Package system incorporating a flip-chip assembly
A package system including providing a first semiconductor die; mounting a second semiconductor die on the first semiconductor die using an inter-die interconnect to form a flip-chip assembly; and attaching the flip-chip assembly on a package substrate with a contact pad, a test connection, a z-bond pad, and a die receptacle, with the first semiconductor die in the flip-chip assembly fitting inside the die receptacle.
1. A package system, comprising:
a flip-chip assembly incorporating a first semiconductor die, a second semiconductor die and an inter-die interconnect; and
a package substrate with a contact pad, a test connection, a z-bond pad, and a die receptacle for accommodating the first semiconductor die in the flip-chip assembly.
2. The system of claim 1 further comprising a molded encapsulant or an underfill material for encapsulating at least portions of the second semiconductor die in the flip-chip assembly, and the package substrate.
3. The system as claimed in claim 1 further comprising a bottom package assembly incorporating a third semiconductor die and a second package substrate.
4. The system as claimed in claim 1 wherein:
the package substrate is substituted with an interposer; and
further comprising:
a top package assembly incorporating a fourth semiconductor die.
5. The system as claimed in claim 1 further comprising a top package assembly incorporating a fourth semiconductor die, a third package substrate, and an inter-package interconnect.
6. The system as claimed in claim 1 further comprising a peripheral interconnect.
7. The system of claim 6 further comprising a molded encapsulant or an underfill material for encapsulating at least portions of the second semiconductor die in the flip-chip assembly, the peripheral interconnect, and the package substrate.
8. The system as claimed in claim 6 further comprising:
a bottom package assembly incorporating a third semiconductor die and a second package substrate with a z-bond pad;
a bond wire for connecting the contact pad or the z-bond-pad in the package substrate to the z-bond pad in the second package substrate; and
a molded encapsulant for encapsulating at least portions of the package substrate, the bottom package assembly, and the bond wire.
9. The system as claimed in claim 6 further comprising:
a molded encapsulant or an underfill material for encapsulating at least portions of the second semiconductor die in the flip-chip assembly, the package substrate, and the peripheral interconnect;
a bottom package assembly incorporating a third semiconductor die and a second package substrate with a z-bond pad;
a bond wire for connecting the contact pad or the z-bond pad in the package substrate to the z-bond pad in the second package substrate;
a molded encapsulant for encapsulating at least portions of the package substrate, the bottom package assembly, and the bond wire;
a top package assembly incorporating a fourth semiconductor die; and
an inter-package interconnect.
10. The system as claimed in claim 6 wherein:
the package substrate is substituted with an interposer with a contact pad and a z-bond pad; and
further comprising:
a bottom package assembly incorporating a third semiconductor die, a second package substrate with a z-bond pad;
a bond wire for connecting the z-bond pad in the interposer to the z-bond pad in the second package substrate;
a molded encapsulant for encapsulating at least portions of the interposer, the bottom package assembly, and the bond wire;
a top package assembly incorporating a fourth semiconductor die; and
an inter-package interconnect.