INTEGRATED CIRCUIT PACKAGE SYSTEM

1 . An integrated circuit package system comprising:

providing a heat spreader;

attaching an upper substrate to the heat spreader, the upper substrate having an upper through-opening provided therein;

attaching a top semiconductor die to the heat spreader through the upper through-opening, the top semiconductor die having a top die interconnect to the upper substrate;

attaching a base substrate to the upper substrate, the base substrate having a base through-opening provided therein larger than the upper through-opening; and

attaching an external interconnect connected to the base substrate.

2 . The system as claimed in claim 1 further comprising:

attaching an interposer to the top semiconductor die through the base through-opening; and

attaching a lower die to the interposer.

3 . The system as claimed in claim 1 further comprising:

attaching a lower package to the top semiconductor die through the base through-opening, the lower package including a lower package substrate and a lower die connected to the lower package substrate.

4 . The system as claimed in claim 1 further comprising:

attaching a lower package to the top semiconductor die through the base through-opening, the lower package including a lower die connected to a lower package substrate and the lower package substrate having further external interconnects.

5 . The system as claimed in claim 1 further comprising:

attaching an interposer to the top semiconductor die through the base through-opening; and

attaching a lower package to the interposer, the lower package including a lower package substrate attached to the interposer and a lower die connected to the lower package substrate.

6 . An integrated circuit package system comprising:

providing a heat spreader;

attaching an upper substrate to the heat spreader, the upper substrate having an upper through-opening provided therein;

attaching a top semiconductor die to the heat spreader through the upper through-opening, the top semiconductor die having a top die interconnect to the upper substrate;

attaching a base substrate to the upper substrate, the base substrate having a base through-opening provided therein larger than the upper through-opening;

attaching an external interconnect connected to the base substrate; and

encapsulating the top semiconductor die and the top die interconnect on the heat spreader.

7 . The system as claimed in claim 6 further comprising:

attaching an interposer to the top semiconductor die through the base through-opening, the interposer having an interposer interconnect connected to the upper substrate or the base substrate; and

attaching a lower die to the interposer, the lower die having a lower die interconnect to the interposer.

8 . The system as claimed in claim 6 further comprising:

attaching a lower package to the top semiconductor die through the base through-opening, the lower package including a lower package substrate; a lower die connected to the lower package substrate; and an encapsulant encapsulating the lower die and attached to the top semiconductor die; and

connecting the lower package substrate to the upper substrate.

9 . The system as claimed in claim 6 further comprising:

attaching a lower package to the top semiconductor die through the base through-opening, the lower package including a lower die connected to the lower package substrate, an encapsulant encapsulating the lower die, and the lower package substrate having further external interconnects.

10 . The system as claimed in claim 6 further comprising:

attaching an interposer to the top semiconductor die through the base through-opening, the interposer having interposer interconnects to the base substrate; and

attaching a lower package to the interposer, the lower package including a lower package substrate attached to the interposer, a lower die connected to the lower package substrate, and an encapsulant encapsulating the lower die on the lower package substrate.

11 . An integrated circuit package system comprising:

a heat spreader;

an upper substrate attached to the heat spreader, the upper substrate having an upper through-opening provided therein;

a top semiconductor die attached to the heat spreader through the upper through-opening, the top semiconductor die having a top die interconnect to the upper substrate;

a base substrate attached to the upper substrate, the base substrate having a base through-opening provided therein larger than the upper through-opening; and

an external interconnect connected to the base substrate.

12 . The system as claimed in claim 11 further comprising:

an interposer attached to the top semiconductor die through the base through-opening; and

a lower die attached to the interposer.

13 . The system as claimed in claim 11 further comprising:

a lower package attached to the top semiconductor die through the base through-opening, the lower package including a lower package substrate and a lower die connected to the lower package substrate.

14 . The system as claimed in claim 11 further comprising:

a lower package attached to the top semiconductor die through the base through-opening, the lower package including a lower die connected to a lower package substrate and the lower package substrate having further external interconnects.

15 . The system as claimed in claim 11 further comprising:

an interposer attached to the top semiconductor die through the base through-opening; and

a lower package attached to the interposer, the lower package including a lower package substrate attached to the interposer and a lower die connected to the lower package substrate.

16 . The system as claimed in claim 11 further comprising:

an encapsulant encapsulating the top semiconductor die and the top die interconnect on the heat spreader.

17 . The system as claimed in claim 16 wherein:

the interposer has an interposer interconnect connected to the upper substrate or the base substrate; and

the lower die has a lower die interconnect to the interposer.

18 . The system as claimed in claim 16 further comprising:

a lower die connected to the lower package substrate;

an encapsulant encapsulates the lower die and is attached to the top semiconductor die; and

the lower package substrate is connected to the upper substrate.

19 . The system as claimed in claim 16 further comprising:

an encapsulant encapsulating the lower die.

20 . The system as claimed in claim 16 wherein:

the interposer has interposer interconnects connected to the base substrate; and

the lower package has an encapsulant encapsulating a lower die on a lower package substrate.