Method for redirecting void diffusion away from vias in an integrated circuit design
View Patent ↗A method for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design, and reducing tensile stress in the electrical conductor to divert void diffusion away from the via.
1. A method for redirecting void diffusion away from vias in an integrated circuit design, the method comprising steps of:
(a) forming an electrical conductor in a first electrically conductive layer of an integrated circuit design;
(b) forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design; and
(c) reducing tensile stress in the electrical conductor to divert void diffusion away from the via.
2. The method of claim 1 wherein step (c) comprises increasing an area of the via.
3. The method of claim 1 wherein step (c) comprises adding an electrically conductive area to the electrical conductor.
4. The method of claim 1 wherein step (c) comprises extending the electrical conductor a distance away from the via in at least one of the first electrically conductive layer and the second electrically conductive layer of the integrated circuit design.
5. The method of claim 4 wherein the electrical conductor is extended by a length calculated from a function of an area of a block connected to a proximal end of the electrical conductor, a width of the electrical conductor, and a distance between the via and the block in the integrated circuit design.
6. The method of claim 1 wherein step (c) comprises forming at least one of an end overlap and a side overlap of the electrical conductor over the via.
7. The method of claim 6 wherein the end overlap extends about 0.055 microns from the via.
8. The method of claim 6 wherein the side overlap extends about 0.001 microns from the via.
9. The method of claim 5 wherein the area of at least one of the end overlap and the side overlap is determined from a layout of the first electrically conductive layer and the second electrically conductive layer of the integrated circuit design.
10. The method of claim 1 further comprising placing the via at a proximal end of the electrical conductor adjacent to a block connected to the electrical conductor.
11. The method of claim 1 wherein step (c) comprises removing a portion of a dielectric layer adjacent to the electrical conductor.