IP Library Granted Patent US 7,521,960
Granted Patent B2
US 7,521,960 · App. 11/932,901 · Granted Apr 21, 2009

Integrated circuit including programmable logic and external-device chip-enable override control

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Quick Facts
Patent No.
US 7,521,960
App. No.
11/932,901
Granted
Apr 21, 2009
Kind
B2
Abstract

An integrated circuit device includes a programmable logic block, a monitoring input, a condition-sensing circuit coupled to the monitoring input and configured to generate a condition-sensed signal at an output in response to sensing a condition at the monitoring input, a first digital input, a first digital output, and a gating circuit configured in the programmable logic block and coupled between the first digital input and the first digital output. The gating circuit has a gating input coupled to the condition-sensing circuit and generates an output. The output is related to an input state of the first digital input in the absence of the condition-sensed signal and assumes an override state in the presence of the condition-sensed signal.

Claims (39)

1. A method for using a programmable system-on-a-chip including digital and analog circuits to send signals to off-chip integrated circuits in an electronic system comprising:

performing a power-up sequence in the system-on-a-chip including:

sensing that power supply voltage is ramping up;

determining that a band-gap circuit in the system-on-a-chip is outputting correct reference voltage;

determining that a first voltage regulator circuit in the system-on-a-chip is outputting correct reference voltage;

determining that an FPGA circuit in the system-on-a-chip is functioning;

determining that a non-volatile memory circuit in the system-on-a-chip is functioning;

determining that a second voltage regulator circuit in the system-on-a-chip is outputting correct reference voltage;

determining that a reference voltage to an analog-to-digital converter circuit in the system-on-a-chip is outputting correct reference voltage;

calibrating the analog-to-digital converter circuit;

initializing and configuring a state machine in the system-on-a-chip; and

monitoring at least one condition of the electronic system.

2. The method of claim 1 wherein determining that the FPGA circuit in the system-on-a-chip is functioning comprises:

determining that the FPGA circuit has become active; and

outputting a signal indicating that the FPGA circuit has become active.

3. The method of claim 1 wherein determining that the non-volatile memory circuit in the system-on-a-chip is functioning comprises:

determining that the non-volatile memory circuit has become active; and

outputting a signal indicating that the non-volatile memory circuit has become active.

4. The method of claim 1 wherein monitoring at least one condition of the electronic system comprises:

sampling a condition of the electronic system to create a condition value;

converting the condition value to a digital condition value;

comparing the digital condition value to a predetermined threshold; and

sending a signal to at least one off-chip integrated circuit if the digital condition value exceeds the predetermined threshold.

5. The method of claim 4 wherein sampling a condition of the electronic system to create a condition value comprises:

sampling a voltage powering a circuit external to the system-on-a-chip;

creating a first condition value if the voltage is within a predetermined specification;

creating a second condition value if the voltage is not within the predetermined specification;

enabling a drive signal to the circuit external to the system-on-a-chip in response to the first condition value; and

disabling the drive signal to the circuit external to the system-on-a-chip in response to the second condition value.

6. The method of claim 5 further comprising:

continuing to sample the voltage powering the circuit external to the system-on-a-chip after disabling the drive signal to the circuit external to the system-on-a-chip in response to the second condition value;

enabling the drive signal to the circuit external to the system-on-a-chip in response to recurrence of the first condition value.

7. The method of claim 6 wherein enabling the drive signal to the circuit external to the system-on-a-chip in response to recurrence of the first condition value comprises enabling the drive signal only after the first condition value has recurred for a predetermined time.

8. The method of claim 5 wherein:

sampling a voltage powering a circuit external to the system-on-a-chip comprises sampling a voltage supplied to an external MOSFET;

enabling a drive signal to the circuit external to the system-on-a-chip in response to the first condition value comprises supplying a voltage to the gate of the external MOSFET sufficient to turn it on; and

disabling the drive signal to the circuit external to the system-on-a-chip in response to the second condition value comprises supplying a voltage to the gate of the external MOSFET sufficient to turn it off.

9. The method of claim 5 further including disabling the drive signal to the circuit external to the system-on-a-chip in response to an external reset signal applied to the system-on-a-chip.

10. The method of claim 9 further including providing a reset-out signal from the system-on-a-chip in response to the external reset signal applied to the system-on-a-chip.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0572 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →