Mountable integrated circuit package system with substrate having a conductor-free recess

1. A mountable integrated circuit package system comprising:

providing a carrier;

mounting a first integrated circuit device over the carrier;

mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess extending to a lateral edge of the substrate;

connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and

forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate.

2. The system as claimed in claim 1 wherein mounting the substrate having the conductor-free recess includes mounting the substrate with the conductor-free recess not to a lateral edge of the substrate.

3. The system as claimed in claim 1 further comprising forming a spacer between the substrate and the first integrated circuit device.

4. The system as claimed in claim 1 further comprising mounting a second integrated circuit device over the substrate.

5. A mountable integrated circuit package system comprising:

providing a carrier, the carrier having a first carrier side and a second carrier side opposing the first carrier side;

mounting a first integrated circuit device over the first carrier side, with a non-active side of the first integrated circuit device facing the first carrier side;

mounting a substrate over the first integrated circuit device, the substrate having a first substrate side and a second substrate side opposing the first substrate side, the second substrate side having a conductor-free recess extending to a lateral edge of the substrate

connecting a first electrical interconnect under the conductor-free recess for connecting the carrier and an active side of the first integrated circuit device; and

forming a package encapsulation over the first carrier side, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the first substrate side.

6. The system as claimed in claim 5 wherein forming the package encapsulation includes exposing a first external interconnect of the substrate.

7. The system as claimed in claim 5 further comprising attaching a second external interconnect to the second carrier side.

8. The system as claimed in claim 5 further comprising connecting a second electrical interconnect between the carrier and the substrate.

9. The system as claimed in claim 5 wherein forming the package encapsulation includes:

exposing a first external interconnect on the first substrate side; and

further comprising:

mounting a second integrated circuit device over the first external interconnect.

10. A mountable integrated circuit package system comprising:

a carrier;

a first integrated circuit device mounted over the carrier;

a substrate mounted over the first integrated circuit device with the substrate having a conductor-free recess extending to a lateral edge of the substrate

a first electrical interconnect under the conductor-free recess connecting the carrier and the first integrated circuit device; and

a package encapsulation formed over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate.

11. The system as claimed in claim 10 wherein the conductor-free recess extends not to a lateral edge of the substrate.

12. The system as claimed in claim 10 further including a spacer between the substrate and an active side of the first integrated circuit device.

13. The system as claimed in claim 10 further comprising a second integrated circuit device mounted over the substrate.

14. The system as claimed in claim 10 wherein the substrate further includes a first substrate side and a second substrate side opposing the first substrate side, with the conductor-free recess formed on the second substrate side facing an active side of the first integrated circuit device.

15. The system as claimed in claim 14 wherein the package encapsulation exposes a first external interconnect on the first substrate side.

16. The system as claimed in claim 14 further comprising a second external interconnect attached to a second carrier side of the carrier opposing a first carrier side of the carrier.

17. The system as claimed in claim 14 further comprising a second electrical interconnect between the carrier and the substrate.

18. The system as claimed in claim 14 wherein the package encapsulation includes:

a first external interconnect exposed on the first substrate side; and

a second integrated circuit device mounted over the first external interconnect.