Integrated circuit package system with leads having multiple sides exposed

1. A method of manufacture of an integrated circuit package system comprising:

forming an integrated circuit stack having a bottom non-active side and a top non-active side of a die;

connecting an internal interconnect between a lead, having a top side and a bottom side, and the integrated circuit stack; and

forming an unitary encapsulation, having both a non-elevated portion and an elevated portion, around the integrated circuit stack and the internal interconnect with the top side exposed at the non-elevated portion, and with the bottom side, the bottom non-active side, and the top non-active side exposed.

2. The method as claimed in claim 1 wherein forming the encapsulation includes covering a side of a protrusion of the lead with the protrusion including the top side.

3. The method as claimed in claim 1 wherein forming the encapsulation includes forming the elevated portion of the encapsulation above the top side of the lead.

4. The method as claimed in claim 1 wherein forming the integrated circuit stack includes forming the integrated circuit stack having integrated circuit dice in an offset configuration.

5. The method as claimed in claim 1 further comprising:

mounting a further integrated circuit package system over the elevated portion of the encapsulation;

connecting a package interconnect between a carrier and the lead with the package interconnect in a clearance formed by the elevated portion; and

forming a package encapsulation over the further integrated circuit package system, the package interconnect, and the carrier.

6. A method of manufacture of an integrated circuit package system comprising:

forming an integrated circuit stack, having a bottom non-active side and a top non-active side of a die, with integrated circuit dice in an offset configuration;

connecting an internal interconnect between a lead, having a top side and a bottom side, and the integrated circuit stack; and

forming an encapsulation around the integrated circuit stack and the internal interconnect including:

forming the encapsulation having both an non-elevated portion and an elevated portion,

exposing the top side exposed at the non-elevated portion,

exposing the top non-active side at the elevated portion, and

exposing the bottom side and the bottom non-active side from a bottom surface of the encapsulation.

7. The method as claimed in claim 6 wherein exposing the bottom side and the bottom non-active side at the bottom surface of the encapsulation includes attaching the internal interconnect in a clearance in the offset configuration in the integrated circuit stack.

8. The method as claimed in claim 6 wherein exposing the bottom side and the bottom non-active side at the bottom surface of the encapsulation includes forming the bottom surface coplanar with the bottom side.

9. The method as claimed in claim 6 wherein forming the encapsulation having the elevated portion includes forming the elevated portion above the top side.

10. The method as claimed in claim 6 wherein exposing the top non-active side includes exposing the top non-active side from a top surface of the encapsulation.

11. An integrated circuit package system comprising:

an integrated circuit stack having a bottom non-active side and a top non-active side of a die;

a lead, having a top side and a bottom side, adjacent to the integrated circuit stack;

an internal interconnect between the lead and the integrated circuit stack; and

an encapsulation, having both a non-elevated portion and an elevated portion, around the integrated circuit stack and the internal interconnect with the top side exposed at the non-elevated portion, and with the bottom side, the bottom non-active side, and the top non-active side exposed.

12. The system as claimed in claim 11 wherein the lead includes a protrusion having the top side.

13. The system as claimed in claim 11 wherein the elevated portion of the encapsulation is above the top side of the lead.

14. The system as claimed in claim 11 wherein the integrated circuit stack includes integrated circuit dice in an offset configuration.

15. The system as claimed in claim 11 further comprising:

a carrier;

a further integrated circuit package system over the elevated portion of the encapsulation and the carrier;

a package interconnect between the carrier and the lead with the package interconnect in a clearance formed by the elevated portion; and

a package encapsulation over the further integrated circuit package system, the package interconnect, and the carrier.

16. The system as claimed in claim 11 wherein:

the integrated circuit stack includes integrated circuit dice in an offset configuration;

the top non-active side of the integrated circuit stack is exposed from the elevated portion, and

the bottom side and the bottom non-active side are exposed from a bottom surface of the encapsulation.

17. The system as claimed in claim 16 wherein the internal interconnect is in a clearance in the offset configuration in the integrated circuit stack.

18. The system as claimed in claim 16 wherein the bottom surface of the encapsulation is coplanar with the bottom side.

19. The system as claimed in claim 16 wherein the elevated portion of the encapsulation is above the top side.

20. The system as claimed in claim 16 wherein the top non-active side of the integrated circuit stack is exposed from a top surface of the encapsulation.