Semiconductor device and method of connecting a shielding layer to ground through conductive vias
View Patent ↗A semiconductor device is made by providing a substrate having an interconnect structure, providing a plurality of semiconductor die each having a through silicon via (TSV), mounting the semiconductor die to the substrate to electrically connect the TSV to the interconnect structure, depositing an encapsulant between the semiconductor die, and forming a shielding layer over the encapsulant and semiconductor die. The shielding layer is electrically connected to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor die from interference. The shielding layer is electrically connected to a ground potential through the TSV and interconnect structure. The semiconductor die includes solder bumps which are electrically connected to contact pads on the substrate. The substrate also includes solder bumps electrically connected to a conductive channel in the interconnect structure which is electrically connected to the TSV. The substrate is singulated to separate the semiconductor die.
1. A method of making a semiconductor device, comprising:
providing a substrate having an interconnect structure;
providing a plurality of semiconductor dies each having a through silicon via (TSV);
mounting the semiconductor dies to the substrate to electrically connect the TSV to the interconnect structure;
depositing an encapsulant between the semiconductor dies;
forming a shielding layer over the encapsulant and semiconductor dies;
electrically connecting the shielding layer to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor dies from interference; and
singulating the substrate to separate the semiconductor dies.
2. The method of claim 1 , further including electrically connecting the shielding layer to a ground potential through the TSV and interconnect structure.
3. The method of claim 1 , further including forming the shielding layer over the substrate.
4. The method of claim 1 , further including:
forming solder bumps on the semiconductor dies;
electrically connecting the solder bumps to the TSV; and
electrically connecting the solder bumps to contact pads on the substrate.
5. The method of claim 1 , further including:
forming solder bumps on the substrate;
forming a conductive channel in the interconnect structure and electrically connecting the solder bumps to the conductive channel; and
electrically connecting the conductive channel in the interconnect structure to the TSV.
6. The method of claim 1 , further including:
stacking a plurality of semiconductor dies prior to forming the shielding layer, each semiconductor dies having a TSV;
electrically connecting the stacked semiconductor dies through the TSV;
forming the shielding layer over the stacked semiconductor dies; and
electrically connecting the shielding layer to the TSV.
7. The method of claim 1 , further including disposing an underfill material under the semiconductor dies.
8. A method of making a semiconductor device, comprising:
providing a substrate having an interconnect structure;
providing a plurality of semiconductor dies each having a through silicon via (TSV);
mounting the semiconductor dies to the substrate to electrically connect the TSV to the interconnect structure;
depositing an encapsulant over the semiconductor dies;
removing the encapsulant extending above the semiconductor dies;
forming a shielding layer over the encapsulant and semiconductor dies;
electrically connecting the shielding layer to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor dies from interference; and
singulating the substrate to separate the semiconductor dies.
9. The method of claim 8 , further including electrically connecting the shielding layer to a ground potential through the TSV and interconnect structure.
10. The method of claim 8 , further including forming the shielding layer over the substrate.
11. The method of claim 8 , further including:
forming solder bumps on the semiconductor dies;
electrically connecting the solder bumps to the TSV; and
electrically connecting the solder bumps to contact pads on the substrate.
12. The method of claim 8 , further including:
forming solder bumps on the substrate;
forming a conductive channel in the interconnect structure and electrically connecting the solder bumps to the conductive channel; and
electrically connecting the conductive channel in the interconnect structure to the TSV.
13. The method of claim 8 , further including depositing an underfill material under the semiconductor dies.
14. The method of claim 8 , further including:
stacking a plurality of semiconductor dies prior to forming the shielding layer, each semiconductor dies having a TSV;
electrically connecting the stacked semiconductor dies through the TSV;
forming the shielding layer over the stacked semiconductor dies; and
electrically connecting the shielding layer to the TSV.
15. The method of claim 8 , further including disposing an underfill material under the semiconductor dies.
16. A method of making a semiconductor device, comprising:
providing a substrate having an interconnect structure;
providing a plurality of semiconductor dies having each a through silicon via (TSV);
mounting the semiconductor dies to the substrate to electrically connect the TSV to the interconnect structure;
depositing an encapsulant between the semiconductor dies;
forming a shielding layer over the encapsulant and semiconductor dies; and
electrically connecting the shielding layer to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor dies from interference.
17. The method of claim 16 , further including electrically connecting the shielding layer to a ground potential through the TSV and interconnect structure.
18. The method of claim 16 , further including forming the shielding layer over the substrate.
19. The method of claim 16 , further including:
forming solder bumps on the semiconductor dies;
electrically connecting the solder bumps to the TSV; and
electrically connecting the solder bumps to contact pads on the substrate.
20. The method of claim 16 , further including:
stacking the plurality of semiconductor dies prior to forming the shielding layer, each semiconductor dies having a TSV;
electrically connecting the stacked semiconductor dies through the TSV;
forming the shielding layer over the stacked semiconductor dies; and
electrically connecting the shielding layer to the TSV.
21. A semiconductor device, comprising:
a substrate having an interconnect structure;
a plurality of semiconductor dies having each a through silicon via (TSV), the semiconductor dies being mounted to the substrate to electrically connect the TSV to the interconnect structure;
an encapsulant deposited between the semiconductor dies; and
a shielding layer formed over the encapsulant and semiconductor dies, the shielding layer being electrically connected to the TSV which in turn electrically connects to the interconnect structure to isolate the semiconductor dies from interference.
22. The semiconductor device of claim 21 , wherein the shielding layer is electrically connected to a ground potential through the TSV and interconnect structure.
23. The semiconductor device of claim 21 , further including a plurality of solder bumps formed on the semiconductor dies, the solder bumps being electrically connected to the TSV and the solder bumps being electrically connected to contact pads on the substrate.
24. The semiconductor device of claim 21 , wherein the plurality of semiconductor dies are stacked and disposed under the shielding layer, the stacked semiconductor dies being electrically connected through the TSV and the shielding layer being electrically connected to the TSVs.
25. The semiconductor device of claim 21 , further including an underfill material disposed under the semiconductor dies.