Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package
View Patent ↗A single metal layer tape substrate includes a patterned metal layer affixed to a patterned dielectric layer. The dielectric layer is patterned to provide openings exposing lands and bond sites on bond fingers on the land side of the metal layer. The metal layer is patterned to provide circuit traces as appropriate for interconnection with the die and with other elements. Interconnection with a die is made by wire bonding to exposed traces on a die attach side of the metal layer, and bond fingers and lands for access to testing the package are provided on the land side of the metal layer.
1. A single metal layer semiconductor package comprising:
a die;
a patterned metal layer having a land side and a die attach side opposite the land side, the patterned metal layer comprising circuit traces for interconnection with the die on the die attach side; and
a patterned dielectric layer affixed to the land side of the patterned metal layer and having openings exposing bond sites on bond fingers on the land side, the openings extend as a window across two or more of the bond fingers, the patterned dielectric layer having additional openings exposing test sites on the patterned metal layer, separate from the die, corresponding to each of the bond fingers, the additional openings adjacent to the window.
2. The package of claim 1 further comprising an encapsulation encapsulating the die on the die attach side of the patterned metal layer.
3. The package of claim 1 wherein the patterned dielectric layer has the additional openings additionally exposing the test sites on the bond fingers on the land side of the patterned metal layer, the test sites arranged in a staggered array.
4. The package of claim 1 wherein the openings of the patterned dielectric layer exposing the bond sites on the bond fingers on the land side of the metal layer are on the periphery of the metal layer.
5. The package of claim 1 wherein the patterned dielectric layer has a slot exposing a plurality of the bond fingers.
6. The package of claim 1 wherein the die is in a land grid array package.
7. The package of claim 1 further comprising a land grid array package mounted over the die.
8. The package of claim 1 further having solder balls attached to the bond sites through the openings to form a ball grid array package.
9. The package of claim 1 further comprising:
a second die;
a second patterned metal layer having a land side and a die attach side opposite the land side, the second patterned metal layer comprising circuit traces for interconnection with the second die on the die attach side;
a second patterned dielectric layer affixed to the land side of the second patterned metal layer and having openings exposing bond sites on lands on the land side of the second patterned metal layer; and
interconnects connecting the patterned metal layer and the second patterned metal layer.
10. A multipackage module comprising a land grid array package of claim 1 stacked over a ball grid array package comprising a die mounted on a ball grid array package substrate, wherein z-interconnection of the land grid array package and the ball grid array package comprises wire bonds each connecting a site on the patterned metal layer with a site on the ball grid array package.
11. The multipackage module of claim 10 wherein the ball grid array package is a single metal layer ball grid array package.
12. The multipackage module of claim 10 wherein the land grid array package is inverted with respect to the ball grid array package, and the z-interconnection is made by wire bonds leading from the exposed wire bond sites on the land side of the land grid array package.
13. A method for making a single metal layer substrate package comprising:
providing a substrate dielectric layer, patterned to provide openings for bond finger sites and to provide additional openings for test sites, and the dielectric layer having a vertical exterior edge;
affixing a metal layer onto a surface of the dielectric layer;
patterning the metal layer to form bond sites on bond fingers over the openings and to form test sites over the additional openings, the test sites corresponding to each of the bond fingers, the openings extending as a window across two or more of the bond fingers, and the additional openings adjacent to the window; and
attaching a die to the metal layer and separate from the test sites.
14. The method of claim 13 wherein the dielectric layer comprises a polymer material.
15. The method of claim 13 wherein the metal layer comprises a metal foil.
16. The method of claim 13 wherein affixing the metal layer to the surface of the dielectric layer comprises using chromium as an affixative.
17. The method of claim 13 wherein affixing the metal layer to the surface of the dielectric layer comprises using an adhesive as an affixative.
18. The method of claim 13 , further comprising plating exposed surfaces of the patterned metal layer with a metal.
19. The method of claim 13 wherein the plating comprises immersing the patterned laminated metal foil and dielectric layer in a plating bath.
20. The method of claim 19 wherein the plating step is repeated to form a plurality of plating layers.
21. The method of claim 18 wherein the plating comprises plating with gold.
22. The method of claim 20 wherein a first plating comprises plating with nickel.
23. The method of claim 20 wherein a second plating comprises plating with gold.
24. The method of claim 13 , further comprising, following patterning the metal layer, applying a dielectric material on a die attach region of the die side of the metal layer facing away from the dielectric layer, to form a substrate assembly having a die attach side and a land side opposite the die attach side.
25. A method for making a semiconductor package further comprising forming a single metal layer tape substrate assembly as in claim 24 , affixing a die onto a die mount surface of the die attach side of the substrate assembly, electrically connecting die pads with bond sites on the die attach side of the bond fingers by wire bonds, and encapsulating the die and wire bonds.
26. The method of claim 24 wherein applying the dielectric material comprises supporting the substrate on the land side and printing the dielectric material onto the die attach side.
27. The method of claim 26 wherein applying the dielectric material comprises printing the dielectric material through a screen, and planarizing a surface of the printed dielectric material.
28. The method of claim 26 wherein applying the dielectric material comprises printing the dielectric material through a mask, and planarizing a surface of the printed dielectric material.
29. An electronic device, comprising a package having a single metal layer tape substrate as in claim 1 , electrically connected to circuitry in the device.
30. An electronic device, comprising a multi-package module including a package having a single metal layer tape substrate as in claim 1 , the module being electrically connected to circuitry in the device.