Integrated circuit package system with support structure under wire-in-film adhesive
View Patent ↗An integrated circuit package in package system including: providing a substrate; mounting a wire bonded die with an active side over the substrate; connecting the active side to the substrate with bond wires; mounting a structure over the wire bonded die having a wire-in-film adhesive between the structure and the wire bonded die and overhangs at ends of the structure between the wire-in-film adhesive and the substrate; mounting support structures at the overhangs between the wire-in-film adhesive and the substrate; and encapsulating the wire bonded die and the structure with an encapsulation.
1. A method of manufacturing an integrated circuit package in package system comprising:
providing a substrate;
mounting a wire bonded die with an active side over the substrate;
connecting the active side to the substrate with bond wires;
mounting support structures having substantially curved sides on the substrate;
mounting a structure, having overhangs at ends of the structure over the substrate, over the wire bonded die having a wire-in-film adhesive of a thermally conductive dielectric material in contact with and between the structure and the wire bonded die with the support structures in contact with and between the wire-in-film adhesive and the substrate; and
encapsulating the wire bonded die and the structure with an encapsulation.
2. The method as claimed in claim 1 wherein:
mounting the structure includes mounting an inner stacking module.
3. The method as claimed in claim 1 wherein:
mounting the structure includes mounting an upper wire bonded die.
4. The method as claimed in claim 1 wherein:
mounting the structure includes mounting an interposer.
5. The method as claimed in claim 1 wherein:
mounting the structure includes mounting a pre-molded package.
6. A method of manufacturing an integrated circuit package in package system comprising:
providing a substrate with a component mounted thereover;
mounting a wire bonded die with an active side over the component;
connecting the active side to the substrate with bond wires;
mounting support structures having substantially curved sides on the substrate;
mounting a structure, having corners and overhangs at ends of the structure over the substrate, over the wire bonded die having a wire-in-film adhesive of a thermally conductive dielectric in contact with and between the structure and the wire bonded die with the support structures in contact with and between the wire-in-film adhesive and the substrate; and
encapsulating the wire bonded die and the structure with an encapsulation.
7. The method as claimed in claim 6 wherein:
mounting the component includes mounting a bottom pre-molded package.
8. The method as claimed in claim 6 wherein:
mounting the component includes mounting a bottom wire bonded die.
9. The method as claimed in claim 6 wherein:
mounting the component includes mounting a flip chip.
10. The method as claimed in claim 6 wherein:
mounting the support structures includes mounting the support structures at the corners of the structure.
11. An integrated circuit package in package system comprising:
a substrate;
a wire bonded die with an active side mounted over the substrate having the active side connected to the substrate with bond wires;
support structures having substantially curved sides on the substrate;
a structure, having overhangs at ends of the structure. mounted over the wire bonded die having a wire-in-film adhesive of a thermally conductive dielectric in contact with and between the structure and the wire bonded die with the support structures in contact with and between the wire-in-film adhesive and the substrate; and
an encapsulation encapsulating the wire bonded die and the structure.
12. The system as claimed in claim 11 wherein:
the structure is an inner stacking module.
13. The system as claimed in claim 11 wherein:
the structure is an upper wire bonded die.
14. The system as claimed in claim 11 wherein:
the structure is an interposer.
15. The system as claimed in claim 11 wherein:
the structure is a pre-molded package.
16. The system as claimed in claim 11 further comprising:
a component mounted over the substrate and under the wire bonded die; and
wherein:
the structure has corners.
17. The system as claimed in claim 16 wherein:
the component is a bottom pre-molded package.
18. The system as claimed in claim 16 wherein:
the component is a bottom wire bonded die.
19. The system as claimed in claim 16 wherein:
the component is a flip chip.
20. The system as claimed in claim 16 wherein:
the support structures are mounted at the corners of the structure.