IP Library Granted Patent US 7,692,972
Granted Patent B1
US 7,692,972 · App. 12/177,680 · Granted Apr 6, 2010

Split gate memory cell for programmable circuit device

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Quick Facts
Patent No.
US 7,692,972
App. No.
12/177,680
Granted
Apr 6, 2010
Kind
B1
Abstract

A split-gate memory cell, includes an n-channel split-gate non-volatile memory transistor having a source, a drain, a select gate over a thin oxide, and a control gate over a non-volatile gate material and separated from the select gate by a gap. A p-channel pull-up transistor has a drain coupled to the drain of the split-gate non-volatile memory transistor, a source coupled to a bit line, and a gate. A switch transistor has first and second source/drain diffusions, and a gate coupled to the drains of the split-gate non-volatile memory transistor and the p-channel pull-up transistor. An inverter has an input coupled to the second source/drain diffusion of the switch transistor, and an output. A p-channel level-restoring transistor has a source coupled to a supply potential, a drain coupled to the first source/drain diffusion of the switch transistor and a gate coupled to the output of the inverter.

Claims (27)

1. A split-gate memory cell, including:

an n-channel split-gate non-volatile memory transistor having a source and a drain, the source and drain defining a channel, a select gate over a portion of the channel nearest the drain, and a control gate over a non-volatile charge retention structure over a portion of the channel nearest the source, the select gate and the control gate separated by a gap;

a p-channel pull-up transistor having a drain coupled to the drain of the split-gate non-volatile memory transistor, a source coupled to a bit line, and a gate;

a switch transistor having a first source/drain diffusion, a second source/drain diffusion, and a gate coupled to the drains of the split-gate non-volatile memory transistor and the p-channel pull-up transistor;

an inverting buffer having an input coupled to the second source/drain diffusion of the switch transistor, and an output;

a p-channel level-restoring transistor having a source coupled to a supply potential, a drain coupled to the first source/drain diffusion of the switch transistor and a gate coupled to the output of the inverting buffer.

2. The split-gate memory cell of claim 1 wherein the non-volatile charge retention structure is a floating gate.

3. The split-gate memory cell of claim 1 wherein the non-volatile charge retention structure is a region of isolated nanocrystals.

4. The split-gate memory cell of claim 1 wherein the non-volatile charge retention structure is a SONOS structure.

5. A split-gate memory cell, including:

an n-channel split-gate non-volatile memory transistor having a source and a drain, the source and drain defining a channel, a select gate over a portion of the channel nearest the drain, and a control gate over a non-volatile charge retention structure over a portion of the channel nearest the source, the select gate and the control gate separated by a gap;

a p-channel split-gate non-volatile memory transistor having a drain coupled to the drain of the split-gate non-volatile memory transistor, a source coupled to a bit line, the source and drain defining a channel, a select gate over a portion of the channel nearest the drain, and a control gate over a non-volatile gate material over a portion of the channel nearest the source, the select gate and the control gate separated by a gap;

a switch transistor having a first source/drain diffusion, a second source/drain diffusion, and a gate coupled to the drains of the n-channel split-gate non-volatile memory transistor and the p-channel split-gate non-volatile memory transistor;

an inverting buffer having an input coupled to the second source/drain diffusion of the switch transistor, and an output;

a p-channel level-restoring transistor having a source coupled to a supply potential, a drain coupled to the first source/drain diffusion of the switch transistor and a gate coupled to the output of the inverting buffer.

6. The split-gate memory cell of claim 5 wherein the non-volatile charge retention structure is a floating gate.

7. The split-gate memory cell of claim 5 wherein the non-volatile charge retention structure is a region of isolated nanocrystals.

8. The split-gate memory cell of claim 5 wherein the non-volatile charge retention structure is a SONOS structure.

9. A split-gate memory cell, including:

a left n-channel split-gate non-volatile memory transistor having a source and a drain, the source and drain defining a channel, a select gate over a portion of the channel nearest the drain, and a control gate over a non-volatile charge retention structure over a portion of the channel nearest the source, the select gate and the control gate separated by a gap;

a right n-channel split-gate non-volatile memory transistor having a source and a drain, the source and drain defining a channel, a select gate over a portion of the channel nearest the drain, and a control gate over a non-volatile gate material over a portion of the channel nearest the source, the select gate and the control gate separated by a gap;

a left p-channel pull-up transistor having a drain coupled to the drain of the left n-channel split-gate non-volatile memory transistor, a source coupled to a left bit line, and a select gate coupled to the drain of the right n-channel split-gate non-volatile memory transistor;

a right p-channel pull-up transistor having a drain coupled to the drain of the right n-channel split-gate non-volatile memory transistor, a source coupled to a left bit line, and a select gate coupled to the drain of the left n-channel split-gate non-volatile memory transistor;

a pass gate including an n-channel pass-gate transistor connected in parallel with a p-channel pass-gate transistor between a switch input node and a switch output node, the n-channel pass-gate transistor having a gate coupled to the gate of a first one of the left and the right p-channel pull-up transistors, the p-channel pass-gate transistor having a gate coupled to the gate of a second one of the left and the right p-channel pull-up transistors.

10. The split-gate memory cell of claim 9 wherein the non-volatile charge retention structure is a floating gate.

11. The split-gate memory cell of claim 9 wherein the non-volatile charge retention structure is a region of isolated nanocrystals.

12. The split-gate memory cell of claim 9 wherein the non-volatile charge retention structure is a SONOS structure.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0572 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2009
From: SADD, MICHAEL; DHAOUI, FETHI; WANG, GEORGE; MCCOLLUM, JOHN
To: ACTEL CORPORATION
Reel/Frame 022268/0769 →