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and
a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation.
12. The system as claimed in claim 11 wherein the integrated circuit subassembly system includes a subsystem integrated circuit.
13. The system as claimed in claim 11 wherein the integrated circuit subassembly system includes the perforated interposer over the integrated circuit.
14. The system as claimed in claim 11 wherein the integrated circuit is a wire bond integrated circuit.
15. The system as claimed in claim 11 wherein the integrated circuit is a flip chip.
16. The system as claimed in claim 11 wherein:
the substrate is a package substrate;
the integrated circuit is a first integrated circuit over the package substrate with a first adhesive;
the integrated circuit subassembly system is an integrated circuit subassembly system having a perforated interposer, a subassembly integrated circuit, and a carrier over the substrate; and
the package encapsulation is over the carrier, the subassembly integrated circuit, the perforated interposer, the first integrated circuit, and the package substrate.
17. The system as claimed in claim 16 wherein the integrated circuit subassembly system includes the carrier over the first integrated circuit.
18. The system as claimed in claim 16 wherein the integrated circuit subassembly system includes a component device over the carrier.
19. The system as claimed in claim 16 wherein the integrated circuit subassembly system includes a mounting integrated circuit device over the integrated circuit subassembly system.
20. The system as claimed in claim 16 further comprising a mounting integrated circuit device adjacent the package encapsulation over the integrated circuit subassembly system.